Datasheet

TMP512
TMP513
www.ti.com SBOS491A –JUNE 2010– REVISED MAY 2011
THERMAL INFORMATION
TMP512AIRSAR
TMP512
TMP512AIRSAT
THERMAL METRIC
(1)
UNITS
D (SOIC) RSA
14 16
θ
JA
Junction-to-ambient thermal resistance 91.1 34.3
θ
JC(top)
Junction-to-case(top) thermal resistance 10.6 35.4
θ
JB
Junction-to-board thermal resistance 40.3 11.6
°C/W
ψ
JT
Junction-to-top characterization parameter 49.1 0.5
ψ
JB
Junction-to-board characterization parameter 47.5 11.6
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance N/A 2.7
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
THERMAL INFORMATION
TMP513AIRSAR
TMP513AID
TMP513AIRSAT
THERMAL METRIC
(1)
UNITS
D (SOIC) RSA
16 16
θ
JA
Junction-to-ambient thermal resistance 77.6 44.8
θ
JC(top)
Junction-to-case(top) thermal resistance 55.0 43.8
θ
JB
Junction-to-board thermal resistance 49.9 14.7
°C/W
ψ
JT
Junction-to-top characterization parameter 3.5 0.4
ψ
JB
Junction-to-board characterization parameter 32.2 14.5
θ
JC(bottom)
Junction-to-case(bottom) thermal resistance N/A 2.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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