Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLinear ICsLinear IC - Audio amplifier 1-channel (mono) Class AB SOIC 8

www.ti.com

FEATURES

SHUTDOWN

BYPASS

IN+

IN-

GND

D OR DGN PACKAGE

(TOP VIEW)

DESCRIPTION

Audio

Input

Bias

Control

350 mW

BYPASS

IN -

0.1

SHUTDOWN

- 8

GND

From System Control

3 IN+

TPA301

SLOS208E – JANUARY 1998 – REVISED JUNE 2004

350-mW MONO AUDIO POWER AMPLIFIER

• Fully Specified for 3.3-V and 5-V Operation

• Wide Power Supply Compatibility 2.5 V - 5.5 V

• Output Power for R

= 8 Ω

– 350 mW at V

= 5 V, BTL

– 250 mW at V

= 3.3 V, BTL

• Ultra-Low Quiescent Current in Shutdown

Mode . . . 0.15 µA

• Thermal and Short-Circuit Protection

• Surface-Mount Packaging

– SOIC

– PowerPAD™ MSOP

The TPA301 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications

where internal speakers are required. Operating with a 3.3-V supply, the TPA301 can deliver 250-mW of

continuous power into a BTL 8-Ω load at less than 1% THD+N throughout voice band frequencies. Although this

device is characterized out to 20 kHz, its operation was optimized for narrower band applications such as cellular

communications. The BTL configuration eliminates the need for external coupling capacitors on the output in

most applications, which is particularly important for small battery-powered equipment. This device features a

shutdown mode for power-sensitive applications with a quiescent current of 0.15 µA during shutdown. The

TPA301 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD MSOP, which

reduces board space by 50% and height by 40%.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (29 pages)

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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 350-mW MONO AUDIO POWER AMPLIFIER FEATURES • • • • • • D OR DGN PACKAGE (TOP VIEW) Fully Specified for 3.3-V and 5-V Operation Wide Power Supply Compatibility 2.5 V - 5.5 V Output Power for RL = 8 Ω – 350 mW at VDD = 5 V, BTL – 250 mW at VDD = 3.3 V, BTL Ultra-Low Quiescent Current in Shutdown Mode . . . 0.
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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 ELECTRICAL CHARACTERISTICS at specified free-air temperature, VDD = 3.3 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX |VOD| Differential output voltage SHUTDOWN = 0 V, RL = 8 Ω, RF = 10 kΩ PSRR Power supply rejection ratio VDD = 3.2 V to 3.
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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 Terminal Functions TERMINAL NAME NO. I/O I DESCRIPTION BYPASS is the tap to the voltage divider for internal mid-supply bias. This terminal should be connected to a 0.1-µF to 1-µF capacitor when used as an audio amplifier. BYPASS 2 GND 7 IN- 4 I IN- is the inverting input. IN- is typically used as the audio input terminal. IN+ 3 I IN+ is the noninverting input. IN+ is typically tied to the BYPASS terminal.
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TPA301 www.ti.
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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 SUPPLY CURRENT (SHUTDOWN) vs SUPPLY VOLTAGE 0.5 SHUTDOWN = VDD RF = 10 kΩ I DD(SD)− Supply Current − µ A 0.45 0.4 0.35 0.3 0.25 0.2 0.15 0.1 0.05 2 2.5 3 3.5 4 4.5 5 5.5 5 5.5 VDD − Supply Voltage − V Figure 4. OUTPUT POWER vs SUPPLY VOLTAGE 1000 THD+N 1% PO − Output Power − mW 800 600 RL = 8 Ω 400 RL = 32 Ω 200 0 2 2.5 3 3.5 4 4.5 VDD − Supply Voltage − V Figure 5.
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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 OUTPUT POWER vs LOAD RESISTANCE 800 THD+N = 1% 700 PO − Output Power − mW 600 VDD = 5 V 500 400 300 VDD = 3.3 V 200 100 0 8 16 24 32 40 48 56 64 RL − Load Resistance − Ω Figure 6. TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 10 VDD = 3.
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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER 10 THD+N −Total Harmonic Distortion + Noise − % THD+N −Total Harmonic Distortion + Noise − % 10 VDD = 3.3 V f = 1 kHz AV = −2 V/V 1 RL = 8 Ω 0.1 0.01 0.04 0.1 0.16 0.22 0.28 0.34 f = 20 kHz f = 10 kHz 1 f = 1 kHz 0.1 f = 20 Hz 0.01 0.01 0.4 0.1 Figure 9. Figure 10.
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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER 10 THD+N −Total Harmonic Distortion + Noise − % VDD = 5 V f = 1 kHz AV = −2 V/V 1 RL = 8 Ω 0.1 0.25 0.40 0.55 0.70 0.85 f = 20 kHz f = 10 kHz 1 f = 1 kHz 0.1 f = 20 Hz VDD = 5 V RL = 8 Ω AV = −2 V/V 0.01 0.01 1 0.1 1 PO − Output Power − W PO − Output Power − W Figure 13. Figure 14.
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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 OPEN-LOOP GAIN AND PHASE vs FREQUENCY 40 180 VDD = 5 V RL = Open Phase 30 120 20 60 10 0 0 Phase − ° Open-Loop Gain − dB Gain −60 −10 −120 −20 −30 −180 1 101 102 103 104 f − Frequency − kHz Figure 16. CLOSED-LOOP GAIN AND PHASE vs FREQUENCY 1 180 Phase 0.75 170 0.25 0 160 Gain −0.25 150 −0.5 −0.75 140 −1 −1.25 −1.5 −1.75 −2 101 VDD = 3.3 V RL = 8 Ω PO = 0.
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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 CLOSED-LOOP GAIN AND PHASE vs FREQUENCY 1 180 Phase 0.75 170 0.25 0 160 Gain −0.25 150 −0.5 −0.75 Phase − ° Closed-Loop Gain − dB 0.5 140 −1 VDD = 5 V RL = 8 Ω PO = 0.35 W CI =1 µF −1.25 −1.5 −1.75 −2 101 102 130 103 104 105 120 106 f − Frequency − Hz Figure 18. OUTPUT NOISE VOLTAGE vs FREQUENCY 100 VDD = 3.3 V BW = 22 Hz to 22 kHz RL = 32 Ω CB =0.
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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 POWER DISSIPATION vs OUTPUT POWER 300 720 270 640 PD − Power Dissipation − mW PD − Power Dissipation − mW POWER DISSIPATION vs OUTPUT POWER 240 210 180 150 VDD = 3.3 V RL = 8 Ω 120 480 400 320 VDD = 5 V RL = 8 Ω 240 90 160 0 100 200 300 PO − Output Power − mW Figure 21. 12 560 400 0 200 400 600 800 PO − Output Power − mW Figure 22.
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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 APPLICATION INFORMATION BRIDGE-TIED LOAD Figure 23 shows a linear audio power amplifier (APA) in a BTL configuration. The TPA301 BTL amplifier consists of two linear amplifiers driving both ends of the load. There are several potential benefits to this differential drive configuration but power to the load should be initially considered.
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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 APPLICATION INFORMATION (continued) VDD -3 dB VO(PP) CC RL VO(PP) fc Figure 24. Single-Ended Configuration and Frequency Response Increasing power to the load does carry a penalty of increased internal power dissipation. The increased dissipation is understandable considering that the BTL configuration produces 4× the output power of a SE configuration.
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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 APPLICATION INFORMATION (continued) P Efficiency where PL P V L RMS R L L SUP 2 Vp 2 2R L V V P L RMS 2 P SUP VDD I DD RMS I DD RMS V DD 2VP RL 2V P RL (3) Efficiency of a BTL Configuration VP 2V DD P LR L 2 1 2 2V DD (4) Table 1 employs Equation 4 to calculate efficiencies for three different output power levels.
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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 VDD 6 RF 50 kΩ CF 5 pF Audio Input CI RI 0.47 µF 10 kΩ 4 IN - 3 IN+ 2 BYPASS VDD CS VDD/2 1 µF - VO+ 5 + CB 2.2 µF - VO- + 8 350 mW 7 GND From System Control 1 SHUTDOWN Bias Control Figure 26. TPA301 Application Circuit The following sections discuss the selection of the components used in Figure 26.
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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 −3 dB f co(lowpass) 1 2 R C F F fco (7) For example, if RF is 100 kΩ and CF is 5 pF then fco is 318 kHz, which is well outside the audio range. Input Capacitor, CI In the typical application, an input capacitor, CI, is required to allow the amplifier to bias the input signal to the proper dc level for optimum operation. In this case, CI and RI form a high-pass filter with the corner frequency determined in Equation 8.
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TPA301 SLOS208E – JANUARY 1998 – REVISED JUNE 2004 www.ti.com Midrail Bypass Capacitor, CB The midrail bypass capacitor, CB, is the most critical capacitor and serves several important functions. During start-up or recovery from shutdown mode, CB determines the rate at which the amplifier starts up. The second function is to reduce noise produced by the power supply caused by coupling into the output drive signal.
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TPA301 www.ti.com SLOS208E – JANUARY 1998 – REVISED JUNE 2004 Converting dB back into watts: PW = 10PdB/10 = 11 mW (15 dB headroom) = 22 mW (12 dB headroom) = 44 mW (9 dB headroom) = 88 mW (6 dB headroom) This is valuable information to consider when attempting to estimate the heat dissipation requirements for the amplifier system.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com (4) 18-Oct-2013 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPA301DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPA301DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPA301DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA301DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 TPA301DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0 TPA301DR SOIC D 8 2500 367.0 367.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.