Datasheet

D1 D2 D3 D4
C1 C2 C3 C4
B1 B2 B3 B4
A1 A3 A4
SW
AGND
CPN
EN
AVDD
CPP
HPVSS
GAIN
OUTL
HPVDD
OUTR
INL-
INL+
INR+
A2
SGND
INR-
WCSP PACKAGE
(TOPVIEW)
TPA6141A2
www.ti.com .................................................................................................................................................... SLOS634A –MARCH 2009–REVISED AUGUST 2009
DEVICE PINOUT
TERMINAL FUNCTIONS
TERMINAL INPUT /
OUTPUT /
BALL
DESCRIPTION
POWER
NAME
WCSP
(I/O/P)
INL– A4 I Inverting left input for differential signals. Connect to left input signal through 1 μF capacitor for
single-ended input applications.
INL+ B4 I Non-inverting left input for differential signals. Connect to ground through 1 μF capacitor for
single-ended input applications.
INR+ C4 I Non-inverting right input for differential signals. Connect to ground through 1 μF capacitor for
single-ended input applications.
INR- D4 I Inverting right input for differential signals. Connect to right input signal through 1 μF capacitor for
single-ended input applications.
SGND C3 I Sense ground. Connect to shield terminal of headphone jack.
EN D1 I Amplifier enable. Connect to logic low to shutdown; connect to logic high to activate.
GAIN D2 I Amplifier gain select pin. Connect to logic low to select a gain of 0 dB; connect to logic high to select
a gain of 6 dB.
OUTL A3 O Left headphone amplifier output. Connect to left terminal of headphone jack.
OUTR D3 O Right headphone amplifier output. Connect to right terminal of headphone jack.
CPP B2 P Charge pump positive flying cap. Connect to positive side of capacitor between CPP and CPN.
CPN C1 P Charge pump negative flying cap. Connect to negative side of capacitor between CPP and CPN.
SW A1 P Buck converter switching node.
AVDD A2 P Primary power supply for device.
HPVDD B3 P Power supply for headphone amplifier (DC/DC output node).
AGND B1 P Main Ground for headphone amplifiers, DC/DC converter, and charge pump.
HPVSS C2 P Charge pump output. Connect 2.2 μF capacitor to GND.
ORDERING INFORMATION
T
A
PACKAGED DEVICES
(1)
PART NUMBER
(2)
SYMBOL
16-ball, WCSP TPA6141A2YFFR ASBI
–40°C to 85°C
16-ball, WCSP TPA6141A2YFFT ASBI
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) YFF packages are only available taped and reeled. The suffix “R” indicates a reel of 3000, the suffix “T” indicates a reel of 250.
Copyright © 2009, Texas Instruments Incorporated 3
Product Folder Link(s): TPA6141A2