Datasheet

Copper
TraceWidth
Solder
PadWidth
SolderMask
Opening
CopperTrace
Thickness
SolderMask
Thickness
TPA6141A2
www.ti.com .................................................................................................................................................... SLOS634A –MARCH 2009–REVISED AUGUST 2009
Figure 29. Land Pattern Dimensions
Table 1. Land Pattern Dimensions
(1) (2) (3) (4)
SOLDER PAD SOLDER MASK
(5)
COPPER STENCIL
(6) (7)
STENCIL
COPPER PAD
DEFINITIONS OPENING THICKNESS OPENING THICKNESS
Non-solder-mask 275 μm × 275 μm Sq.
230 μm (+0.0, –25 μm) 310 μm (+0.0, –25 μm) 1 oz max (32 μm) 100 μm thick
defined (NSMD) (rounded corners)
(1) Circuit traces from NSMD defined PWB lands should be 75 μm to 100 μm wide in the exposed area inside the solder mask opening.
Wider trace widths reduce device stand off and impact reliability.
(2) Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the
intended application
(3) Recommend solder paste is Type 3 or Type 4.
(4) For a PWB using a Ni/Au surface finish, the gold thickness should be less 0,5 mm to avoid a reduction in thermal fatigue performance.
(5) Solder mask thickness should be less than 20 μm on top of the copper circuit pattern
(6) Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in
inferior solder paste volume control.
(7) Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to
solder wetting forces.
Copyright © 2009, Texas Instruments Incorporated 17
Product Folder Link(s): TPA6141A2