Datasheet
YFP, YZP, AND YZTPACKAGES
LaserMarkingView
BumpView
C
B
2 1
A
C
B
1 2
A
TPS22921, TPS22922, TPS22922B
www.ti.com
SLVS749B –NOVEMBER 2008–REVISED MAY 2013
LOW INPUT VOLTAGE, ULTRA-LOW r
ON
LOAD SWITCHES
Check for Samples: TPS22921, TPS22922, TPS22922B
1
FEATURES
APPLICATIONS
• Input Voltage: 0.9 V to 3.6 V • PDAs
• Ultra-Low ON Resistance (Typical Values) • Cell Phones
– r
ON
= 14 mΩ at V
IN
= 3.6 V • GPS Devices
– r
ON
= 20 mΩ at V
IN
= 2.5 V • MP3 Players
– r
ON
= 33 mΩ at V
IN
= 1.8 V • Peripheral Ports
– r
ON
= 67 mΩ at V
IN
= 1.2 V • Portable Media Players
– r
ON
= 116 mΩ at V
IN
= 1.0 V • RF Modules
• 2-A Maximum Continuous Switch Current
DESCRIPTION
• Ultra-Low Quiescent Current:
TPS22921, TPS22922, and TPS22922B are ultra-low
– Typical 78 nA at 1.8 V
r
ON
load switches with controlled turn on.
• Ultra-Low Shutdown Current:
TPS22921/2/2B contain an ultra-low r
ON
P-channel
MOSFET that can operate over an input voltage
– Typical 35 nA at 1.8 V
range of 0.9 V to 3.6 V. The switch is controlled by an
• Low Threshold Control Input Enable the use of
on/off input (ON), which is capable of interfacing
1.2 V, 1.8 V, 2.5 V, or 3.3 V Logic
directly with low-voltage control signals. In TPS22922
• Controlled Slew Rate to Avoid Inrush Currents
and in TPS22922B, a 120-Ω on-chip load resistor is
added for output quick discharge when switch is
• Typical Rise Times at V
IN
= 1.8 V
turned off. The rise time (slew rate) of the device is
– TPS22921 and TPS22922: 30 μs
internally controlled in order to avoid inrush current:
– TPS22922B: 200 μs
TPS22921 and TPS22922 feature a 30 μs rise time
whereas TPS22922B is 200 μs.
• ESD Performance Tested Per JESD 22
– 3000-V Human-Body Model
TPS22921, TPS22922, and TPS22922B feature ultra-
(A114-B, Class II)
low quiescent and shutdown current and are available
in space-saving 6-terminals wafer-chip-scale
– 1000-V Charged-Device Model (C101)
packages (WCSP: YZP and YZT with 0.5-mm pitch
• Six Terminal Wafer-Chip-Scale Package
and YFP with 0.4-mm pitch) which make them ideal
(nominal dimensions shown - see addendum
for portable electronics. The devices are
for details)
characterized for operation over the free-air
temperature range of –40°C to 85°C.
– 0.9 mm × 1.4 mm, 0.5-mm Pitch,
0.5-mm Height (YZP)
– 0.9 mm × 1.4 mm, 0.5-mm Pitch,
0.625-mm Height (YZT)
– 0.8 mm × 1.2 mm, 0.4-mm Pitch,
0.5-mm Height (YFP)
TERMINAL ASSIGNMENTS
C ON GND
B V
IN
V
OUT
A V
IN
V
OUT
2 1
1
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Copyright © 2008–2013, Texas Instruments Incorporated
PRODUCTION DATA information current as of publication date.
Products conform to specifications per the terms of Texas
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