Datasheet

www.ti.com Thermal Guidelines and Layout Recommendations
Table 1. Thermal Dissipation Rating
T
A
≤ 25°C (T
A
= 85°C)
T
A
= 70°C Power
Board Package R
θJA
Power Power
Rating
Rating Rating
High-K
(1)
DBV 213.1°C/W 470 mW 258 mW 188 mW
(1)
The JEDEC High-K (2s2p) board design used to derive this data was 3-inch × 3-inch, multilayer board with 1-ounce internal
power and ground planes and 2-ounce copper traces on top and bottom of the board.
The thermal resistance for the TLV70130EVM-077, R
θJA
, is the measured value for this particular layout
scheme. The actual allowable power dissipation on your PCB is a strong function of your layout.
5
SLVU554– October 2011 TLV70130EVM-077
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