Datasheet

ExampleBoardLayout

StencilOpenings

BasedonStencilThickness

of0,127mm(.005in)

TLV700xx

SLVSA00D –SEPTEMBER 2009–REVISED NOVEMBER 2012

www.ti.com

(1) All linear dimensions are in millimeters.

(2) Customers should place a note on the circuit board fabrication drawing not to alter the center solder mask defined

pad.

(3) Publication IPC-7351 is recommended for alternate designs.

(4) Laser-cutting apertures with trapedzoidal walls and also rounding corners will offer better paste release. Customers

should contact their board assembly site for stencil design recommendations. Example stencil design based on a 50%

volumetric load solder paste. Refer to IPC-7525 for other stencil recommendations.

Figure 24. Recommended Land Pattern for DCK Package