Datasheet

N.C. – Not internally connected
DRS PACKAGE
(TOP VIEW)
GND
V
CC
N.C.
IO1
IO2
N.C.
GND
4
5
6
3
2
1
DRY PACKAGE
(TOP VIEW)
IO1
N.C. N.C.
IO2
GND
V
CC
3
2
6
5
4
1
GND
V
CC
N.C.
DRL PACKAGE
(TOP VIEW)
IO1
IO2
2
3
4
5
1
IO2
GND
DZD PACKAGE
(TOP VIEW)
IO1
V
CC
2
3
4
1
TPD2E001
www.ti.com
SLLS684H JULY 2006REVISED AUGUST 2014
5 Pin Configuration and Functions
Pin Functions
DRY DRL DRS DZD
NAME FUNCTION
NO. NO. NO. NO.
3, 6 3, 5 3, 6 2, 3 IOx ESD-protected channel
4 4 4 1 GND Ground
1 1 1 4 V
CC
Power-supply input. Bypass V
CC
to GND with a 0.1-μF ceramic capacitor.
2, 5 2 2, 5 N.C. No connection. Not internally connected.
EP EP Exposed pad. Connect to GND.
6 Specifications
6.1 Absolute Maximum Ratings
(1)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Power Pin Voltage –0.3 7 V
V
IO
IO Pin Voltage –0.3 V
CC
+ 0.3 V
T
J
Junction temperature 150 °C
Infrared (15 s) 220
Bump temperature (soldering) °C
Vapor phase (60 s) 215
Lead temperature (soldering, 10 s) 300 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the
specifications is not implied. Exposure to absolute-maximum-rating conditions for extended periods may affect device reliability.
6.2 Handling Ratings
MIN MAX UNIT
T
stg
Storage temperature range –65 150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all
–15 15
pins
(1)
Charged device model (CDM), per JEDEC specification
–1 1
V
(ESD)
Electrostatic discharge kV
JESD22-C101, all pins
(2)
IEC 61000-4-2 Contact -8 8
IEC 61000-4-2 Air-Gap Discharge -15 15
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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