Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - LDO voltage regulator Positive, fixed SOT 23 5

TLV702xx

GND

IN OUT

OUT

Off

OUT

1 F

Ceramic

TLV702xxDBV

SOT23-5

(TOPVIEW)

OUT

N/C

GND

N/C

GND

OUT

TLV702xxDSE

1,5mm 1,5mmSON

(TOPVIEW)

TLV702xx

www.ti.com

SLVSAG6B –SEPTEMBER 2010– REVISED FEBRUARY 2011

300-mA, Low-I

, Low-Dropout Regulator

FEATURES

DESCRIPTION

234

• Very Low Dropout:

The TLV702xx series of low-dropout (LDO) linear

regulators are low quiescent current devices with

– 37 mV at I

OUT

= 50 mA, V

OUT

= 2.8 V

excellent line and load transient performance. These

– 75 mV at I

OUT

= 100 mA, V

OUT

= 2.8 V

LDOs are designed for power-sensitive applications.

– 220mV at I

OUT

= 300 mA, V

OUT

= 2.8 V

A precision bandgap and error amplifier provides

• 2% Accuracy overall 2% accuracy. Low output noise, very high

power-supply rejection ratio (PSRR), and low-dropout

• Low I

: 35 μA

voltage make this series of devices ideal for a wide

• Fixed-Output Voltage Combinations Possible

selection of battery-operated handheld equipment. All

from 1.2 V to 4.8 V

device versions have thermal shutdown and current

limit for safety.

• High PSRR: 68 dB at 1 kHz

• Stable with Effective Capacitance of 0.1 μF

(1)

Furthermore, these devices are stable with an

effective output capacitance of only 0.1 μF. This

• Thermal Shutdown and Overcurrent Protection

feature enables the use of cost-effective capacitors

• Packages: SOT23-5 and 1,5mm × 1,5mm SON-6

that have higher bias voltages and temperature

(1)

See the Input and Output Capacitor Requirements in the

derating. The devices regulate to specified accuracy

Application Information section.

with no output load.

The TLV702xxP series also provides an active

APPLICATIONS

pulldown circuit to quickly discharge the outputs.

• Wireless Handsets

The TLV702xx series of LDO linear regulators are

• Smart Phones, PDAs

available in SOT23-5 and 1,5mm × 1,5mm SON-6

• MP3 Players

packages.

• ZigBee

Networks

• Bluetooth

Devices

• Li-Ion Operated Handheld Products

• WLAN and Other PC Add-on Cards

Typical Application Circuit

(Fixed-Voltage Versions)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2Bluetooth is a registered trademark of Bluetooth SIG.

3ZigBee is a registered trademark of the ZigBee Alliance.

4All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (28 pages)

PAGE 1
TLV702xx SLVSAG6B – SEPTEMBER 2010 – REVISED FEBRUARY 2011 www.ti.com 300-mA, Low-IQ, Low-Dropout Regulator FEATURES DESCRIPTION • Very Low Dropout: – 37 mV at IOUT = 50 mA, VOUT = 2.8 V – 75 mV at IOUT = 100 mA, VOUT = 2.8 V – 220mV at IOUT = 300 mA, VOUT = 2.8 V • 2% Accuracy • Low IQ: 35 μA • Fixed-Output Voltage Combinations Possible from 1.2 V to 4.8 V • High PSRR: 68 dB at 1 kHz • Stable with Effective Capacitance of 0.
PAGE 2
TLV702xx SLVSAG6B – SEPTEMBER 2010 – REVISED FEBRUARY 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
PAGE 3
TLV702xx SLVSAG6B – SEPTEMBER 2010 – REVISED FEBRUARY 2011 www.ti.com ELECTRICAL CHARACTERISTICS At VIN = VOUT(TYP) + 0.5 V or 2.0 V (whichever is greater); IOUT = 10 mA, VEN = 0.9 V, COUT = 1.0 μF, and TJ = –40°C to +125°C, unless otherwise noted. Typical values are at TJ = +25°C.
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TLV702xx SLVSAG6B – SEPTEMBER 2010 – REVISED FEBRUARY 2011 www.ti.com FUNCTIONAL BLOCK DIAGRAMS IN OUT Current Limit Thermal Shutdown UVLO EN Bandgap LOGIC TLV702xx Series GND Figure 1. TLV702xx IN OUT Current Limit Thermal Shutdown UVLO EN 120W Bandgap LOGIC TLV702xxP Series GND Figure 2.
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TLV702xx SLVSAG6B – SEPTEMBER 2010 – REVISED FEBRUARY 2011 www.ti.com PIN CONFIGURATIONS DBV PACKAGE SOT23-5 (TOP VIEW) IN 1 GND 2 EN 3 5 OUT 4 NC DSE PACKAGE 1,5mm × 1,5mm SON-6 (TOP VIEW) IN 1 6 EN GND 2 5 N/C OUT 3 4 N/C PIN DESCRIPTIONS PIN NAME SOT23-5 DBV SON-6 DSE DESCRIPTION IN 1 1 Input pin. A small 1-μF ceramic capacitor is recommended from this pin to ground to assure stability and good transient performance.
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TLV702xx SLVSAG6B – SEPTEMBER 2010 – REVISED FEBRUARY 2011 www.ti.com TYPICAL CHARACTERISTICS Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(TYP) + 0.5 V or 2.0 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1.0 μF, unless otherwise noted. Typical values are at TJ = +25°C. LINE REGULATION LINE REGULATION 1.90 1.90 VOUT = 1.8 V IOUT = 10 mA 1.86 1.86 1.84 1.84 1.82 1.82 1.80 1.78 1.76 1.72 1.80 1.78 1.76 +125°C +85°C +25°C -40°C 1.74 VOUT = 1.
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TLV702xx SLVSAG6B – SEPTEMBER 2010 – REVISED FEBRUARY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(TYP) + 0.5 V or 2.0 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1.0 μF, unless otherwise noted. Typical values are at TJ = +25°C. GROUND PIN CURRENT vs INPUT VOLTAGE GROUND PIN CURRENT vs LOAD 450 50 VOUT = 1.8 V 45 40 350 35 300 30 IGND (mA) IGND (mA) VOUT = 1.
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TLV702xx SLVSAG6B – SEPTEMBER 2010 – REVISED FEBRUARY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(TYP) + 0.5 V or 2.0 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1.0 μF, unless otherwise noted. Typical values are at TJ = +25°C. POWER-SUPPLY RIPPLE REJECTION vs INPUT VOLTAGE VOUT = 1.8 V 1 kHz 70 PSRR (dB) 60 10 kHz 50 100 kHz 40 30 20 10 0 2.1 2.2 2.3 2.4 2.5 2.6 2.
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TLV702xx SLVSAG6B – SEPTEMBER 2010 – REVISED FEBRUARY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(TYP) + 0.5 V or 2.0 V, whichever is greater; IOUT = 10 mA, VEN = VIN, COUT = 1.0 μF, unless otherwise noted. Typical values are at TJ = +25°C. LINE TRANSIENT RESPONSE LINE TRANSIENT RESPONSE 1 V/div 2.9 V VIN Slew Rate = 1 V/ms 2.9 V 2.3 V VIN VOUT VOUT = 1.8 V IOUT = 300 mA 5 mV/div 2.
PAGE 10
TLV702xx SLVSAG6B – SEPTEMBER 2010 – REVISED FEBRUARY 2011 www.ti.com APPLICATION INFORMATION The TLV702xx belongs to a new family of next-generation value LDO regulators. These devices consume low quiescent current and deliver excellent line and load transient performance. These characteristics, combined with low noise and very good PSRR with little (VIN – VOUT) headroom, make this family of devices ideal for portable RF applications.
PAGE 11
TLV702xx SLVSAG6B – SEPTEMBER 2010 – REVISED FEBRUARY 2011 www.ti.com DROPOUT VOLTAGE The TLV702xx uses a PMOS pass transistor to achieve low dropout. When (VIN – VOUT) is less than the dropout voltage (VDO), the PMOS pass device is in the linear region of operation and the input-to-output resistance is the RDS(ON) of the PMOS pass element. VDO scales approximately with output current because the PMOS device behaves as a resistor in dropout.
PAGE 12
TLV702xx SLVSAG6B – SEPTEMBER 2010 – REVISED FEBRUARY 2011 www.ti.com 18.16 mm 20.7 mm Figure 25. HPA503 EVM Top Layer 18.16 mm 20.7 mm Figure 26.
PAGE 13
TLV702xx SLVSAG6B – SEPTEMBER 2010 – REVISED FEBRUARY 2011 www.ti.com 17 mm 20.5 mm Figure 27. DSE EVM Top Layer 17 mm 20.5 mm Figure 28.
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TLV702xx SLVSAG6B – SEPTEMBER 2010 – REVISED FEBRUARY 2011 Example Board Layout www.ti.com Stencil Openings Based on Stencil Thickness of 0,127 mm (.005 in) (1) All linear dimensions are in millimeters. (2) Customers should place a note on the circuit board fabrication drawing not to alter the center solder mask defined pad. (3) Publication IPC-7351 is recommended for alternate designs. (4) Laser-cutting apertures with trapedzoidal walls and also rounding corners will offer better paste release.
PAGE 15
TLV702xx SLVSAG6B – SEPTEMBER 2010 – REVISED FEBRUARY 2011 www.ti.com Figure 30.
PAGE 16
TLV702xx SLVSAG6B – SEPTEMBER 2010 – REVISED FEBRUARY 2011 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (October 2010) to Revision B • Added SON-6 (DSE) package and related references to data sheet ...................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 22-Dec-2013 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PAGE 21
PACKAGE MATERIALS INFORMATION www.ti.com 30-Dec-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) TLV70212DBVR SOT-23 DBV 5 3000 178.0 9.0 TLV70212DBVR SOT-23 DBV 5 3000 180.0 TLV70212DBVT SOT-23 DBV 5 250 180.0 TLV70215DBVR SOT-23 DBV 5 3000 TLV70215PDBVR SOT-23 DBV 5 W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 8.4 3.23 3.17 1.37 4.
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PACKAGE MATERIALS INFORMATION www.ti.com 30-Dec-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TLV70229DSET WSON DSE 6 250 180.0 8.4 1.83 1.83 0.89 4.0 8.0 Q2 TLV70230DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV70231DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3 TLV70233DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.
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PACKAGE MATERIALS INFORMATION www.ti.com 30-Dec-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV70212DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV70212DBVR SOT-23 DBV 5 3000 202.0 201.0 28.0 TLV70212DBVT SOT-23 DBV 5 250 202.0 201.0 28.0 TLV70215DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV70215PDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TLV70218DBVR SOT-23 DBV 5 3000 180.0 180.0 18.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.