Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsTMP423AIDCNT

+5V

SCL

GND

SDA

V+

SMBus

Controller

TMP421

DXP

DXN

1ChannelLocal

1ChannelRemote

TMP422

DX1

DX2

DX3

DX4

1ChannelLocal

2ChannelsRemote

TMP423

DXP1

DXP2

DXP3

DXN

1ChannelLocal

3ChannelsRemote

TMP421

TMP422

TMP423

www.ti.com

SBOS398C –JULY 2007–REVISED MAY 2012

±1°C Remote and Local TEMPERATURE SENSOR

Check for Samples: TMP421, TMP422, TMP423

FEATURES

DESCRIPTION

The TMP421, TMP422, and TMP423 are remote

234

• SOT23-8 and DSBGA (WCSP) PACKAGES

temperature sensor monitors with a built-in local

• ±1°C REMOTE DIODE SENSOR (MAX)

temperature sensor. The remote temperature sensor

• ±1.5°C LOCAL TEMPERATURE SENSOR (MAX)

diode-connected transistors are typically low-cost,

NPN- or PNP-type transistors or diodes that are an

• SERIES RESISTANCE CANCELLATION

integral part of microcontrollers, microprocessors, or

• n-FACTOR CORRECTION

FPGAs.

• TWO-WIRE/ SMBus™ SERIAL INTERFACE

Remote accuracy is ±1°C for multiple IC

• MULTIPLE INTERFACE ADDRESSES

manufacturers, with no calibration needed. The two-

• DIODE FAULT DETECTION

wire serial interface accepts SMBus write byte, read

byte, send byte, and receive byte commands to

• RoHS COMPLIANT AND NO Sb/Br

configure the device.

APPLICATIONS

The TMP421, TMP422, and TMP423 include series

resistance cancellation, programmable non-ideality

• PROCESSOR/FPGA TEMPERATURE

factor, wide remote temperature measurement range

MONITORING

(up to +150°C), and diode fault detection.

• LCD/ DLP

/LCOS PROJECTORS

The TMP421, TMP422, and TMP423 are all available

• SERVERS

in a SOT23-8 package. The TMP421C is also

• CENTRAL OFFICE TELECOM EQUIPMENT

available in a DSBGA (WCSP) package.

• STORAGE AREA NETWORKS (SAN)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2DLP is a registered trademark of Texas Instruments.

3SMBus is a trademark of Intel Corporation.

4All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (35 pages)

PAGE 1
TMP421 TMP422 TMP423 www.ti.com SBOS398C – JULY 2007 – REVISED MAY 2012 ±1°C Remote and Local TEMPERATURE SENSOR Check for Samples: TMP421, TMP422, TMP423 FEATURES DESCRIPTION • • • • • • • • • The TMP421, TMP422, and TMP423 are remote temperature sensor monitors with a built-in local temperature sensor. The remote temperature sensor diode-connected transistors are typically low-cost, NPN- or PNP-type transistors or diodes that are an integral part of microcontrollers, microprocessors, or FPGAs.
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TMP421 TMP422 TMP423 SBOS398C – JULY 2007 – REVISED MAY 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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TMP421 TMP422 TMP423 www.ti.com SBOS398C – JULY 2007 – REVISED MAY 2012 ELECTRICAL CHARACTERISTICS: TMP421, TMP422, TMP423 At TA = –40°C to +125°C and V+ = 2.7V to 5.5V, unless otherwise noted. TMP421, TMP422, TMP423 PARAMETER CONDITIONS MIN TYP MAX UNIT TEMPERATURE ERROR Local Temperature Sensor Remote Temperature Sensor (1) TELOCAL TEREMOTE vs Supply (Local/Remote) TA = –40°C to +125°C ±1.25 ±2.5 °C TA = +15°C to +85°C, V+ = 3.3V ±0.25 ±1.
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TMP421 TMP422 TMP423 SBOS398C – JULY 2007 – REVISED MAY 2012 www.ti.com ELECTRICAL CHARACTERISTICS: TMP421C At TA = –40°C to +125°C and V+ = 2.55V to 5.5V, unless otherwise noted. TMP421C PARAMETER CONDITIONS MIN TYP MAX UNIT TEMPERATURE ERROR Local Temperature Sensor Remote Temperature Sensor (1) TELOCAL TEREMOTE vs Supply (Local/Remote) TA = –40°C to +125°C ±1.25 ±2.5 °C TA = +15°C to +85°C, V+ = 3.3V ±0.25 ±1.5 °C TA = +15°C to +85°C, TD = –40°C to +150°C, V+ = 3.3V ±0.
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TMP421 TMP422 TMP423 www.ti.com SBOS398C – JULY 2007 – REVISED MAY 2012 TMP421 PIN CONFIGURATION DCN PACKAGE SOT23-8 (TOP VIEW) 1 DXN 2 8 V+ 7 SCL TMP421 A1 3 6 SDA A0 4 5 GND DXP 1 DXN 2 A1 3 A0 4 TMP421C DXP YZD PACKAGE DSBGA-8 (TOP VIEW) 8 V+ 7 SCL 6 SDA 5 GND TMP421 PIN ASSIGNMENTS TMP421 NO. NAME 1 DXP DESCRIPTION Positive connection to remote temperature sensor. 2 DXN Negative connection to remote temperature sensor.
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TMP421 TMP422 TMP423 SBOS398C – JULY 2007 – REVISED MAY 2012 www.ti.com TMP423 PIN CONFIGURATION DCN PACKAGE SOT23-8 (TOP VIEW) DXP1 1 DXP2 2 8 V+ 7 SCL TMP423 DXP3 3 6 SDA DXN 4 5 GND TMP423 PIN ASSIGNMENTS TMP423 6 NO. NAME DESCRIPTION 1 DXP1 Channel 1 positive connection to remote temperature sensor. 2 DXP2 Channel 2 positive connection to remote temperature sensor. 3 DXP3 Channel 3 positive connection to remote temperature sensor.
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TMP421 TMP422 TMP423 www.ti.com SBOS398C – JULY 2007 – REVISED MAY 2012 TYPICAL CHARACTERISTICS At TA = +25°C and V+ = +5.0V, unless otherwise noted. REMOTE TEMPERATURE ERROR vs TEMPERATURE 3 V+ = 3.3V TREMOTE = +25°C 2 30 Typical Units Shown h = 1.008 1 0 -1 -2 2 1 0 -1 -2 -3 -3 -50 0 -25 25 50 75 100 125 -50 -25 0 25 50 75 100 Ambient Temperature, TA (°C) Ambient Temperature, TA (°C) Figure 1. Figure 2.
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TMP421 TMP422 TMP423 SBOS398C – JULY 2007 – REVISED MAY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C and V+ = +5.0V, unless otherwise noted. REMOTE TEMPERATURE ERROR vs SERIES RESISTANCE (GND Collector-Connected Transistor, 2N3906 PNP) REMOTE TEMPERATURE ERROR vs DIFFERENTIAL CAPACITANCE 3 1.5 Remote Temperature Error (°C) Remote Temperature Error (°C) 2.0 V+ = 2.7V 1.0 0.5 V+ = 5.5V 0 -0.5 -1.0 -1.5 -2.0 2 1 0 -1 -2 -3 0 500 1000 1500 2000 2500 3000 0 3500 0.5 1.
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TMP421 TMP422 TMP423 www.ti.com SBOS398C – JULY 2007 – REVISED MAY 2012 APPLICATION INFORMATION The TMP421 is a two-channel digital temperature sensor that combines a local die temperaturemeasurement channel and a remote-junction temperature-measurement channel, and is available in SOT23-8 and DSBGA-8 packages.
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TMP421 TMP422 TMP423 SBOS398C – JULY 2007 – REVISED MAY 2012 www.ti.com +5V Transistor-connected configuration(1): 0.1mF Series Resistance RS(2) DXP1 8 1 CDIFF(3) RS(2) 2 V+ DX1(4) DXN1 SMBus Controller 6 SDA TMP422 RS(2) DXP2 10kW (typ) 7 SCL DX2(4) 10kW (typ) 3 CDIFF(3) RS(2) 4 DX3(4) DX4(4) DXN2 GND 5 Diode-connected configuration(1): RS(2) RS(2) CDIFF(3) (1) Diode-connected configuration provides better settling time.
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TMP421 TMP422 TMP423 www.ti.com SBOS398C – JULY 2007 – REVISED MAY 2012 SERIES RESISTANCE CANCELLATION Series resistance in an application circuit that typically results from printed circuit board (PCB) trace resistance and remote line length is automatically cancelled by the TMP421/22/23, preventing what would otherwise result in a temperature offset.
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TMP421 TMP422 TMP423 SBOS398C – JULY 2007 – REVISED MAY 2012 www.ti.com Both local and remote temperature data use two bytes for data storage. The high byte stores the temperature with 1°C resolution. The second or low byte stores the decimal fraction value of the temperature and allows a higher measurement resolution, as shown in Table 2. The measurement resolution for the both the local and remote channels is 0.0625°C, and is not adjustable. Table 2.
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TMP421 TMP422 TMP423 www.ti.com SBOS398C – JULY 2007 – REVISED MAY 2012 Table 3.
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TMP421 TMP422 TMP423 SBOS398C – JULY 2007 – REVISED MAY 2012 www.ti.com STATUS REGISTER shutdown mode. When SD is set to '0' again, the TMP421/22/23 resume continuous conversions. When SD = '1', a single conversion can be started by writing to the One-Shot Register. See the One-Shot Conversion section for more information. The Status Register reports the state of the temperature ADCs. Table 4 summarizes the Status Register bits.
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TMP421 TMP422 TMP423 www.ti.com SBOS398C – JULY 2007 – REVISED MAY 2012 The RC bit (bit 2) enables the resistance correction feature for the external temperature channels. If RC = '1', series resistance correction is enabled; if RC = '0', resistance correction is disabled. Resistance correction should be enabled for most applications.
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TMP421 TMP422 TMP423 SBOS398C – JULY 2007 – REVISED MAY 2012 www.ti.com Table 7. Conversion Rate Register CONVERSION RATE REGISTER (Read/Write = 0Bh, POR = 07h) AVERAGE IQ (TYP) (μA) (1) (2) R7 R6 R5 R4 R3 R2 R1 R0 CONVERSIONS/SEC V+ = 2.7V V+ = 5.5V 0 0 0 0 0 0 0 0 0.0625 11 32 0 0 0 0 0 0 0 1 0.125 17 38 0 0 0 0 0 0 1 0 0.25 28 49 0 0 0 0 0 0 1 1 0.
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TMP421 TMP422 TMP423 www.ti.com SBOS398C – JULY 2007 – REVISED MAY 2012 SOFTWARE RESET The TMP421/22/23 may be reset by writing any value to the Software Reset Register (pointer address FCh). This action restores the power-on reset state to all of the TMP421/22/23 registers as well as aborts any conversion in process. The TMP421/22/23 also support reset via the two-wire general call address (0000 0000). The General Call Reset section contains more information. Table 8.
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TMP421 TMP422 TMP423 SBOS398C – JULY 2007 – REVISED MAY 2012 www.ti.com SERIAL BUS ADDRESS To communicate with the TMP421/22/23, the master must first address slave devices via a slave address byte. The slave address byte consists of seven address bits, and a direction bit indicating the intent of executing a read or write operation. DXN connection should be left unconnected. The polarity of the transistor for external channel 2 (pins 3 and 4) sets the least significant bit of the slave address.
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TMP421 TMP422 TMP423 www.ti.com SBOS398C – JULY 2007 – REVISED MAY 2012 The TMP422 checks the polarity of the external transistor at power-on, or after software reset, by forcing current to pin 1 while connecting pin 2 to approximately 0.6V. If the voltage on pin 1 does not pull up to near the V+ of the TMP422, pin 1 functions as DXP for channel 1, and the second LSB of the slave address is '0'.
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TMP421 TMP422 TMP423 SBOS398C – JULY 2007 – REVISED MAY 2012 www.ti.com TIMING DIAGRAMS The TMP421/22/23 are two-wire and SMBuscompatible. Figure 16 to Figure 19 describe the timing for various operations on the TMP421/22/23. Parameters for Figure 16 are defined in Table 11. Bus definitions are: Bus Idle: Both SDA and SCL lines remain high. Start Data Transfer: A change in the state of the SDA line, from high to low, while the SCL line is high, defines a START condition.
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TMP421 TMP422 TMP423 www.ti.com SBOS398C – JULY 2007 – REVISED MAY 2012 1 9 9 1 ¼ SCL SDA 1 0 0 1 1 0(1) 0 R/W Start By Master P7 P6 P5 P4 P3 P2 P1 ACK By TMP421/22/23 ¼ P0 ACK By TMP421/22/23 Frame 2 Pointer Register Byte Frame 1 Two-Wire Slave Address Byte 9 1 SCL (Continued) SDA (Continued) D7 D6 D5 D4 D3 D2 D1 D0 ACK By Stop By TMP421/22/23 Master Frame 3 Data Byte 1 (1) Slave address 1001100 shown. Figure 17.
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TMP421 TMP422 TMP423 SBOS398C – JULY 2007 – REVISED MAY 2012 www.ti.
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TMP421 TMP422 TMP423 www.ti.com SBOS398C – JULY 2007 – REVISED MAY 2012 SHUTDOWN MODE (SD) The TMP421/22/23 Shutdown Mode allows the user to save maximum power by shutting down all device circuitry other than the serial interface, reducing current consumption to typically less than 3μA; see Figure 10, Shutdown Quiescent Current vs Supply Voltage. Shutdown Mode is enabled when the SD bit (bit 6) of Configuration Register 1 is high; the device shuts down once the current conversion is completed.
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TMP421 TMP422 TMP423 SBOS398C – JULY 2007 – REVISED MAY 2012 www.ti.com For η = 1.004 and T(°C) = 100°C: power dissipated as a result of exciting the remote temperature sensor is negligible because of the small currents used. For a 5.5V supply and maximum conversion rate of eight conversions per second, the TMP421/22/23 dissipate 2.3mW (PDIQ = 5.5V × 415μA). A θJA of 100°C/W (for SOT23 package) causes the junction temperature to rise approximately +0.23°C above the ambient. ǒ Ǔ T ERR + 1.004 * 1.
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TMP421 TMP422 TMP423 www.ti.com SBOS398C – JULY 2007 – REVISED MAY 2012 V+ DXP Ground or V+ layer on bottom and/or top, if possible. DXN GND NOTE: Use minimum 5 mil (0.127mm) traces with 5 mil spacing. Figure 20. Suggested PCB Layer Cross-Section 0.1mF Capacitor DXP 1 8 DXN 2 A1 A0 0.1mF Capacitor GND GND PCB Via PCB Via V+ DX1 1 8 7 DX2 2 7 3 6 DX3 3 6 4 5 DX4 4 5 TMP421 V+ TMP422 0.1mF Capacitor DXP 1 8 DXN 2 A1 A0 0.
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TMP421 TMP422 TMP423 SBOS398C – JULY 2007 – REVISED MAY 2012 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (March 2008) to Revision C Page • Removed package name from title ....................................................................................................................................... 1 • Added new DSBGA package to feature bullet .................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Orderable Device Status (1) TMP423BIDCNTG4 Package Type Package Pins Package Drawing Qty ACTIVE SOT-23 DCN 8 250 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) MSL Peak Temp Op Temp (°C) Top-Side Markings (3) CU NIPDAU Level-2-260C-1 YEAR (4) -40 to 125 DAFI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 28-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) TMP421AIDCNR SOT-23 DCN 8 3000 179.0 8.4 3.2 TMP421AIDCNT SOT-23 DCN 8 250 179.0 8.4 3.2 TMP421YZDR DSBGA YZD 8 3000 180.0 8.4 1.1 TMP421YZDT DSBGA YZD 8 250 180.0 8.4 1.1 TMP422AIDCNR SOT-23 DCN 8 3000 179.0 8.4 W Pin1 (mm) Quadrant 3.
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PACKAGE MATERIALS INFORMATION www.ti.com 28-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TMP421AIDCNR SOT-23 DCN 8 3000 195.0 200.0 45.0 TMP421AIDCNT SOT-23 DCN 8 250 195.0 200.0 45.0 TMP421YZDR DSBGA YZD 8 3000 182.0 182.0 17.0 TMP421YZDT DSBGA YZD 8 250 182.0 182.0 17.0 TMP422AIDCNR SOT-23 DCN 8 3000 195.0 200.0 45.0 TMP422AIDCNT SOT-23 DCN 8 250 195.0 200.0 45.
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D: Max = 2.122 mm, Min =2.062 mm E: Max = 0.932 mm, Min =0.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.