Datasheet

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SLVS401 − AUGUST 2001
    
     
1
www.ti.com
FEATURES
D
Complete Power Management Solution for
USB Bus-Powered Hubs
D 3.3-V 200 mA Low-Dropout Voltage Regulator
D Two 5-V 340-m (Typ) High-Side MOSFETs
D Independent Thermal- and Short-Circuit
Protection for LDO and Each Switch
D Overcurrent Indicator With Transient Filter
D 2.9-V to 5.5-V Operating Range
D CMOS- and TTL-Compatible Enable Inputs
D 75-µA (Typ) Supply Current
D Available in 8-Pin MSOP (PowerPAD)
D −40°C to 85°C Ambient Temperature Range
APPLICATIONS
D
USB Bus-Powered Hubs
− Keyboards
− Monitors
− Hub Boxes
DESCRIPTION
The TPS2149 incorporates two power distribution
switches and an LDO in one small package, providing
a USB bus-powered hub power management solution
that saves up to 60% in board space over typical
implementations.
The TPS2149 meets USB 2.0 bus-powered hub
requirements. An integrated LDO regulates the 5-V bus
power down to 3.3 V for the USB controller. The two
MOSFET switches provide power to the downstream
ports. With independent enables, the downstream ports
remain unpowered until the hub completes
enumeration.
Each power-distribution switch is capable of supplying
200 mA of continuous current, and the independent
logic enables are compatible with 5-V logic and 3-V
logic. The switches and the LDO are designed with
controlled rise times and fall times to minimize current
surges.
The TPS2149 has active-low enables while the
TPS2159 has active-high enables.
LDO and dual switch family selection guide and schematics
LDO
LDO_OUT
LDO_ADJ
OC1
OUT1
OUT2
OC2
V
IN/SW1
L
DO_EN
EN1
SW2
EN2
GND
TPS2145/55
TSSOP−14
LDO
LDO_OUT
OC1
OUT1
OUT2
OC2
VIN/SW1
EN1
SW2
EN2
GND
TPS2147/57
MSOP−10
LDO
LDO_OUT
OUT2
OUT1
V
IN/SW1
EN2
EN1
GND
TPS2148/58
MSOP−8
LDO_EN
LDO
LDO_OU
T
OUT1
OUT2
OC
VIN
EN1
EN2
GND
TPS2149/59
MSOP−8
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PowerPAD is a trademark of Texas Instruments.
Copyright 2001, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

Summary of content (23 pages)