Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - ELCs High side TSSOP 20

RGP PW PWP DAP

AUXIN

3.3VIN

1.5VIN

AUXOUT

3.3VOUT

1.5VOUT

PERST

CPPE

CPUSB

SHDN

STBY

SYSRST

TPS2231

Host Connector

ExpressCard Connector

GND RCLKEN

REFCLK+

REFCLK−

Express Card

Host

Power

Source

Host

Chip

Set/Lock

Circuits

TPS2231

TPS2236

www.ti.com

.................................................................................................................................................. SLVS536J –JULY 2004–REVISED SEPTEMBER 2009

ExpressCard™ POWER INTERFACE SWITCH

Check for Samples: TPS2231 TPS2236

FEATURES

• Available in a 20-pin TSSOP, a 20-pin QFN, or

24-pin PowerPAD™ HTSSOP (Single)

• Meets the ExpressCard™ Standard

(ExpressCard|34 or ExpressCard|54) • Available in a 32-pin PowerPAD™ HTSSOP

(Dual)

• Compliant with the ExpressCard™

Compliance Checklists

APPLICATIONS

• Fully Satisfies the ExpressCard™

• Notebook Computers

Implementation Guidelines

• Desktop Computers

• Supports Systems with WAKE Function

• Personal Digital Assistants (PDAs)

• TTL-Logic Compatible Inputs

• Digital Cameras

• Short Circuit and Thermal Protection

• TV and Set Top Boxes

• –40°C to 85°C Ambient Operating

Temperature Range

DESCRIPTION

The TPS2231 and TPS2236 ExpressCard power interface switches provide the total power management solution

required by the ExpressCard specification. The TPS2231 and TPS2236 ExpressCard power interface switches

distribute 3.3 V, AUX, and 1.5 V to the ExpressCard socket. Each voltage rail is protected with integrated

current-limiting circuitry.

The TPS2231 supports systems with single-slot ExpressCard|34 or ExpressCard|54 sockets. The TPS2236

supports systems with dual-slot ExpressCard sockets.

End equipment for the TPS2231 and TPS2236 include notebook computers, desktop computers, personal digital

assistants (PDAs), and digital cameras.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2PowerPAD is a trademark of Texas Instruments.

3ExpressCard is a trademark of Personal Computer Memory Card International Association.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (42 pages)

PAGE 1
RGP PW PWP TPS2231 TPS2236 DAP www.ti.com..................................................................................................................................................
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TPS2231 TPS2236 SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009.................................................................................................................................................. www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
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TPS2231 TPS2236 www.ti.com.................................................................................................................................................. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 DISSIPATION RATINGS (Thermal Resistance = °C/W) PACKAGE TA ≤ 25°C POWER RATING PW (20) (1) 704.2 mW 7.41 mW/°C 370.6 mW 259.5 mW PWP (24) (1) 3153 mW 33.19 mW/°C 1659.5 mW 1161.
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TPS2231 TPS2236 SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009.................................................................................................................................................. www.ti.com ELECTRICAL CHARACTERISTICS (continued) TJ = 25°C, VI(3.3VIN) = VI(AUXIN) = 3.3 V, VI(1.5VIN) = 1.5 V, VI(/SHDNx), VI(/STBYx) = 3.3 V, VI(/CPPEx) = VI(/CPUSBx) = 0 V, VI(/SYSRST) = 3.
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TPS2231 TPS2236 www.ti.com.................................................................................................................................................. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 ELECTRICAL CHARACTERISTICS (continued) TJ = 25°C, VI(3.3VIN) = VI(AUXIN) = 3.3 V, VI(1.5VIN) = 1.5 V, VI(/SHDNx), VI(/STBYx) = 3.3 V, VI(/CPPEx) = VI(/CPUSBx) = 0 V, VI(/SYSRST) = 3.
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TPS2231 TPS2236 SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009.................................................................................................................................................. www.ti.com SWITCHING CHARACTERISTICS TJ = 25°C, VI(3.3VIN) = VI(AUXIN) = 3.3 V, VI(1.5VIN) = 1.5 V, VI(/SHDNx), VI(/STBYx) = 3.3 V, VI(/CPPEx) = VI(/CPUSBx) = 0 V, VI(/SYSRST) = 3.
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TPS2231 TPS2236 www.ti.com.................................................................................................................................................. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 PIN ASSIGNMENTS TPS2231 PW PACKAGE (TOP VIEW) SYSRST SHDN STBY 3.3VIN 3.3VIN 3.3VOUT 3.3VOUT PERST NC GND TPS2231 PWP PACKAGE (TOP VIEW) 20 19 18 17 16 15 14 13 12 11 1 2 3 4 5 6 7 8 9 10 OC RCLKEN AUXIN AUXOUT 1.5VIN 1.5VIN 1.5VOUT 1.5VOUT CPPE CPUSB NC SYSRST SHDN STBY 3.3VIN 3.
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TPS2231 TPS2236 SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009.................................................................................................................................................. www.ti.com TERMINAL FUNCTIONS TERMINAL TPS2231 NAME PW PWP NAME RGP NO. I/O DESCRIPTION DAP 3.3VIN 4, 5 5, 6 2 3.3VIN 8, 9 I 3.3-V input for 3.3VOUT 1.5VIN 15, 16 18, 19 12 1.5VIN 24, 25 I 1.5-V input for 1.
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TPS2231 TPS2236 www.ti.com.................................................................................................................................................. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 FUNCTIONAL BLOCK DIAGRAM Single ExpressCard Power Switch 3.3VIN PG S1 (Note A) AUXIN 3.3VOUT CS (Note B) PG S4 CS AUXOUT S2 S5 1.5VIN PG 1.
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TPS2231 TPS2236 SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009.................................................................................................................................................. www.ti.com Dual ExpressCard Power Switch 3.3VIN S1 PG1 CS 3.3VOUT1 S4 PG1 AUXIN CS AUXOUT1 S2 S5 1.5VIN S3 PG1 1.5 VOUT1 CS S6 PG2 CS 3.3VOUT2 S7 S10 PG2 CS AUXOUT2 S8 S11 PG2 CS 1.
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TPS2231 TPS2236 www.ti.com.................................................................................................................................................. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 DETAILED PIN DESCRIPTIONS CPPE A logic low level on this input indicates that the card present supports PCI Express functions. CPPE connects to the AUXIN input through an internal pullup.
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TPS2231 TPS2236 SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009.................................................................................................................................................. www.ti.com SYSRST This input is driven by the host system and directly affects PERST. Asserting SYSRST (logic low) forces PERST to assert. RCLKEN is not affected by the assertion of SYSRST. SYSRST has an internal pullup connected to AUXIN. OC This pin is an open-drain output.
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TPS2231 TPS2236 www.ti.com.................................................................................................................................................. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 POWER STATES If AUXIN is not present, then all input-to-output power switches are kept off (OFF mode). If AUXIN is present and SHDN is asserted (logic low), then all input-to-output power switches are kept off and the output discharge FETs are turned on (Shutdown mode).
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TPS2231 TPS2236 SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009.................................................................................................................................................. www.ti.com PARAMETER MEASUREMENT INFORMATION VIN IO(3.3VOUT/AUXOUT) RL CL VIN IO(1.5VOUT) RL CL LOAD CIRCUIT LOAD CIRCUIT VOLTAGE WAVEFORMS VIN VI(3.3V/AUXIN) 50% VIN VI(1.5V) 50% GND GND tpd(off) tpd(on) VO(3.3VOUT/AUXOUT) tpd(off) tpd(on) VI(3.3V) 90% 10% tf tr VI(3.
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TPS2231 TPS2236 www.ti.com.................................................................................................................................................. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 OUTPUT VOLTAGE WHEN CARD IS INSERTED vs TIME RCLKEN AND PERST VOLTAGE DURING POWER UP vs TIME VI(CPxx) 2 V/div VO(3.3VOUT) 2 V/div VO(3.3VOUT) 2 V/div 2 V/div VO(RCLKEN) 2 V/div VO(AUXOUT) 2 V/div VO(PERST) 2 V/div VO(1.5VOUT) t − Time − 5 ms/div t − Time − 1 ms/div Figure 2.
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TPS2231 TPS2236 SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009.................................................................................................................................................. www.ti.com PERST DE-ASSERTED BY SYSRST WHEN POWER IS ON vs TIME OUTPUT VOLTAGE WHEN 3.3VIN IS REMOVED vs TIME VI(3.3VIN) 2 V/div VI(SYSRST) 2 V/div VO(3.3VOUT) 2 V/div VO(1.5VOUT) 2 V/div VO(PERST) 2 V/div VO(AUXOUT) 2 V/div RL(3.3VOUT) = 3.6 W RL(1.5VOUT) = 2.7 W RL(AUXOUT) = 12 W CL(3.3V/1.
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TPS2231 TPS2236 www.ti.com.................................................................................................................................................. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 SUPPLY CURRENT OF AUXIN vs JUNCTION TEMPERATURE STATIC DRAIN-SOURCE ON-STATE RESISTANCE vs JUNCTION TEMPERATURE 180 250 AUXIN + CPxx 150 AUXIN 50 On−State Resistance − m Ω rDS(on) − Static Drain-Source ICC − Supply Current − µ A 200 100 3.
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TPS2231 TPS2236 SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009.................................................................................................................................................. www.ti.com AUX POWER SWITCH CURRENT LIMIT vs JUNCTION TEMPERATURE 3.3-V POWER SWITCH CURRENT LIMIT TRIP vs JUNCTION TEMPERATURE 500 3.20 490 3.10 Current Limit Trip Threshold − A 480 Current Limit − mA 470 460 450 440 430 420 410 3 2.90 2.80 2.70 2.
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TPS2231 TPS2236 www.ti.com.................................................................................................................................................. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 APPLICATION INFORMATION INTRODUCTION TO ExpressCard An ExpressCard module is an add-in card with a serial interface based on PCI Express and/or Universal Serial Bus (USB) technologies. An ExpressCard comes in two form factors defined as ExpressCard|34 or ExpressCard|54.
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TPS2231 TPS2236 SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009.................................................................................................................................................. www.ti.com EXPRESS CARD TIMING DIAGRAMS Host Power (AUXIN, 3.3VIN, and 1.5VIN) SYSRST CPxx a Card Power (AUXIN, 3.3VOUT, and 1.
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TPS2231 TPS2236 www.ti.com.................................................................................................................................................. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 Host Power (AUXIN) Host Power (3.3VIN and 1.5VIN) SYSRST CPxx Card Power (AUXIN, 3.3VOUT, and 1.5VOUT) RCLKEN PERST REFCLK (Either Tri-Stated or Off) Note: Once 3.3 V and 1.5 V are applied, the power switch follows the power-up sequence of Figure 18 or Figure 19. Figure 20.
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TPS2231 TPS2236 SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009.................................................................................................................................................. www.ti.com Host Power (AUXIN, 3.3VIN, and 1.5VIN) e SHDN CPxx f Card Power (AUXOUT, 3.3VOUT, and 1.5VOUT) RCLKEN a d Tpd PERST a b c d e f f c REFCLK Min Max Units Load Dependent System Dependent 500 500 System Dependent System Dependent ns ns Figure 22.
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TPS2231 TPS2236 www.ti.com.................................................................................................................................................. SLVS536J – JULY 2004 – REVISED SEPTEMBER 2009 REVISION HISTORY NOTE: Page numbers in the latest revision may differ from previous versions. Changes from Revision F (August 2007) to Revision G ................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) Multiple Top-Side Markings will be inside parentheses.
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PACKAGE MATERIALS INFORMATION www.ti.com 17-Oct-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS2231MRGPR QFN RGP 20 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q2 TPS2231MRGPR-1 QFN RGP 20 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.0 Q3 TPS2231MRGPR-2 QFN RGP 20 3000 330.0 12.4 4.25 4.25 1.15 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 17-Oct-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS2231MRGPR QFN RGP 20 3000 367.0 367.0 35.0 TPS2231MRGPR-1 QFN RGP 20 3000 367.0 367.0 35.0 TPS2231MRGPR-2 QFN RGP 20 3000 367.0 367.0 35.0 TPS2231MRGPR-3 QFN RGP 20 3000 367.0 367.0 35.0 TPS2231MRGPT QFN RGP 20 250 210.0 185.0 35.0 TPS2231MRGPT-1 QFN RGP 20 250 210.0 185.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.