Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - LDO voltage regulator Positive, fixed DSBGA 4 (1x1)

GND

OUT

YFF, YFP PACKAGES

WCSP-4

(TOP VIEW)

A B

TLV705

GND

OUT

Input

Output

Off

OUT

1 F

Ceramic

TLV705

TLV705P

www.ti.com

SBVS151C –DECEMBER 2010–REVISED OCTOBER 2012

200-mA, Low I

, Low-Noise, Low-Dropout Regulator

in Ultra-Small 0.8-mm x 0.8-mm WCSP

FEATURES

DESCRIPTION

The TLV705 series of low-dropout (LDO) linear

234

• Very Low Dropout:

regulators are low quiescent current devices with

– 105 mV at I

OUT

= 150 mA

excellent line and load transient performance.

– 145 mV at I

OUT

= 200 mA

Designed for power-sensitive applications, a precision

bandgap and error amplifier provides typical accuracy

• Accuracy: 0.5% Typical

of 0.5%. Low output noise, very high power-supply

• Low I

: 35 μA

rejection ratio (PSRR), and low dropout voltage make

• Available in Fixed-Output Voltages from

this series of LDOs ideal for a wide selection of

0.7 V to 4.8 V

battery-operated hand-held equipment. All devices

have a thermal shutdown and current limit for safety.

• High PSRR: 70 dB at 1 kHz

• Stable with Effective Capacitance of 0.1 μF

Furthermore, the TLV705 is stable with an effective

output capacitance of only 0.1 μF. This feature

• Thermal Shutdown and Overcurrent Protection

enables the use of cost-effective capacitors that have

• Available in 0.8-mm x 0.8-mm WCSP

higher bias voltage and temperature derating. The

devices regulate to the specified accuracy with zero

APPLICATIONS

output load. The TLV705P series also provides an

active pull-down circuit to quickly discharge output.

• Wireless Handsets

• Smart Phones, PDAs The TLV705 and TLV705P series are both available

in a 0.8-mm × 0.8-mm WCSP with two height options

• MP3 Players

that are optimal for hand-held applications.

• Zigbee™ Networks

• Bluetooth

Devices

• Other Li-Ion Operated Hand-Held Products

• WLAN and Other PC Add-On Cards

Typical Application Circuit

(Fixed-Voltage Versions)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2Bluetooth is a registered trademark of Bluetooth SIG, Inc.

3Zigbee is a trademark of ZigBee Alliance.

4All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (24 pages)

PAGE 1
TLV705 TLV705P www.ti.com SBVS151C – DECEMBER 2010 – REVISED OCTOBER 2012 200-mA, Low IQ, Low-Noise, Low-Dropout Regulator in Ultra-Small 0.8-mm x 0.8-mm WCSP FEATURES DESCRIPTION • Very Low Dropout: – 105 mV at IOUT = 150 mA – 145 mV at IOUT = 200 mA • Accuracy: 0.5% Typical • Low IQ: 35 μA • Available in Fixed-Output Voltages from 0.7 V to 4.8 V • High PSRR: 70 dB at 1 kHz • Stable with Effective Capacitance of 0.1 μF • Thermal Shutdown and Overcurrent Protection • Available in 0.8-mm x 0.
PAGE 2
TLV705 TLV705P SBVS151C – DECEMBER 2010 – REVISED OCTOBER 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
PAGE 3
TLV705 TLV705P www.ti.com SBVS151C – DECEMBER 2010 – REVISED OCTOBER 2012 ELECTRICAL CHARACTERISTICS At TJ = –40°C to +125°C, VIN = VOUT (typ) + 0.5 V or 2 V (whichever is greater), IOUT = 10 mA, VEN = 0.9 V, and COUT = 1 μF, unless otherwise noted. Typical values are at TJ = +25°C. TLV705 PARAMETER VIN TEST CONDITIONS MIN Input voltage range VOUT VO Output voltage range DC output accuracy –40°C ≤ TJ ≤ +125°C ±5 20 mV 0.05 5 mV 1 Dropout voltage (1) VIN = 0.
PAGE 4
TLV705 TLV705P SBVS151C – DECEMBER 2010 – REVISED OCTOBER 2012 www.ti.com FUNCTIONAL BLOCK DIAGRAMS VOUT VIN Current Limit Thermal Shutdown UVLO EN Bandgap LOGIC TLV705 Series GND Figure 1. TLV705 Diagram TLV705P Series VOUT VIN Current Limit Thermal Shutdown 120 W UVLO EN Bandgap LOGIC GND Figure 2.
PAGE 5
TLV705 TLV705P www.ti.com SBVS151C – DECEMBER 2010 – REVISED OCTOBER 2012 PIN CONFIGURATION YFF, YFP PACKAGES WCSP-4 (TOP VIEW) EN VIN GND VOUT A B 2 1 Table 1. Pin Descriptions TLV705 NAME PIN # DESCRIPTION GND A1 Ground pin EN A2 Enable pin. Driving EN over 0.9 V turns on the regulator. Driving EN below 0.4 V puts the regulator into shutdown mode, thus reducing operating current to 1 μA, nominal. VOUT B1 Regulated output voltage pin.
PAGE 6
TLV705 TLV705P SBVS151C – DECEMBER 2010 – REVISED OCTOBER 2012 www.ti.com TYPICAL CHARACTERISTICS Over operating temperature range (TJ = –40°C to +125°C), IOUT = 10 mA, VEN = 0.9 V, COUT = 1 μF, and VIN = VOUT(TYP) + 0.5 V or 2 V, whichever is greater, unless otherwise noted. Typical values are at TJ = +25°C. LINE REGULATION LINE REGULATION 1.90 1.90 VOUT = 1.8 V IOUT = 10 mA 1.88 1.86 1.84 1.84 1.82 1.82 VOUT (V) VOUT (V) 1.86 1.80 1.78 1.76 1.72 1.80 1.78 1.
PAGE 7
TLV705 TLV705P www.ti.com SBVS151C – DECEMBER 2010 – REVISED OCTOBER 2012 TYPICAL CHARACTERISTICS (continued) Over operating temperature range (TJ = –40°C to +125°C), IOUT = 10 mA, VEN = 0.9 V, COUT = 1 μF, and VIN = VOUT(TYP) + 0.5 V or 2 V, whichever is greater, unless otherwise noted. Typical values are at TJ = +25°C. GROUND PIN CURRENT vs INPUT VOLTAGE 50 GROUND PIN CURRENT vs OUTPUT CURRENT 400 VOUT = 1.8 V IOUT = 0 mA 45 40 300 35 30 IGND (mA) IGND (mA) VOUT = 1.
PAGE 8
TLV705 TLV705P SBVS151C – DECEMBER 2010 – REVISED OCTOBER 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) Over operating temperature range (TJ = –40°C to +125°C), IOUT = 10 mA, VEN = 0.9 V, COUT = 1 μF, and VIN = VOUT(TYP) + 0.5 V or 2 V, whichever is greater, unless otherwise noted. Typical values are at TJ = +25°C. OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY 10 Output Spectral Noise Density (mV/ÖHz) POWER-SUPPLY REJECTION RATIO vs INPUT VOLTAGE 100 VOUT = 1.
PAGE 9
TLV705 TLV705P www.ti.com SBVS151C – DECEMBER 2010 – REVISED OCTOBER 2012 TYPICAL CHARACTERISTICS (continued) Over operating temperature range (TJ = –40°C to +125°C), IOUT = 10 mA, VEN = 0.9 V, COUT = 1 μF, and VIN = VOUT(TYP) + 0.5 V or 2 V, whichever is greater, unless otherwise noted. Typical values are at TJ = +25°C. SMALL-STEP LINE TRANSIENT (10mA) SMALL-STEP LINE TRANSIENT (200mA) Slew Rate = 1 V/ms 2.9 V 2.9 V VIN Slew Rate = 1 V/ms VIN (200 mV/div) (200 mV/div) 2.3 V (5 mV/div) VOUT 2.
PAGE 10
TLV705 TLV705P SBVS151C – DECEMBER 2010 – REVISED OCTOBER 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) Over operating temperature range (TJ = –40°C to +125°C), IOUT = 10 mA, VEN = 0.9 V, COUT = 1 μF, and VIN = VOUT(TYP) + 0.5 V or 2 V, whichever is greater, unless otherwise noted. Typical values are at TJ = +25°C. POWER-UP/POWER-DOWN VIN (1 V/div) VOUT Time (100ms/div) Figure 27.
PAGE 11
TLV705 TLV705P www.ti.com SBVS151C – DECEMBER 2010 – REVISED OCTOBER 2012 APPLICATION INFORMATION The TLV705 and TLV705P series of devices belong to a new family of next-generation value low-dropout (LDO) voltage regulators. They consume low quiescent current and deliver excellent line and load transient performance. This performance, combined with low noise, very good PSRR with little (VIN – VOUT) headroom, makes these devices ideal for RF portable applications.
PAGE 12
TLV705 TLV705P SBVS151C – DECEMBER 2010 – REVISED OCTOBER 2012 If the output capacitor and load are increased such that the soft-start current exceeds the output current limit, it is clamped at the typical current limit of 400 mA. For example, if COUT = 10 μF and IOUT = 200 mA, then 10 μF × 0.06 V/μs + 200 mA = 800 mA is not supplied. Instead, it is clamped at 400 mA. SHUTDOWN The enable pin (EN) is active high. The device is enabled when the EN pin goes above 0.9 V.
PAGE 13
TLV705 TLV705P www.ti.com SBVS151C – DECEMBER 2010 – REVISED OCTOBER 2012 Table 2. Power Dissipation Ratings (1) (1) BOARD PACKAGE RθJ TA ≤ 25°C POWER RATING TA = +70°C POWER RATING TA = +85°C POWER RATING High-K YFF, YFP 140 °C/W 714 mW 392 mW 285 mW Thermal resistance as measured on the evaluation module (EVM). Figure 28.
PAGE 14
TLV705 TLV705P SBVS151C – DECEMBER 2010 – REVISED OCTOBER 2012 www.ti.com Figure 29.
PAGE 15
TLV705 TLV705P www.ti.com SBVS151C – DECEMBER 2010 – REVISED OCTOBER 2012 REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (December 2011) to Revision C • Page Deleted last Features bullet ..................................................................................................................................................
PAGE 16
PACKAGE OPTION ADDENDUM www.ti.
PAGE 17
PACKAGE OPTION ADDENDUM www.ti.
PAGE 18
PACKAGE OPTION ADDENDUM www.ti.com 28-Jan-2014 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device.
PAGE 19
PACKAGE MATERIALS INFORMATION www.ti.com 28-Jan-2014 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TLV70512YFPR DSBGA YFP 4 3000 180.0 8.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 0.86 0.86 0.59 4.0 8.0 Q1 TLV70512YFPT DSBGA YFP 4 250 180.0 8.4 0.86 0.86 0.59 4.0 8.0 Q1 TLV70515YFPR DSBGA YFP 4 3000 180.0 8.4 0.86 0.86 0.59 4.0 8.
PAGE 20
PACKAGE MATERIALS INFORMATION www.ti.com 28-Jan-2014 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) TLV70530YFPR DSBGA YFP 4 3000 180.0 8.4 TLV70530YFPT DSBGA YFP 4 250 180.0 8.4 TLV70533YFFR DSBGA YFF 4 3000 180.0 TLV70533YFFT DSBGA YFF 4 250 180.0 TLV70533YFPR DSBGA YFP 4 3000 W Pin1 (mm) Quadrant 0.86 0.86 0.59 4.0 8.0 Q1 0.86 0.86 0.59 4.0 8.0 Q1 8.4 0.85 0.85 0.64 4.0 8.
PAGE 21
PACKAGE MATERIALS INFORMATION www.ti.com 28-Jan-2014 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TLV70518PYFPT DSBGA YFP 4 250 182.0 182.0 17.0 TLV70518YFPR DSBGA YFP 4 3000 182.0 182.0 17.0 TLV70518YFPT DSBGA YFP 4 250 182.0 182.0 17.0 TLV70525PYFPR DSBGA YFP 4 3000 182.0 182.0 17.0 TLV70525PYFPT DSBGA YFP 4 250 182.0 182.0 17.0 TLV70525YFPR DSBGA YFP 4 3000 182.0 182.0 17.0 TLV70525YFPT DSBGA YFP 4 250 182.
PAGE 22
D: Max = 0.806 mm, Min =0.746 mm E: Max = 0.806 mm, Min =0.
PAGE 23
D: Max = 0.806 mm, Min =0.746 mm E: Max = 0.806 mm, Min =0.
PAGE 24
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.