Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLinear ICsLinear IC - Audio amplifier 2-channel (stereo) Class D HTQFP 48 (7x7)

QFN

HTQFP

Simplified ApplicationCircuit

TV Audio

Processor

RINP

BSRN

BSRP

VCLAMPR

VCLAMPL

PGNDR

PGNDL

VREG

VBYP

ROSC

BSLN

ROUTN

LOUTN

LOUTP

BSLP

ROUTP

TPA3100D2

LINN

RINN

LINP

MUTE

GAIN0

GAIN1

SYNC

FAULT

PVCCR

PVCCL

AVCC

AGND

MSTR/SLV

SHUTDOWN

Shutdown

Control

MuteControl

SyncControl

FaultFlag

10Vto26V

GainSelect

1 Fm

10nF

100kW

0.22 Fm

1 Fm

TPA3100D2

www.ti.com

SLOS469F –OCTOBER 2005–REVISED AUGUST 2010

20-W STEREO CLASS-D AUDIO POWER AMPLIFIER

Check for Samples: TPA3100D2

FEATURES

APPLICATIONS

• Televisions

• 20-W/ch into an 8-Ω Load From a 18-V Supply

• 10-W/ch into an 8-Ω Load From a 12-V Supply

DESCRIPTION

• 15-W/ch into an 4-Ω Load From a 12-V Supply

The TPA3100D2 is a 20-W (per channel) efficient,

• Operates from 10 V to 26 V

Class-D audio power amplifier for driving bridged-tied

• 92% Efficient Class-D Operation Eliminates

stereo speakers. The TPA3100D2 can drive stereo

Need for Heat Sinks

speakers as low as 4 Ω. The high efficiency of the

• Four Selectable, Fixed Gain Settings TPA3100D2, 92%, eliminates the need for an

external heat sink when playing music.

• Differential Inputs

The gain of the amplifier is controlled by two gain

• Thermal and Short-Circuit Protection With

select pins. The gain selections are 20, 26, 32,

Auto Recovery Feature

36 dB.

• Clock Output for Synchronization With

The outputs are fully protected against shorts to

Multiple Class-D Devices

GND, V

, and output-to-output shorts with an auto

• Surface Mount 7 mm × 7 mm, 48-pin QFN

recovery feature and monitor output.

Package

• Surface Mount 9 mm × 9 mm, 48-pin HTQFP

Package

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (41 pages)

PAGE 1
TPA3100D2 HTQFP QFN www.ti.
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TPA3100D2 SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) UNIT VCC Supply voltage VI Input voltage AVCC, PVCC –0.3 V to 30 V SHUTDOWN, MUTE –0.3 V to VCC + 0.
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TPA3100D2 www.ti.
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TPA3100D2 SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 www.ti.com DC CHARACTERISTICS (continued) TA = 25°C, VCC = 12 V, RL = 8 Ω (unless otherwise noted) PARAMETER rDS(on) Drain-source on-state resistance TEST CONDITIONS VCC = 12 V, IO = 500 mA, TJ = 25°C GAIN1 = 0.8 V G Gain GAIN1 = 2 V MIN TYP MAX High Side 200 Low side 200 Total 400 500 UNIT mΩ GAIN0 = 0.8 V 19 20 21 GAIN0 = 2 V 25 26 27 GAIN0 = 0.
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TPA3100D2 www.ti.
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TPA3100D2 SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 www.ti.com TERMINAL FUNCTIONS (continued) TERMINAL NAME QFN NO. HTQFP NO. I/O ROUTP 41, 42 41, 42 O PVCCR 34, 35 34, 35 DESCRIPTION Class-D 1/2-H-bridge positive output for right channel. Power supply for right channel H-bridge, not connected to PVCCL or AVCC. BSRP 43 43 AGND 4, 17 4, 17 ROSC 14 14 I/O MSTR/SLV 10 10 I SYNC 11 11 I/O Clock input/output for synchronizing multiple class-D devices.
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TPA3100D2 www.ti.com SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 FUNCTIONAL BLOCK DIAGRAM PVCCR PVCCR VCLAMPR PVCCR VBYP BSRN VBYP AVCC AVCC Gain RINN Gate Drive Gain Control RINP ROUTN VClamp Gen PWM Logic PVCCR VBYP GAIN0 GAIN1 BSRP Gain Control Gate Drive To Gain Adj.
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TPA3100D2 SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 www.ti.com TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY THD+N - Total Harmonic Distortion + Noise - % RL = 8 W, Gain = 20 dB 1 PO = 5 W 0.1 PO = 2.5 W PO = 0.5 W 0.01 0.005 0.003 20 10 THD+N - Total Harmonic Distortion + Noise - % 10 VCC = 12 V, 100 10k 20k 1k f - Frequency - Hz RL = 8 W, Gain = 20 dB 1 PO = 10 W 0.1 PO = 5 W 0.01 PO = 1 W 0.005 0.
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TPA3100D2 www.ti.com SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 THD+N - Total Harmonic Distortion + Noise - % 10 VCC = 12 V, RL = 8 W, Gain = 32 dB 1 10 kHz 0.1 0.05 1 kHz 0.02 20 Hz 0.01 10m 100m 200m 1 TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER THD+N - Total Harmonic Distortion + Noise - % TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER 10 V = 18 V, CC RL = 8 W, Gain = 32 dB 1 10 kHz 0.1 0.05 1 kHz 20 Hz 0.02 0.01 10m 10 20 40 100m 200m PO - Output Power - W Figure 5.
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TPA3100D2 SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 www.ti.com CLOSED LOOP RESPONSE vs FREQUENCY CLOSED LOOP RESPONSE vs FREQUENCY Gain − dB 25 150 35 100 30 50 25 Phase 20 0 15 VCC = 12 V RL = 8 W VI = 0.1 Vrms 10 CI = 10 mF Gain = 32 dB RC Filter = 100 W, 10 nF 5 0 10 100 1k 10k 200 Gain 100 50 Phase 20 −50 15 −100 10 −150 5 −200 100k 0 0 −50 VCC = 24 V RL = 8 W VI = 0.
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TPA3100D2 www.ti.com SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 EFFICIENCY vs OUTPUT POWER 100 100 VCC = 12 V 90 90 80 80 VCC = 18 V 60 VCC = 24 V 50 VCC = 12 V 70 Efficiency − % 70 Efficiency − % EFFICIENCY vs OUTPUT POWER 40 60 50 40 30 30 20 20 RL = 8 W Gain = 32 dB 10 RL = 4 Ω Gain = 32 dB 10 0 0 0 2 4 6 8 10 12 14 16 18 0 20 2 4 6 8 10 12 14 15 PO − Output Power (Per Channel) − W PO − Output Power (Per Channel) − W Figure 13. Figure 14.
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TPA3100D2 SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 www.ti.com CROSSTALK vs FREQUENCY CROSSTALK vs FREQUENCY -40 -40 −60 VCC = 12 V RL = 8 Ω Gain = 20 dB VO = 1 Vrms −60 VCC = 24 V RL = 8 Ω Gain = 20 dB VO = 1 Vrms L to R −80 R to L −100 Crosstalk − dB Crosstalk − dB L to R R to L −100 −120 −120 −140 20 −80 100 1k −140 20 10k 20k 100 Figure 17. Figure 18.
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TPA3100D2 www.ti.
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TPA3100D2 Shutdown and Mute Control www.ti.
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TPA3100D2 SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 Fault Output Shutdown and Mute Control www.ti.
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TPA3100D2 www.ti.
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TPA3100D2 www.ti.com SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 CLASS-D OPERATION This section focuses on the class-D operation of the TPA3100D2. Traditional Class-D Modulation Scheme The traditional class-D modulation scheme, which is used in the TPA032D0x family, has a differential output where each output is 180 degrees out of phase and changes from ground to the supply voltage, VCC.
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TPA3100D2 SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 www.ti.com OUTP OUTN Differential Voltage Across Load Output = 0 V +12 V 0V -12 V Current OUTP OUTN Differential Voltage Across Load Output > 0 V +12 V 0V -12 V Current Figure 26.
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TPA3100D2 www.ti.com SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 Most applications require a ferrite bead filter. The ferrite filter reduces EMI around 1 MHz and higher (FCC and CE only test radiated emissions greater than 30 MHz). When selecting a ferrite bead, choose one with high impedance at high frequencies, but low impedance at low frequencies. Use an LC output filter if there are low frequency (<1 MHz) EMI-sensitive circuits and/or there are long wires from the amplifier to the speaker.
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TPA3100D2 SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 www.ti.com Using the LC filter in Figure 27, the TPA3100D2 EMI EVM passed the FCC Part 15 Class B radiated emissions with 21-inch speaker wires. Quasi-peak measurements were taken for the 4 standard test configurations, and the TPA3100D2 EVM passed with at least 17-dB margin. A plot of the peak measurement for the horizontal rear configuration is shown in Figure 30.
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TPA3100D2 www.ti.com SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 Adaptive Dynamic Range Control TPA3100D2 Closest Competitor V - Voltage = 1 V/div V - Voltage = 10 V/div TPA3100D2 Closest Competitor t - Time = 100 ms/div t - Time = 20 ms/div Figure 31. 1-kHz Sine Output at 10% THD+N Figure 32.
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TPA3100D2 SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 www.ti.com Zf Ci IN Input Signal Zi The -3-dB frequency can be calculated using Equation 1. Use the ZI values given in Table 2. f = 1 2p Zi Ci (1) INPUT CAPACITOR, CI In the typical application, an input capacitor (CI) is required to allow the amplifier to bias the input signal to the proper dc level for optimum operation.
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TPA3100D2 www.ti.com SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 IC Output Snubbers 1-nF capacitors in series with 20-Ω resistors from the outputs of the TPA3100D2 IC to ground are switching snubbers. These are illustrated in Figure 33. They linearize switching transitions and reduce overshoot and ringing. By doing so they improve THD+N, reducing it by a factor near 3 at 1kHz, 1W; and they improve EMC by 2 to 6 dB at middle frequencies.
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TPA3100D2 SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 www.ti.com A secondary function of the VBYP capacitor is to filter high-frequency noise on the internal 1.25-V bias generator. A value of at least 0.47µF is recommended for the VBYP capacitor. For the best power-up and shutdown pop performance, the VBYP capacitor should be greater than or equal to the input capacitors.
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TPA3100D2 www.ti.com SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 TPA3100D2 External GPIO Control MUTE FAULT Figure 34. External MUTE Control MSTR/SLV and SYNC operation The MSTR/SLV and SYNC terminals can be used to synchronize the frequency of the class-D output switching. When the MSTR/SLV terminal is high, the output switching frequency is determined by the selection of the resistor connected to the ROSC terminal (see ROSC Resistor Selection).
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TPA3100D2 SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 www.ti.com THERMAL PROTECTION Thermal protection on the TPA3100D2 prevents damage to the device when the internal die temperature exceeds 150°C. There is a ±15°C tolerance on this trip point from device to device. Once the die temperature exceeds the thermal set point, the device enters into the shutdown state and the outputs are disabled. This is not a latched fault. The thermal fault is cleared once the temperature of the die is reduced by 30°C.
PAGE 27
TPA3100D2 www.ti.com SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 The generator output and amplifier input must be ac-coupled. However, the EVMs already have the ac-coupling capacitors, (CIN), so no additional coupling is required. The generator output impedance should be low to avoid attenuating the test signal, and is important because the input resistance of APAs is not high. Conversely, the analyzer-input impedance should be high.
PAGE 28
TPA3100D2 SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 www.ti.com DIFFERENTIAL INPUT AND BTL OUTPUT All of the class-D APAs and many class-AB APAs have differential inputs and bridge-tied load (BTL) outputs. Differential inputs have two input pins per channel and amplify the difference in voltage between the pins. Differential inputs reduce the common-mode noise and distortion of the input circuit. BTL is a term commonly used in audio to describe differential outputs.
PAGE 29
TPA3100D2 www.ti.com SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 CLASS-D RC LOW-PASS FILTER An RC filter is used to reduce the square-wave output when the analyzer inputs cannot process the pulse-width modulated class-D output waveform. This filter has little effect on the measurement accuracy because the cutoff frequency is set above the audio band.
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TPA3100D2 SLOS469F – OCTOBER 2005 – REVISED AUGUST 2010 www.ti.com Table 4 shows recommended values of RFILT and CFILT based on common component values. The value of fC was originally calculated to be 28 kHz for an fMAX of 20 kHz. CFILT, however, was calculated to be 57,000 pF, but the nearest values of 56,000 pF and 51,000 pF were not available. A 47,000-pF capacitor was used instead, and fC is 34 kHz, which is above the desired value of 28 kHz. Table 4.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 (4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Top-Side Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
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PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPA3100D2PHPR HTQFP PHP 48 1000 330.0 16.4 9.6 9.6 1.5 12.0 16.0 Q2 TPA3100D2RGZR VQFN RGZ 48 2500 330.0 16.4 7.3 7.3 1.5 12.0 16.0 Q2 TPA3100D2RGZT VQFN RGZ 48 250 180.0 16.4 7.3 7.3 1.5 12.0 16.
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PACKAGE MATERIALS INFORMATION www.ti.com 24-Jul-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA3100D2PHPR HTQFP PHP 48 1000 367.0 367.0 38.0 TPA3100D2RGZR VQFN RGZ 48 2500 367.0 367.0 38.0 TPA3100D2RGZT VQFN RGZ 48 250 210.0 185.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.