Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLinear ICsLinear IC - Audio amplifier Headphones (2-channel, stereo) Class AB MSOP 8 PowerPad

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FEATURES DESCRIPTION

IN1−

BYPASS

GND

IN2−

SHUTDOWN

D OR DGN PACKAGE

(TOP VIEW)

TYPICAL APPLICATION CIRCUIT

Audio

Input

Bias

Control

IN1−

BYPASS

SHUTDOWN

(BYP)

(S)

Audio

Input

IN2−

From Shutdown

Control Circuit

−

(C)

TPA6111A2

SLOS313B – DECEMBER 2000 – REVISED JUNE 2004

150-mW STEREO AUDIO POWER AMPLIFIER

• 150-mW Stereo Output

The TPA6111A2 is a stereo audio power amplifier

packaged in either an 8-pin SOIC or an 8-pin

• PC Power Supply Compatible

PowerPAD™ MSOP package capable of delivering

– Fully Specified for 3.3-V and

150 mW of continuous RMS power per channel into

5-V Operation

16-Ω loads. Amplifier gain is externally configured by

– Operation to 2.5 V

means of two resistors per input channel and does

not require external compensation for settings of 0 to

• Pop Reduction Circuitry

20 dB.

• Internal Midrail Generation

THD+N, when driving a 16-Ω load from 5 V, is 0.03%

• Thermal and Short-Circuit Protection

at 1 kHz, and less than 1% across the audio band of

• Surface-Mount Packaging

20 Hz to 20 kHz. For 32-Ω loads, the THD+N is

– PowerPAD™ MSOP

reduced to less than 0.02% at 1 kHz, and is less than

1% across the audio band of 20 Hz to 20 kHz. For

– SOIC

10-kΩ loads, the THD+N performance is 0.005% at 1

• Pin Compatible With TPA122, LM4880, and

kHz, and less than 0.5% across the audio band of 20

LM4881 (SOIC)

Hz to 20 kHz.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PowerPAD is a trademark of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (27 pages)

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TPA6111A2 www.ti.com SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 150-mW STEREO AUDIO POWER AMPLIFIER FEATURES • • • • • • • DESCRIPTION 150-mW Stereo Output PC Power Supply Compatible – Fully Specified for 3.3-V and 5-V Operation – Operation to 2.
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TPA6111A2 www.ti.com SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. AVAILABLE OPTIONS PACKAGED DEVICES TA SMALL OUTLINE (1) (D) MSOP (1) (DGN) –40°C to 85°C TPA6111A2D TPA6111A2DGN (1) MSOP SYMBOLIZATION TI AJA The D and DGN package is available in left-ended tape and reel only (e.g.
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TPA6111A2 www.ti.com SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 RECOMMENDED OPERATING CONDITIONS MIN MAX VDD Supply voltage 2.5 5.5 V TA Operating free-air temperature –40 85 °C VIH High-level input voltage (SHUTDOWN) VIL Low-level input voltage (SHUTDOWN) 60% x VDD UNIT V 25% x VDD V DC ELECTRICAL CHARACTERISTICS at VDD = 3.3 V, TA = 25°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP VOO Output offset voltage PSRR Power supply rejection ratio VDD = 3.2 V to 3.
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TPA6111A2 www.ti.com SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 AC OPERATING CHARACTERISTICS VDD = 5 V, TA = 25°C, RL = 6 Ω PARAMETER TEST CONDITIONS MIN TYP PO Output power (each channel) THD ≤ 0.1%, f = 1 kHz THD+N Total harmonic distortion + noise PO = 100 mW, 20 Hz – 20 kHz 0.6% BOM Maximum output power BW G = 20 dB, THD < 5% > 20 Phase margin Open loop Supply ripple rejection ratio f = 1 kHz, C(BYP) = 0.
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TPA6111A2 www.ti.
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TPA6111A2 www.ti.com SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY 1 10 VDD = 5 V, PO = 60 mW, CB = 1 µF, RL = 32 Ω, THD+N − Total Harmonic Distortion + Noise − % THD+N − Total Harmonic Distortion + Noise − % 10 AV = −5 V/V AV = −1 V/V AV = −10 V/V 0.1 0.05 0.01 0.001 20 100 TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER 1k f − Frequency − Hz 1 kHz 0.01 100 500 Figure 4.
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TPA6111A2 www.ti.com SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER 10 1 THD+N − Total Harmonic Distortion + Noise − % THD+N − Total Harmonic Distortion + Noise − % 10 VDD = 3.3 V, PO = 60 mW, CB = 1 µF, RL = 8 Ω, AV = −1 V/V 0.1 0.01 0.001 20 100 1k f − Frequency − Hz 1 kHz 0.01 100 Figure 8.
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TPA6111A2 www.ti.com SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 TOTAL HARMONIC DISTORTION + NOISE vs FREQUENCY TOTAL HARMONIC DISTORTION + NOISE vs OUTPUT POWER 10 1 THD+N − Total Harmonic Distortion + Noise − % THD+N − Total Harmonic Distortion + Noise − % 10 VDD = 3.3 V, PO = 40 mW, CB = 1 µF, RL = 16 Ω, AV = −1 V/V 0.1 0.01 0.
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TPA6111A2 www.ti.com SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 SUPPLY RIPPLE REJECTION RATIO vs FREQUENCY SUPPLY RIPPLE REJECTION RATIO vs FREQUENCY 0 0.1 µF −10 VDD = 3.3 V, RL = 16 Ω, AV = −1 V/V 0.47 µF −20 1 µF −30 −40 −50 −60 −70 −80 Bypass = 1.65 V −90 −100 −110 K SVR − Supply Ripple Rejection Ratio − dB K SVR − Supply Ripple Rejection Ratio − dB 0 −120 VDD = 5 V, RL = 16 Ω, AV = −1 V/V 0.47 µF −20 1 µF −30 −40 −50 −60 −70 −80 Bypass = 2.
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TPA6111A2 www.ti.com SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 CROSSTALK vs FREQUENCY CROSSTALK vs FREQUENCY 0 0 VDD = 3.3 V, PO = 25 mW, CB = 1 µF, RL = 32 Ω, AV = −1 V/V −10 −20 −20 −30 −40 Crosstalk − dB Crosstalk − dB −30 −50 −60 −70 −80 −70 IN2− to VO1 20 100 1k f − Frequency − Hz IN1− to VO2 −110 IN1− to VO2 −120 10k 20k 20 100 1k f − Frequency − Hz Figure 19. Figure 20. CROSSTALK vs FREQUENCY CROSSTALK vs FREQUENCY 0 10k 20k 0 VDD = 3.
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TPA6111A2 www.ti.com SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 CROSSTALK vs FREQUENCY CROSSTALK vs FREQUENCY 0 0 VDD = 5 V, PO = 100 mW, CB = 1 µF, RL = 16 Ω, AV = −1 V/V −10 −20 −20 −30 −40 Crosstalk − dB Crosstalk − dB −30 −50 −60 −70 −80 −50 −60 −70 IN2− to VO1 −90 −100 −100 IN1− to VO2 −110 20 0 −10 100 1k f − Frequency − Hz −120 10k 20k 20 100 1k f − Frequency − Hz 10k 20k Figure 23. Figure 24.
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TPA6111A2 www.ti.com SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 OPEN-LOOP GAIN AND PHASE MARGIN vs FREQUENCY VDD = 3.
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TPA6111A2 www.ti.com SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 SUPPLY CURRENT vs SUPPLY VOLTAGE SIGNAL-TO-NOISE RATIO vs VOLTAGE GAIN 120 2.5 SNR − Signal-to-Noise Ratio − dB VDD = 5 V 1.5 1 0.5 0 0 0.5 1 1.5 2 2.5 3 3.5 4 VDD − Supply Voltage − V 4.5 5 100 80 60 40 20 0 5.5 1 2 3 4 5 6 7 8 9 10 AV − Voltage Gain − V/V Figure 31. Figure 32. POWER DISSIPATION/AMPLIFIER vs LOAD POWER 80 VDD = 3.
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TPA6111A2 www.ti.com SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 POWER DISSIPATION/AMPLIFIER vs LOAD POWER 180 Power Dissipation/Amplifier − mW VDD = 5 V 8Ω 160 140 120 100 16 Ω 80 60 32 Ω 40 64 Ω 20 0 0 20 40 60 80 100 120 140 160 180 Load Power − mW Figure 34.
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TPA6111A2 www.ti.com SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 APPLICATION INFORMATION GAIN SETTING RESISTORS, RF and Ri The gain for the TPA6111A2 is set by resistors RF and RI according to Equation 1. Gain RF RI (1) Given that the TPA6111A2 is a MOS amplifier, the input impedance is high. Consequently, input leakage currents are not generally a concern, although noise in the circuit increases as the value of RF increases.
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TPA6111A2 www.ti.com SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 APPLICATION INFORMATION (continued) POWER SUPPLY DECOUPLING, C(S) The TPA6111A2 is a high-performance CMOS audio amplifier that requires adequate power supply decoupling to ensure that the output total harmonic distortion (THD) is as low as possible. Power supply decoupling also prevents oscillations for long lead lengths between the amplifier and the speaker.
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TPA6111A2 www.ti.com SLOS313B – DECEMBER 2000 – REVISED JUNE 2004 The output coupling capacitor required in single-supply SE mode also places additional constraints on the selection of other components in the amplifier circuit. With the rules described earlier still valid, add the following relationship: 1 1 1 RLC (C) C R C 230 kΩ I I (BYP) (8) USING LOW-ESR CAPACITORS Low-ESR capacitors are recommended throughout this application.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com (4) 18-Oct-2013 There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
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PACKAGE MATERIALS INFORMATION www.ti.com 31-Jul-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPA6111A2DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPA6111A2DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPA6111A2DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 31-Jul-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA6111A2DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 TPA6111A2DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0 TPA6111A2DR SOIC D 8 2500 340.5 338.1 20.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.