Datasheet

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FEATURES APPLICATIONS
D PACKAGE
(TOP VIEW)
1
2
3
4
8
7
6
5
NC
V
CC+
OUT
NC
NC
IN–
IN+
V
CC–
NC – No internal connection
DBV PACKAGE
(TOP VIEW)
1
2
3
5
4
OUT
V
CC+
IN+
V
CC–
IN–
DCK PACKAGE
(TOP VIEW)
1
2
3
6
4
OUT
V
CC+
IN+
NC
IN–
5
V
CC–
DESCRIPTION/ORDERING INFORMATION
TLV7211 , , TLV7211A
CMOS COMPARATORS
WITH RAIL-TO-RAIL INPUT AND PUSH-PULL OUTPUT
SLCS149B AUGUST 2006 REVISED JANUARY 2007
Battery-Powered Products
Parameters Specified at 2.7-V, 5-V, and 15-V
Supplies
Notebooks and PDAs
Mobile Communications
Supply Current 7 µ A (Typ) at 5 V
Alarm and Security Circuits
Response Time 4 µ s (Typ) at 5 V
Direct Sensor Interface
Push-Pull Output
Replaces Amplifiers Used as Comparators
Input Common-Mode Range Beyond
With Better Performance and Lower Current
V
CC–
and V
CC+
Low Input Current
The TLV7211 and TLV7211A are micropower CMOS comparators available in the space-saving SOT-23-5
package. This makes the comparators ideal for space- and weight-critical designs. The TLV7211A features an
input offset voltage of 5 mV, and the TLV7211 features an input offset voltage of 15 mV.
The main benefits of the SOT-23-5 package are most apparent in small portable electronic devices, such as
mobile phones, pagers, notebook computers, personal digital assistants, and PCMCIA cards. The rail-to-rail
input voltage makes the TLV7211 or TLV7211A a good choice for sensor interfacing, such as light detector
circuits, optical and magnetic sensors, and alarm and status circuits.
The SOT-23-5 package's small size allows it to fit into tight spaces on PC boards.
ORDERING INFORMATION
V
OS
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
(MAX)
Reel of 2500 TLV7211AIDR
SOIC D 7211AI
Tube of 75 TLV7211AID
5 mV SOT-23-5 DBV Reel of 3000 TLV7211AIDBVR YBN_
Reel of 3000 TLV7211AIDCKR
SOT (SC-70) DCK Y8_
Reel of 250 TLV7211AIDCKT
–40 ° C to 85 ° C
Reel of 2500 TLV7211IDR
SOIC D TY7211
Tube of 75 TLV7211ID
15 mV SOT-23-5 DBV Reel of 3000 TLV7211IDBVR YBK_
Reel of 3000 TLV7211IDCKR
SOT (SC-70) DCK Y7_
Reel of 250 TLV7211IDCKT
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006–2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Summary of content (21 pages)