Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - ELCs High side XFBGA 4

Bump View

Laser Marking View

TPS22903

TPS22904

www.ti.com

SLVS827C –FEBRUARY 2009–REVISED APRIL 2010

ULTRA-SMALL LOW-INPUT-VOLTAGE LOW r

LOAD SWITCH

Check for Samples: TPS22903, TPS22904

FEATURES

APPLICATIONS

• PDAs

• Input Voltage: 1.1 V to 3.6 V

• Cell Phones

• Ultra-Low ON-State Resistance

• GPS Devices

– r

= 66 mΩ at V

= 3.6 V

• MP3 Players

– r

= 75 mΩ at V

= 2.5 V

• Digital Cameras

– r

= 90 mΩ at V

= 1.8 V

• Peripheral Ports

– r

= 135 mΩ at V

= 1.2 V

• Portable Instrumentation

• 500-mA Maximum Continuous Switch Current

YFP PACKAGE

• Quiescent Current < 1 mA

• Shutdown Current < 1 mA

• Low Control Input Threshold Enables Use of

1.2-V/1.8-V/2.5-V/3.3-V Logic

• Controlled Slew Rate (5 ms Max at 3.6 V)

• Quick Output Discharge (TPS22904 Only)

• ESD Performance Tested Per JESD 22

TERMINAL ASSIGNMENTS

– 2000-V Human-Body Model

B GND ON

(A114-B, Class II)

A V

OUT

– 1000-V Charged-Device Model (C101)

2 1

• 4-Terminal Wafer Chip-Scale Package (WCSP)

– 0.8 mm × 0.8 mm,

0.4-mm Pitch, 0.5-mm Height

DESCRIPTION

The TPS22903 and TPS22904 are ultra-small, low r

single channel load switches with controlled turn on. The

device contains a P-channel MOSFET that can operate over an input voltage range of 1.1 V to 3.6 V. The switch

is controlled by an on/off input (ON), which is capable of interfacing directly with low-voltage control signals. In

TPS22904, a 85-Ω on-chip load resistor is added for output quick discharge when switch is turned off.

TPS22903 and TPS22904 are available in a space-saving 4-terminal WCSP 0.4-mm pitch (YFP). The devices

are characterized for operation over the free-air temperature range of –40°C to 85°C.

FEATURE LIST

MAXIMUM

TYPICAL SLEW RATE QUICK OUTPUT

DEVICE OUTPUT ENABLE

AT 3.6 V AT 3.6 V DISCHARGE

(1)

CURRENT

TPS22903 66 mΩ 5 ms max No 500 mA Active high

TPS22904 66 mΩ 5 ms max Yes 500 mA Active high

(1) This feature discharges the output of the switch to ground through a 85-Ω resistor, preventing the

output from floating.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (18 pages)

PAGE 1
TPS22903 TPS22904 www.ti.com SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010 ULTRA-SMALL LOW-INPUT-VOLTAGE LOW rON LOAD SWITCH Check for Samples: TPS22903, TPS22904 FEATURES APPLICATIONS • • • • • • • • • 1 • • • • • • • • Input Voltage: 1.1 V to 3.6 V Ultra-Low ON-State Resistance – rON = 66 mΩ at VIN = 3.6 V – rON = 75 mΩ at VIN = 2.5 V – rON = 90 mΩ at VIN = 1.8 V – rON = 135 mΩ at VIN = 1.
PAGE 2
TPS22903 TPS22904 SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010 www.ti.com ORDERING INFORMATION (1) PACKAGE (2) TA –40°C to 85°C (1) (2) (3) ORDERABLE PART NUMBER WCSP – YFP (0.4-mm pitch) Tape and reel TOP-SIDE MARKING (3) TPS22903YFPR _ _ _4P_ TPS22904YFPR _ _ _4R_ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.
PAGE 3
TPS22903 TPS22904 www.ti.com SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010 ABSOLUTE MAXIMUM RATINGS (1) VIN Input voltage range VOUT Output voltage range VON Input voltage range PD Power dissipation at TA = 25°C IMAX Maximum continuous switch current TA Operating free-air temperature range Tstg Storage temperature range Tlead Maximum lead temperature (10-s soldering time) ESD (1) MIN MAX –0.3 4 V VIN + 0.3 V 4 V 0.48 W –0.3 Electrostatic discharge protection UNIT 0.
PAGE 4
TPS22903 TPS22904 SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010 www.ti.com ELECTRICAL CHARACTERISTICS VIN = 1.1 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS TA MIN TYP (1) MAX UNIT IIN Quiescent current IOUT = 0, VIN = VON Full 1 mA IIN(OFF) OFF-state supply current VON = GND, OUT = Open Full 1 mA IIN(LEAKAGE) OFF-state switch current VON = GND, VOUT = 0 Full 1 mA 25°C VIN = 3.
PAGE 5
TPS22903 TPS22904 www.ti.com SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010 TYPICAL CHARACTERISTICS 1.0 0.9 0.8 ON-State Resistance, rON (Ω) 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0.0 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 Input Voltage, VIN (V) Figure 2. rON vs VIN 100 90 80 W Voltage Drop (mV) 70 Vdrop = 1.0 V 60 Vdrop = 1.2 V 50 Vdrop = 1.8 V Vdrop = 2.5 V 40 Vdrop = 3.3 V 30 20 10 0 0.00 0.05 0.
PAGE 6
TPS22903 TPS22904 SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) 250 200 180 200 Quiescent Current, IIN (nA) Quiescent Current, IIN (nA) 160 140 150 120 100 100 80 60 50 40 20 0 0.5 0 1.0 1.5 2.0 2.5 3.0 Input Voltage, VIN(V) 3.5 –40 4.0 Figure 5. Quiescent Current vs VIN (VON = VIN, IOUT = 0) 25 Temperature(°C) 85 Figure 6. Quiescent Current vs Temperature (VIN = 3.
PAGE 7
TPS22903 TPS22904 www.ti.com SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010 TYPICAL CHARACTERISTICS (continued) 250 120 225 200 IIN (Leakage) Current (nA) IIN (Leakage) Current (nA) 100 80 60 40 175 150 125 100 75 50 20 25 0 0.5 0 1.0 1.5 2.0 2.5 3.0 3.5 –40 4.0 25 85 Temperature (°C) Input Voltage, VIN (V) Figure 9. IIN(Leakage) vs VIN (IOUT = 0) Figure 10. IIN (Leakage) vs Temperature (VIN = 3.3 V) 4.0 VIN = 3.6 V 3.5 VIN = 3.3 V 3.0 VIN = 3 V VIN = 2.5 V VOUT (V) 2.5 2.
PAGE 8
TPS22903 TPS22904 SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) 7 6.0 5.5 tfall 6 tOFF 5.0 4.5 5 tON/tOFF (ms) tIrise /tfall (ms) 4.0 4 CL = 0.1 µF IL = 100 mA 3 3.5 3.0 CL = 0.1 µF IL = 100 mA 2.5 2.0 2 1.5 1 tON 1.0 trise 0.5 0.0 –40 0 –40 –20 0 20 40 60 80 100 –20 0 20 40 60 80 Temperature (°C) Temperature (°C) Figure 12. trise (TPS22903/4) / tfall (TPS22903) vs Temperature (VIN = 3.3 V) Figure 13.
PAGE 9
TPS22903 TPS22904 www.ti.com SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010 TYPICAL CHARACTERISTICS (continued) VON 200 mV/DIV VON 200 mV/DIV CL= 0.1 mF IOUT = 100 mA VIN = 1.2 V IOUT 20 mA/DIV CL= 10 mF IOUT = 100 mA VIN = 1.2 V IOUT 20 mA/DIV 5 ms/DIV 20 ms/DIV Figure 16. tON Response Figure 17. tON Response VON 200 mV/DIV VON 200 mV/DIV CL= 0.1 mF IOUT = 100 mA VIN = 3.3 V IOUT 20 mA/DIV CL= 10 mF IOUT = 100 mA VIN = 3.3 V IOUT 20 mA/DIV 5 ms/DIV 20 ms/DIV Figure 18.
PAGE 10
TPS22903 TPS22904 SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) CL= 0.1 mF IOUT = 100 mA VIN = 3.3 V CL= 10 mF IOUT = 100 mA VIN = 3.3 V VON 200 mV/DIV VON 200 mV/DIV IOUT 20 mA/DIV IOUT 20 mA/DIV 5 ms/DIV 200 ms/DIV Figure 22. tOFF Response (TPS22903) Figure 23. tOFF Response (TPS22903) VON 200 mV/DIV VON 200 mV/DIV IOUT 20 mA/DIV IOUT 20 mA/DIV CL= 0.1 mF IOUT = 100 mA VIN = 3.3 V CL= 0.1 mF IOUT = 100 mA VIN = 1.
PAGE 11
TPS22903 TPS22904 www.ti.com SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010 PARAMETER MEASUREMENT INFORMATION VIN ON VOUT (A) RL CL + – TPS22903 OFF CIN =10 x CL GND GND GND TEST CIRCUIT 1.8 V VON VON VON/2 VON/2 tr 0V tON tOFF VOUT/2 VOUT/2 90% VOUT VOH VOUT tf 0V 10% 90% 10% VOL tON/tOFF WAVEFORMS A. trise and tfall of the control signal is 100 ns. Figure 28.
PAGE 12
TPS22903 TPS22904 SLVS827C – FEBRUARY 2009 – REVISED APRIL 2010 www.ti.com APPLICATION INFORMATION ON/OFF Control The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state as there is no fault. ON is active-high and has a low threshold, making it capable of interfacing with low-voltage signals. The ON pin is compatible with standard GPIO logic thresholds. It can be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V, or 3.3-V GPIOs.
PAGE 13
PACKAGE OPTION ADDENDUM www.ti.
PAGE 14
PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PAGE 15
PACKAGE MATERIALS INFORMATION www.ti.com 12-Nov-2010 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) TPS22903YFPR DSBGA YFP 4 3000 180.0 8.4 TPS22904YFPR DSBGA YFP 4 3000 180.0 TPS22904YFPT DSBGA YFP 4 250 180.0 0.89 0.89 0.58 4.0 8.0 Q1 8.4 0.89 0.89 0.58 4.0 8.0 Q1 8.4 0.89 0.89 0.58 4.0 8.
PAGE 16
PACKAGE MATERIALS INFORMATION www.ti.com 12-Nov-2010 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS22903YFPR DSBGA YFP 4 3000 220.0 220.0 34.0 TPS22904YFPR DSBGA YFP 4 3000 220.0 220.0 34.0 TPS22904YFPT DSBGA YFP 4 250 220.0 220.0 34.
PAGE 17
D: Max = 0.79 mm, Min = 0.73 mm E: Max = 0.79 mm, Min = 0.
PAGE 18
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.