Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLinear ICsLinear IC - Audio amplifier 1-channel (mono) Class AB MSOP 8 PowerPad

GQV,ZQV

DRB

DGN

FEATURES APPLICATIONS

DESCRIPTION

APPLICATIONCIRCUIT

Actual SolutionSize

6,9mm

5,25mm

(1)

O+

O-

GND

ToBattery

Bias

Circuitry

IN-

IN+

InFrom

DAC

SHUTDOWN

AppliestotheGQV/ZQVPackagesOnly

( )

BYPASS

(Optional)

TPA6203A1

www.ti.com

.......................................................................................................................................................... SLOS364F – MARCH 2002 – REVISED JUNE 2008

1.25-W MONO FULLY DIFFERENTIAL AUDIO POWER AMPLIFIER

• Designed for Wireless or Cellular Handsets

• 1.25 W Into 8 Ω From a 5-V Supply at

and PDAs

THD = 1% (Typical)

• Low Supply Current: 1.7 mA Typical

• Shutdown Control < 10 µ A

The TPA6203A1 is a 1.25-W mono fully differential

• Only Five External Components

amplifier designed to drive a speaker with at least

– Improved PSRR (90 dB) and Wide Supply

8- Ω impedance while consuming less than 37 mm

Voltage (2.5 V to 5.5 V) for Direct Battery

(ZQV package option) total printed-circuit board

Operation

(PCB) area in most applications. This device operates

from 2.5 V to 5.5 V, drawing only 1.7 mA of quiescent

– Fully Differential Design Reduces RF

supply current. The TPA6203A1 is available in the

Rectification

space-saving 2 mm x 2 mm MicroStar Junior™ BGA

– Improved CMRR Eliminates Two Input

package, and the space saving 3 mm x 3 mm QFN

Coupling Capacitors

(DRB) package.

– C

(BYPASS)

Is Optional Due to Fully

Features like 85-dB PSRR from 90 Hz to 5 kHz,

Differential Design and High PSRR

improved RF-rectification immunity, and small PCB

• Avaliable in a 2 mm x 2 mm MicroStar

area makes the TPA6203A1 ideal for wireless

Junior ™ BGA Package (GQV, ZQV)

handsets. A fast start-up time of 4 µ s with minimal

pop makes the TPA6203A1 ideal for PDA

• Available in 3 mm x 3 mm QFN Package (DRB)

applications.

• Available in an 8-Pin PowerPAD™ MSOP

(DGN)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2 Junior, PowerPAD, MicroStar Junior are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (29 pages)

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DRB GQV, ZQV TPA6203A1 DGN www.ti.com.......................................................................................................................................................... SLOS364F – MARCH 2002 – REVISED JUNE 2008 1.25-W MONO FULLY DIFFERENTIAL AUDIO POWER AMPLIFIER FEATURES APPLICATIONS • 1.25 W Into 8 Ω From a 5-V Supply at THD = 1% (Typical) • Low Supply Current: 1.
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TPA6203A1 SLOS364F – MARCH 2002 – REVISED JUNE 2008.......................................................................................................................................................... www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.
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TPA6203A1 www.ti.com.......................................................................................................................................................... SLOS364F – MARCH 2002 – REVISED JUNE 2008 ELECTRICAL CHARACTERISTICS TA = 25°C, Gain = 1 V/V PARAMETER TEST CONDITIONS |VOO| Output offset voltage (measured differentially) VI = 0 V, VDD = 2.5 V to 5.5 V PSRR Power supply rejection ratio VDD = 2.5 V to 5.5 V VDD = 3.6 V to 5.5 V, VIC = 0.5 V to VDD-0.8 VDD = 2.5 V, VIC = 0.
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TPA6203A1 SLOS364F – MARCH 2002 – REVISED JUNE 2008.......................................................................................................................................................... www.ti.
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TPA6203A1 www.ti.com..........................................................................................................................................................
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TPA6203A1 SLOS364F – MARCH 2002 – REVISED JUNE 2008.......................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS OUTPUT POWER vs SUPPLY VOLTAGE OUTPUT POWER vs LOAD RESISTANCE 1.8 THD+N = 10% 1 0.8 0.6 THD+N = 1% 0.4 0.4 0 0 3.5 4 4.5 5 VDD = 2.5 V 0.6 0.2 3 VDD = 3.6 V 0.8 0.2 2.5 0.8 VDD = 2.5 V 0.6 0.
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TPA6203A1 www.ti.com.......................................................................................................................................................... SLOS364F – MARCH 2002 – REVISED JUNE 2008 TYPICAL CHARACTERISTICS (continued) 1 0.5 25 mW 0.2 0.1 125 mW 0.05 0.02 500 mW 0.01 0.005 0.002 0.001 20 50 100 200 500 1 k 2 k f - Frequency - Hz 5 k 10 k 20 k 10 5 VDD = 2.5 V CI = 2 µF RL = 8 Ω C(Bypass) = 0 to 1 µF Gain = 1 V/V 2 1 0.5 15 mW 0.2 0.1 75 mW 0.05 0.
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TPA6203A1 SLOS364F – MARCH 2002 – REVISED JUNE 2008.......................................................................................................................................................... www.ti.com TYPICAL CHARACTERISTICS (continued) GSM POWER SUPPLY REJECTION vs FREQUENCY 0 C1 Frequency 217.41 Hz -50 C1 - Duty 20 % -100 C1 Pk-Pk 504 mV VO 2 ms/div -150 VDD Shown in Figure 19 CI = 2 µF, C(Bypass) = 0.47 µF, Inputs ac-Grounded Gain = 1V/V -50 -100 -150 0 200 400 600 800 1k 1.
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TPA6203A1 www.ti.com.......................................................................................................................................................... SLOS364F – MARCH 2002 – REVISED JUNE 2008 APPLICATION INFORMATION FULLY DIFFERENTIAL AMPLIFIER The TPA6203A1 is a fully differential amplifier with differential inputs and outputs. The fully differential amplifier consists of a differential amplifier and a common- mode amplifier.
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TPA6203A1 SLOS364F – MARCH 2002 – REVISED JUNE 2008.......................................................................................................................................................... www.ti.com VDD RF CI IN + RI IN- RI IN+ CI To Battery Cs _ VO+ VO- + RF GND SHUTDOWN Bias Circuitry C(BYPASS) (Optional) Figure 29.
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TPA6203A1 www.ti.com.......................................................................................................................................................... SLOS364F – MARCH 2002 – REVISED JUNE 2008 Input Capacitor (CI) Decoupling Capacitor (CS) The TPA6203A1 does not require input coupling capacitors if using a differential input source that is biased from 0.5 V to VDD - 0.8 V. Use 1% tolerance or better gain-setting resistors if not using input coupling capacitors.
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TPA6203A1 SLOS364F – MARCH 2002 – REVISED JUNE 2008.......................................................................................................................................................... www.ti.com V V (rms) + V Power + O(PP) 2 Ǹ2 2 (rms) R L (4) VDD VO(PP) RL low-frequency performance of the system. This frequency-limiting effect is due to the high pass filter network created with the speaker impedance and the coupling capacitance and is calculated with Equation 5.
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TPA6203A1 www.ti.com.......................................................................................................................................................... SLOS364F – MARCH 2002 – REVISED JUNE 2008 FULLY DIFFERENTIAL AMPLIFIER EFFICIENCY AND THERMAL INFORMATION VO Class-AB amplifiers are inefficient. The primary cause of these inefficiencies is voltage drop across the output stage transistors. There are two components of the internal voltage drop.
PAGE 14
TPA6203A1 SLOS364F – MARCH 2002 – REVISED JUNE 2008.......................................................................................................................................................... www.ti.com Therefore, Θ p h BTL + Ǹ2 PL RL 4V DD (7) Table 2. Efficiency and Maximum Ambient Temperature vs Output Power in 5-V 8-Ω BTL Systems Output Power (W) Efficiency (%) Internal Dissipation (W) Power From Supply (W) Max Ambient Temperature (°C) 0.25 31.4 0.55 0.75 62 0.50 44.4 0.
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TPA6203A1 www.ti.com.......................................................................................................................................................... SLOS364F – MARCH 2002 – REVISED JUNE 2008 0.38 mm 0.25 mm 0.28 mm C1 B1 C2 B2 C3 B3 A1 VIAS to Ground Plane A3 Solder Mask Paste Mask (Stencil) Copper Trace Figure 34.
PAGE 16
TPA6203A1 SLOS364F – MARCH 2002 – REVISED JUNE 2008.......................................................................................................................................................... www.ti.com 8-Pin QFN (DRB) Layout Use the following land pattern for board layout with the 8-pin QFN (DRB) package. Note that the solder paste should use a hatch pattern to fill solder paste at 50% to ensure that there is not too much solder paste under the package. 0.7 mm 0.
PAGE 17
PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PAGE 19
PACKAGE MATERIALS INFORMATION www.ti.com 26-Mar-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPA6203A1DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPA6203A1DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPA6203A1DRBR SON DRB 8 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 26-Mar-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant R JUNI OR *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA6203A1DGNR MSOP-PowerPAD DGN 8 2500 364.0 364.0 27.0 TPA6203A1DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 TPA6203A1DRBR SON DRB 8 3000 367.0 367.0 35.
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MECHANICAL DATA MPBG144C – JUNE 2000 – REVISED FEBRUARY 2002 GQV (S-PBGA-N8) PLASTIC BALL GRID ARRAY 2,10 SQ 1,90 1,00 TYP 0,50 C 1,00 TYP B A 0,50 1 A1 Corner 2 3 Bottom View 0,77 0,71 1,00 MAX Seating Plane 0,35 0,25 ∅ 0,05 M 0,25 0,15 0,08 4201040/E 01/02 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. MicroStar Junior configuration Falls within JEDEC MO-225 MicroStar Junior is a trademark of Texas Instruments.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.