Datasheet

TPA6141A2
SLOS634A –MARCH 2009–REVISED AUGUST 2009.................................................................................................................................................... www.ti.com
TRACE WIDTH
Recommended trace width at the solder balls is 75 μm to 100 μm to prevent solder wicking onto wider PCB
traces. For high current pins (VDD, HPVDD, HPVSS, CPP, CPN, OUTL, and OUTR) of the TPA6141A2, use 100
μm trace widths at the solder balls and at least 500 μm PCB traces to ensure proper performance and output
power for the device. For the remaining signals of the TPA6141A2, use 75 μm to 100 μm trace widths at the
solder balls. The audio input pins (INL–, INL+, INR– and INR+) must run side-by-side to maximize
common-mode noise cancellation.
Package Dimensions
D E
Max = 1590µm Max = 1590µm
Min = 1530µm Min = 1530µm
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Product Folder Link(s): TPA6141A2