Digital Signal Processor Product Preview

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PRODUCT PREVIEW
2 Device Overview
2.1 Device Characteristics
TMS320C6454
Fixed-Point Digital Signal Processor
SPRS311A – APRIL 2006 – REVISED DECEMBER 2006
Table 2-1 , provides an overview of the C6454 DSP. The tables show significant features of the C6454
device, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type
with pin count.
Table 2-1. Characteristics of the C6454 Processor
HARDWARE FEATURES C6454
EMIFA (64-bit bus width)
1
(clock source = AECLKIN or SYSCLK4)
DDR2 Memory Controller (32-bit bus width) [1.8 V I/O]
1
(clock source = CLKIN2)
EDMA3 (64 independent channels) [CPU/3 clock rate] 1
I2C 1
Peripherals
HPI (32- or 16-bit user selectable) 1 (HPI16 or HPI32)
Not all peripherals pins
are available at the same
PCI (32-bit), [66-MHz or 33-MHz] 1 (PCI66 or PCI33)
time (For more detail, see
McBSPs (internal CPU/6 or external clock source up
the Device Configuration
2
to 100 Mbps)
section).
10/100/1000 Ethernet MAC (EMAC) 1
Management Data Input/Output (MDIO) 1
64-Bit Timers (Configurable)
2 64-bit or 4 32-bit
(internal clock source = CPU/6 clock frequency)
General-Purpose Input/Output Port (GPIO) 16
Size (Bytes) 1144K
32K-Byte (32KB) L1 Program Memory Controller
[SRAM/Cache]
On-Chip Memory
Organization 32KB Data Memory Controller [SRAM/Cache]
1048KB L2 Unified Memory/Cache
32KB L2 ROM
C64x+ Megamodule Megamodule Revision ID Register (address location:
See Section 5.6 , Megamodule Revision
Revision ID 0181 2000h)
See Section 3.6 , JTAG ID (JTAGID) Register
JTAG BSDL_ID JTAGID register (address location: 0x02A80008)
Description
Frequency MHz 720, 850, and 1000 (1 GHz)
1.39 ns (C6454-720), 1.17 ns (C6454-850),
Cycle Time ns
1 ns (C6454-1000) [1 GHz CPU]
1.25 V (-1000)
Core (V)
1.2 V (-850/-720)
Voltage
1.5/1.8 [EMAC RGMII], and
I/O (V)
1.8 and 3.3 V [I/O Supply Voltage]
PLL1 and PLL1
CLKIN1 frequency multiplier Bypass (x1), x15, x20, x25, x30, x32
Controller Options
CLKIN2 frequency multiplier
PLL2 x20
[DDR2 Memory Controller and EMAC support only]
697-Pin Flip-Chip Plastic BGA (ZTZ)
BGA Package 24 x 24 mm
697-Pin Plastic BGA (GTZ)
Process Technology µm 0.09 µm
Product Preview (PP), Advance Information (AI),
Product Status
(1)
PP
or Production Data (PD)
(1) PRODUCT PREVIEW information concerns experimental products (designated as TMX) that are in the formative or design phase of
development. Characteristic data and other specifications are design goals. Texas Instruments reserves the right to change or
discontinue these products without notice.
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