Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLinear ICsLinear IC - Audio amplifier 1-channel (mono) Class AB MSOP 8 PowerPad

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  

SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D Fully Specified for 3.3-V and 5-V Operation

D Wide Power Supply Compatibility

2.5 V − 5.5 V

D Power Supply Rejection at 217 Hz

− 84 dB at V

= 5 V

− 81 dB at V

= 3.3 V

D Output Power for R

= 8 Ω

− 700 mW at V

= 5 V

− 250 mW at V

= 3.3 V

D Ultralow Supply Current in Shutdown

Mode . . . 1.5 nA

D Thermal and Short-Circuit Protection

D Surface-Mount Packaging

− SOIC

− PowerPAD MSOP

− MicroStar Junior (BGA)

description

The TPA751 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications

where internal speakers are required. Operating with a 3.3-V supply, the TPA751 can deliver 250-mW of

continuous power into a BTL 8-Ω load at less than 0.6% THD+N throughout voice band frequencies. Although

this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as

wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the

output in most applications, which is particularly important for small battery-powered equipment. This device

features a shutdown mode for power-sensitive applications with a supply current of 1.5 nA during shutdown.

The TPA751 is available in a 3.0 × 3.0 mm MicroStar Junior (BGA), 8-pin SOIC surface-mount package and

a surface-mount PowerPAD MSOP.

Audio

Input

Bias

Control

700 mW

BYPASS

IN −

SHUTDOWN

−8

GND

From System Control

3 IN+

−

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

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!%"!/  (( &%!%"*

SHUTDOWN

BYPASS

IN+

IN−

−

GND

D OR DGN PACKAGE

(TOP VIEW)

(SIDE VIEW)

MicroStar Juniort (GQS) Package

(TOP VIEW)

SHUTDOWN

−

BYPASS

IN+

IN−

GND

NOTE: The shaded terminals are used for thermal

connections to the ground plane.

(E2)

(E3)

(E4)

(E5)

(A2)

(A3)

(A4)

(A5)

PowerPAD and MicroStar Junior are trademarks of Texas Instruments.

Summary of content (29 pages)

PAGE 1
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 D Fully Specified for 3.3-V and 5-V Operation D Wide Power Supply Compatibility D OR DGN PACKAGE (TOP VIEW) 2.5 V − 5.5 V SHUTDOWN BYPASS IN+ IN− D Power Supply Rejection at 217 Hz D D D D − 84 dB at VDD = 5 V − 81 dB at VDD = 3.3 V Output Power for RL = 8 Ω − 700 mW at VDD = 5 V − 250 mW at VDD = 3.3 V Ultralow Supply Current in Shutdown Mode . . . 1.
PAGE 2
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 AVAILABLE OPTIONS PACKAGED DEVICES MicroStar-Junior (BGA)‡ (GQS) SMALL OUTLINE† (D) MSOP‡ (DGN) TPA751GQS TPA751D TPA751DGN Device Package symbolization TPA751 TPA751 ATC † In the SOIC package, the maximum RMS output power is thermally limited to 350 mW; 700 mW peaks can be driven, as long as the RMS value is less than 350 mW.
PAGE 3
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 recommended operating conditions ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ ÁÁ ÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁÁ MIN MAX 2.5 5.5 Supply voltage, VDD High-level input voltage, VIH, (SHUTDOWN) 0.
PAGE 4
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 PARAMETER MEASUREMENT INFORMATION VDD 6 RF VDD/2 Audio Input RI CI VDD CS 4 IN − 3 IN+ 2 BYPASS VO+ 5 − + RL = 8 Ω CB − VO− 8 + 7 GND VDD 1 SHUTDOWN Bias Control Figure 1.
PAGE 5
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 TYPICAL CHARACTERISTICS SUPPLY RIPPLE REJECTION RATIO vs FREQUENCY SUPPLY CURRENT vs SUPPLY VOLTAGE 1.8 RL = 8 Ω CB = 1 µF Inputs Floating −20 SHUTDOWN = VDD RF = 10 kΩ 1.6 I DD − Supply Current − mA −10 −30 −40 −50 −60 −70 VDD = 3.3 V −80 −100 20 100 1.4 1.2 1 0.8 VDD = 5 V −90 10k 1k 0.6 2.5 20k 3.5 3 f − Frequency − Hz 4 4.5 5 5.
PAGE 6
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 TYPICAL CHARACTERISTICS OUTPUT POWER vs SUPPLY VOLTAGE 1000 THD+N 1% f = 1 kHz PO − Output Power − mW 800 600 RL = 8 Ω RL = 32 Ω 400 200 0 2.5 3 3.5 4 4.5 5 5.5 VDD − Supply Voltage − V Figure 5 OUTPUT POWER vs LOAD RESISTANCE 800 THD+N = 1% f = 1 kHz PO − Output Power − mW 700 600 VDD = 5 V 500 400 300 VDD = 3.
PAGE 7
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 TYPICAL CHARACTERISTICS TOTAL HARMONIC DISTORTION PLUS NOISE vs FREQUENCY TOTAL HARMONIC DISTORTION PLUS NOISE vs FREQUENCY 10 THD+N −Total Harmonic Distortion + Noise − % THD+N −Total Harmonic Distortion + Noise − % 10 VDD = 3.3 V PO = 250 mW RL = 8 Ω AV = −20 V/V 1 AV =− 10 V/V AV = −2 V/V 0.1 0.01 20 100 1k 10k VDD = 3.3 V RL = 8 Ω AV = −2 V/V PO = 50 mW 1 0.
PAGE 8
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 TYPICAL CHARACTERISTICS TOTAL HARMONIC DISTORTION PLUS NOISE vs FREQUENCY TOTAL HARMONIC DISTORTION PLUS NOISE vs FREQUENCY 10 VDD = 5 V PO = 700 mW RL = 8 Ω THD+N −Total Harmonic Distortion + Noise − % THD+N −Total Harmonic Distortion + Noise − % 10 AV = −20 V/V 1 AV = −10 V/V AV = −2 V/V 0.1 0.01 20 100 1k 10k 20k VDD = 5 V RL = 8 Ω AV = −2 V/V 1 PO = 700 mW 0.
PAGE 9
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 TYPICAL CHARACTERISTICS OPEN-LOOP GAIN AND PHASE vs FREQUENCY 80 180° VDD = 3.
PAGE 10
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 TYPICAL CHARACTERISTICS CLOSED-LOOP GAIN AND PHASE vs FREQUENCY 1 180° Phase 0.75 170° 0.25 0 160° Gain −0.25 150° −0.5 −0.75 140° −1 −1.25 −1.5 Phase Closed-Loop Gain − dB 0.5 VDD = 3.3 V RL = 8 Ω PO = 250 mW 130° −1.75 −2 101 102 103 104 105 106 120° f − Frequency − Hz Figure 17 CLOSED-LOOP GAIN AND PHASE vs FREQUENCY 1 180° Phase 0.75 170° 0.25 0 160° Gain −0.
PAGE 11
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 TYPICAL CHARACTERISTICS OUTPUT NOISE VOLTAGE vs FREQUENCY 100 VDD = 3.
PAGE 12
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 APPLICATION INFORMATION bridged-tied load Figure 23 shows a linear audio power amplifier (APA) in a BTL configuration. The TPA751 BTL amplifier consists of two linear amplifiers driving both ends of the load. There are several potential benefits to this differential drive configuration, but initially consider power to the load.
PAGE 13
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 APPLICATION INFORMATION bridged-tied load (continued) For example, a 68-µF capacitor with an 8-Ω speaker would attenuate low frequencies below 293 Hz. The BTL configuration cancels the dc offsets, which eliminates the need for the blocking capacitors. Low-frequency performance is then limited only by the input network and speaker response.
PAGE 14
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 APPLICATION INFORMATION BTL amplifier efficiency (continued) Although the voltages and currents for SE and BTL are sinusoidal in the load, currents from the supply are very different between SE and BTL configurations. In an SE application, the current waveform is a half-wave rectified shape, whereas in BTL it is a full-wave rectified waveform. This means RMS conversion factors are different.
PAGE 15
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 APPLICATION INFORMATION application schematics Figure 26 is a schematic diagram of a typical handheld audio application circuit, configured for a gain of −10 V/V. VDD 6 RF 50 kΩ Audio Input RI 10 kΩ CI 4 IN − 3 IN+ 2 BYPASS VDD CS 1 µF VDD/2 − VO+ 5 + CB 2.2 µF − VO− 8 + 700 mW 7 GND 1 From System Control SHUTDOWN Bias Control Figure 26.
PAGE 16
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 APPLICATION INFORMATION application schematics (continued) It is important to note that using the additional RF resistor connected between IN+ and BYPASS causes VDD/2 to shift slightly, which could influence the THD+N performance of the amplifier.
PAGE 17
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 APPLICATION INFORMATION input capacitor, CI In the typical application an input capacitor, CI, is required to allow the amplifier to bias the input signal to the proper dc level for optimum operation. In this case, CI and RI form a high-pass filter with the corner frequency determined in equation 8.
PAGE 18
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 APPLICATION INFORMATION midrail bypass capacitor, CB The midrail bypass capacitor, CB, is the most critical capacitor and serves several important functions. During start-up or recovery from shutdown mode, CB determines the rate at which the amplifier starts up. The second function is to reduce noise produced by the power supply caused by coupling into the output drive signal.
PAGE 19
SLOS336C − DECEMBER 2000 − REVISED OCTOBER 2002 APPLICATION INFORMATION headroom and thermal considerations Linear power amplifiers dissipate a significant amount of heat in the package under normal operating conditions. A typical music CD requires 12 dB to 15 dB of dynamic headroom to pass the loudest portions without distortion as compared with the average power output.
PAGE 20
PACKAGE OPTION ADDENDUM www.ti.
PAGE 21
PACKAGE OPTION ADDENDUM www.ti.com (4) 24-Jan-2013 Only one of markings shown within the brackets will appear on the physical device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information.
PAGE 22
PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPA751DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPA751DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.
PAGE 23
PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPA751DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 TPA751DR SOIC D 8 2500 340.5 338.1 20.
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