Datasheet

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FEATURES

APPLICATIONS

DESCRIPTION

APPLICATION CIRCUIT

IN−

IN+

PWM H−

Bridge

O−

O+

Internal

Oscillator

ToBattery

GND

Bias

Circuitry

Differential

Input

TPA2032D1

SHUTDOWN

A1 A2 A3

B2 B3

C1 C2

IN+

GND

O−

PGND

IN−

SHUTDWN

O+

1,4 mm

9-BALLWAFERCHIPSCALE,YZFPACKAGE,

(TOPVIEWOFPCB)

Note:PinA1ismarkedwitha “0” .

1,55mm

1,4mm

1,55mm

TPA

203xD1

0402

2,5

1,7mm

TPA2032D1

TPA2033D1

TPA2034D1

SLOS476 – JUNE 2006

2.75-W FIXED GAIN MONO FILTER-FREE CLASS-D AUDIO POWER AMPLIFIER

• Wafer Chip Scale Packaging (WCSP)

• Maximize Battery Life and Minimize Heat – NanoFree™ Lead-Free (Pb-Free: YZF)

– 0.5- µ A Shutdown Current

– 3.0-mA Quiescent Current

• Ideal for Wireless Handsets, PDAs, and other

– High Efficiency Class-D

mobile devices

• 88% at 400mW at 8 Ω

• 80% at 100mW at 8 Ω

• Three Fixed Gain Versions

The TPA2032D1 (2V/V gain), TPA2033D1 (3V/V

gain), and TPA2034D1 (4V/V gain) are 2.75-W high

– TPA2032D1 has a gain of 2 V/V (6dB)

efficiency filter-free class-D audio power amplifiers,

– TPA2033D1 has a gain of 3 V/V (9.5dB)

each in an approximately 1.5-mm × 1.5-mm wafer

– TPA2034D1 has a gain of 4 V/V (12dB)

chip scale package (WCSP) that requires only one

• Only One External Component Required

external component. The pinout is the same as the

TPA2010D1 except that the external gain setting

– Internal Matched Input Gain and Feedback

input resistors required by the TPA2010D1 are

Resistors for Excellent PSRR and CMRR

integrated into the fixed gain TPA203xD1 family.

– Optimized PWM Output Stage Eliminates

Features like –75dB PSRR and improved

LC Output Filter

RF-rectification immunity with a very small PCB

– PSRR (–75 dB) and Wide Supply Voltage

footprint (WCSP amplifier plus single decoupling

(2.5 V to 5.5 V) Eliminates Need for a

cap) make the TPA203xD1 family ideal for wireless

Dedicated Voltage Regulator

handsets. A fast start-up time of 3.2 ms with minimal

pop makes the TPA203xD1 family ideal for PDA

– Fully Differential Design Reduces RF

applications.

Rectification and Eliminates Bypass

Capacitor

In wireless handsets, the earpiece, speaker phone,

– CMRR (–69 dB)Eliminates Two Input

and melody ringer can each be driven by a

TPA203xD1. The TPA203xD1 family has a low

Coupling Capacitors

27- µ V noise floor, A-weighted.

• Thermal and Short-Circuit Protection

• Pinout Very Similar to TPA2010D1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

NanoFree is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (19 pages)

PAGE 1
TPA2032D1 TPA2033D1 TPA2034D1 www.ti.com SLOS476 – JUNE 2006 2.75-W FIXED GAIN MONO FILTER-FREE CLASS-D AUDIO POWER AMPLIFIER • Wafer Chip Scale Packaging (WCSP) – NanoFree™ Lead-Free (Pb-Free: YZF) FEATURES • • • • • Maximize Battery Life and Minimize Heat – 0.5-µA Shutdown Current – 3.0-mA Quiescent Current – High Efficiency Class-D • 88% at 400mW at 8Ω • 80% at 100mW at 8Ω Three Fixed Gain Versions – TPA2032D1 has a gain of 2 V/V (6dB) – TPA2033D1 has a gain of 3 V/V (9.
PAGE 2
TPA2032D1 TPA2033D1 TPA2034D1 www.ti.com SLOS476 – JUNE 2006 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
PAGE 3
TPA2032D1 TPA2033D1 TPA2034D1 www.ti.com SLOS476 – JUNE 2006 ELECTRICAL CHARACTERISTICS TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS |VOS| Output offset voltage (measured differentially) Inputs AC grounded, VDD = 2.5 V to 5.5 V PSRR Power supply rejection ratio VDD = 2.5 V to 5.5 V MIN TYP MAX TPA2032D1 5 25 TPA2033D1 5 25 TPA2034D1 CMRR Common mode rejection ratio VIC = 0.5 V to (VDD –0.8 V) |IIH| High-level input current VDD = 5.5 V, VI = 5.
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TPA2032D1 TPA2033D1 TPA2034D1 www.ti.com SLOS476 – JUNE 2006 OPERATING CHARACTERISTICS (continued) TA = 25°C, RL = 8 Ω (unless otherwise noted) PARAMETER Vn TEST CONDITIONS VDD = 3.6 V, f = 20 Hz to 20 kHz, Inputs AC grounded with Ci = 1 µF Output voltage noise CMRR Common mode rejection ratio RI Input impedance Start-up time from shutdown MIN TYP MAX No weighting 35 A weighting 27 VDD = 3.6 V, VIC = 1.0 Vpp , VCm = 1.8 f = 217 Hz V –69 AV = 2 V/V 30.2 AV = 3 V/V 22.8 AV = 4 V/V 18.
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TPA2032D1 TPA2033D1 TPA2034D1 www.ti.
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TPA2032D1 TPA2033D1 TPA2034D1 www.ti.com SLOS476 – JUNE 2006 EFFICIENCY vs OUTPUT POWER VDD = 2.5 V 90 80 Efficiency - % 1.4 80 1.2 Class AB 4 W VDD = 5 V VDD = 3.6 V 50 Class AB 40 VDD = 3.6 V 60 VDD = 2.5 V 50 40 Class AB 30 30 20 RL = 8 W, 33 μH 0 0.2 0.4 0.6 0.8 1 PO - Output Power - W 1.2 1.4 0.4 VDD = 5 V, RL = 8 W 0.5 1 1.5 2 PO - Output Power - W 0 2.5 0.5 1 1.5 2 2.5 Figure 3.
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TPA2032D1 TPA2033D1 TPA2034D1 www.ti.com SLOS476 – JUNE 2006 3 2.5 4 W THD+N = 10% 2.5 PO - Output Power - W VDD = 5 V, 1% 1.5 VDD = 3.6 V, 1% 1 VDD = 2.5 V, 1% 4 W THD+N = 1% 2 8 W THD+N = 10% 1.5 1 0.5 0.5 0 0 4 9 14 19 24 8 W THD+N = 1% 2.5 29 3 3.5 4 4.5 VDD - Supply Voltage - V 5 20 RL = 4 W 10 VDD = 2.5 V VDD = 3 V VDD = 3.6 V 1 VDD = 5 V 0.1 0.05 10m 100m 1 PO - Output Power - W 3 Figure 11. Figure 12.
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TPA2032D1 TPA2033D1 TPA2034D1 www.ti.com SLOS476 – JUNE 2006 SUPPLY RIPPLE REJECTION RATIO vs FREQUENCY - TPA2033D1 R L = 8 W, -50 -60 Gain = 2 V/V VDD = 2.5 V -70 -80 -90 -100 10 VDD = 3.6 V VDD = 5 V 100 1k f - Frequency - Hz 10 k Gain = 3 V/V VDD = 2.7 V -60 VDD = 2.5 V -70 -80 VDD = 5 V -90 -100 10 100 k VDD = 3.6 V 100 1k 10 k f - Frequency - Hz -40 -50 VDD = 2.5 V -60 -70 VDD = 5 V -80 Inputs ac-grounded, CI = 1 mF, -90 -100 10 100 k VDD = 2.7 V VDD = 3.
PAGE 9
TPA2032D1 TPA2033D1 TPA2034D1 www.ti.com SLOS476 – JUNE 2006 GSM POWER SUPPLY REJECTION vs FREQUENCY 0 -20 -40 -60 -80 -100 -120 -140 VO - Output Voltage - dBV VDD 200 mV/div VOUT 20 mV/div t - Time - 2 mS/div 10 -10 -30 -50 -70 -90 -110 -130 -150 VDD Shown in Figure 22 CI = 1 mF, Inputs ac-Grounded 0 200 400 600 800 1k 1.2k 1.4k 1.6k1.8k 2k f - Frequency - Hz Figure 28. Figure 29.
PAGE 10
TPA2032D1 TPA2033D1 TPA2034D1 www.ti.com SLOS476 – JUNE 2006 APPLICATION INFORMATION FULLY DIFFERENTIAL AMPLIFIER The TPA2032D1 is a fully differential amplifier with differential inputs and outputs. The fully differential amplifier consists of a differential amplifier and a common-mode amplifier. The differential amplifier ensures that the amplifier outputs a differential voltage on the output that is equal to the differential input times the gain.
PAGE 11
TPA2032D1 TPA2033D1 TPA2034D1 www.ti.com SLOS476 – JUNE 2006 APPLICATION INFORMATION (continued) Equation 2 is reconfigured to solve for the input coupling capacitance. 1 C + I ǒ2p RI f cǓ (2) If the corner frequency is within the audio band, the capacitors should have a tolerance of ±10% or better, because any mismatch in capacitance causes an impedance mismatch at the corner frequency and below. For a flat low-frequency response, use large input coupling capacitors (1 µF or larger).
PAGE 12
TPA2032D1 TPA2033D1 TPA2034D1 www.ti.com SLOS476 – JUNE 2006 APPLICATION INFORMATION (continued) CI Single-ended Input To Battery Internal Oscillator VDD IN− _ PWM CS VO− H− Bridge VO+ + IN+ CI GND Bias Circuitry SHUTDOWN TPA2032D1 Filter-Free Class D Figure 37. TPA2032D1 Application Schematic With Single-Ended Input BOARD LAYOUT In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined (NSMD) land.
PAGE 13
TPA2032D1 TPA2033D1 TPA2034D1 www.ti.com SLOS476 – JUNE 2006 APPLICATION INFORMATION (continued) Table 1. Land Pattern Dimensions SOLDER PAD DEFINITIONS COPPER PAD SOLDER MASK OPENING COPPER THICKNESS STENCIL OPENING STENCIL THICKNESS Nonsolder mask defined (NSMD) 275 µm (+0.0, –25 µm) 375 µm (+0.0, –25 µm) 1 oz max (32 µm) 275 µm x 275 µm Sq. (rounded corners) 125 µm thick NOTES: 1.
PAGE 14
TPA2032D1 TPA2033D1 TPA2034D1 www.ti.com SLOS476 – JUNE 2006 75 mm 100 mm 100 mm 100 mm 375 mm (+0, -25 mm) 275 mm (+0, -25 mm) 100 mm Circular Solder Mask Opening Paste Mask (Stencil) = Copper Pad Size 75 mm 100 mm 75 mm Figure 39. Close Up of TPA2032D1 Land Pattern From TPA2032D1 EVM EFFICIENCY AND THERMAL INFORMATION The maximum ambient temperature depends on the heat-sinking ability of the PCB system. The derating factor for the YZF package is shown in the dissipation rating table.
PAGE 15
TPA2032D1 TPA2033D1 TPA2034D1 www.ti.com SLOS476 – JUNE 2006 WHEN TO USE AN OUTPUT FILTER Design the TPA2032D1 without an output filter if the traces from the amplifier to the speaker are short. Wireless handsets and PDAs are great applications for this class-D amplifier to be used without an output filter. The TPA2032D1 passed FCC- and CE-radiated emissions testing with no shielding with speaker trace wires 100 mm long or less.
PAGE 16
PACKAGE MATERIALS INFORMATION www.ti.com 28-Sep-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TPA2033D1YZFR DSBGA YZF 9 3000 180.0 8.4 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 1.65 1.65 0.81 4.0 8.0 Q1 TPA2033D1YZFT DSBGA YZF 9 250 180.0 8.4 1.65 1.65 0.81 4.0 8.0 Q1 TPA2034D1YZFR DSBGA YZF 9 3000 180.0 8.4 1.65 1.65 0.81 4.0 8.
PAGE 17
PACKAGE MATERIALS INFORMATION www.ti.com 28-Sep-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA2033D1YZFR DSBGA YZF 9 3000 182.0 182.0 17.0 TPA2033D1YZFT DSBGA YZF 9 250 182.0 182.0 17.0 TPA2034D1YZFR DSBGA YZF 9 3000 182.0 182.0 17.0 TPA2034D1YZFT DSBGA YZF 9 250 182.0 182.0 17.
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