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TPS22932B

www.ti.com

SLVS802B –AUGUST 2009–REVISED AUGUST 2013

LOW INPUT VOLTAGE, ULTRA-LOW r

LOAD SWITCH

WITH CONFIGURABLE ENABLE LOGIC AND CONTROLLED SLEW-RATE

Check for Samples: TPS22932B

FEATURES

APPLICATIONS

• Input Voltage: 1.1 V to 3.6 V • PDAs

• Ultra-Low ON Resistance • Cell Phones

– r

= 55 mΩ at V

= 3.6 V • GPS Devices

– r

= 65 mΩ at V

= 2.5 V • MP3 Players

– r

= 75 mΩ at V

= 1.8 V • Digital Cameras

– r

= 115 mΩ at V

= 1.2 V • Peripheral Ports

• 500-mA Maximum Continuous Switch Current • Portable Instrumentation

• Quiescent Current < 1 μA

DESCRIPTION

• Shutdown Current < 1 μA

TPS22932B is a low r

load switch with controlled

• Low Control Threshold Allows Use of 1.2-

turn on. It contains an ultra-low r

P-channel

V/1.8-V/2.5-V/3.3-V Logic

MOSFET that can operate over an input voltage

• Configurable Enable Logic

range of 1.1 V to 3.6 V.

• Controlled Slew Rate to Avoid Inrush

The switch is controlled by eight patterns of 3-bit

Currents: 165 μs at 1.8 V

input. The user can choose the logic functions MUX,

AND, OR, NAND, NOR, inverter, and non-inverter. All

• ESD Performance Tested Per JESD 22

inputs can be connected to V

or GND. The control

– 2000-V Human-Body Model

pins can be connected to low voltage GPIOs allowing

(A114-B, Class II)

it to be controlled by whatever 1.2-V, 1.8-V, 2.5-V, or

– 1000-V Charged-Device Model (C101)

3.3-V logic signals while keeping extremely low

quiescent current.

• Six-Terminal Wafer Chip Scale Package

(DSBGA)

A 120-Ω on-chip load resistor is available for output

– 0.8 mm × 1.2 mm,

quick discharge when the switch is turned off. The

rise time (slew rate) of the device is internally

0.4-mm Pitch, 0.5-mm Height

controlled to avoid inrush current: the rise time of

TPS22932B is 165 μs.

TPS22932B is available in a space-saving 6-terminal

DSBGA (YFP with 0.4-mm pitch). The device is

characterized for operation over the free-air

temperature range of –40°C to 85°C.

AT 1.8 V SLEW RATE QUICK OUTPUT MAX OUTPUT

DEVICE ENABLE

(TYP) (TYP AT 3.3 V) DISCHARGE

(1)

CURRENT

TPS22932B 75 mΩ 165 μs Yes 500 mA Active high

(1) This feature discharges the output of the switch to ground through a 120-Ω resistor, preventing the output from floating.

Table 1. TERMINAL ASSIGNMENTS

YFP PACKAGE

C ON2 ON3

B ON1 GND

A V

OUT

2 1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (23 pages)

PAGE 1
TPS22932B www.ti.com SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 LOW INPUT VOLTAGE, ULTRA-LOW rON LOAD SWITCH WITH CONFIGURABLE ENABLE LOGIC AND CONTROLLED SLEW-RATE Check for Samples: TPS22932B FEATURES APPLICATIONS • • • • • • • • • 1 • • • • • • • • Input Voltage: 1.1 V to 3.6 V Ultra-Low ON Resistance – rON = 55 mΩ at VIN = 3.6 V – rON = 65 mΩ at VIN = 2.5 V – rON = 75 mΩ at VIN = 1.8 V – rON = 115 mΩ at VIN = 1.
PAGE 2
TPS22932B SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 www.ti.com TYPICAL APPLICATION VBATT VIN SMPS (see Note A) LOAD VOUT ON1 CIN = 1 µF CL ON2 CL ON3 GND RL TPS22932B GND GND A.
PAGE 3
TPS22932B www.ti.com SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 Table 2. CONFIGURABLE LOGIC FUNCTION TABLE INPUTS ON3 ON2 L L SWITCH CONTROL ON1 Y L L OFF L H OFF L H L ON L H H ON H L L OFF H L H ON H H L OFF H H H ON TERMINAL FUNCTIONS TERMINAL NO.
PAGE 4
TPS22932B SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 www.ti.com LOGIC CONFIGURATIONS ON3 ON2 A GND ON1 B VOUT VIN A/B A/B GND Y A B Bump View Figure 1. 2-to-1 Data Selector A GND ON3 ON2 GND ON1 VOUT VIN B A B Y Bump View Figure 2. 2-Input AND Gate A GND ON3 ON2 GND ON1 VOUT VIN A B Y B A B VIN/VCC Y Bump View Figure 3.
PAGE 5
TPS22932B www.ti.com SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 A GND ON3 ON2 GND ON1 VOUT VIN A Y VIN/VCC Bump View Figure 6. Inverter GND ON3 ON2 GND ON1 VOUT VIN A A Y Bump View Figure 7. Noninverted Buffer ABSOLUTE MAXIMUM RATINGS (1) MIN MAX –0.3 4 UNIT VIN Input voltage range VOUT Output voltage range VIN + 0.3 V P Power dissipation at TA = 25°C 0.
PAGE 6
TPS22932B SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 www.ti.com ELECTRICAL CHARACTERISTICS VIN = 1.1 V to 3.6 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS TA MIN TYP (1) MAX VIN = 1.1 V IIN Quiescent current IIN(OFF) OFF-state supply current IIN(LEAKAGE) OFF-state switch current IOUT = 0 VON = GND, OUT = Open VON = GND, VOUT = 0 140 275 280 500 VIN = 3.6 V 860 920 VIN = 1.1 V 80 225 VIN = 1.8 V VIN = 1.8 V Full 125 300 VIN = 3.
PAGE 7
TPS22932B www.ti.com SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 SWITCHING CHARACTERISTICS VIN = 1.2 V, RL_CHIP = 120 Ω, TA = 25°C (unless otherwise noted) PARAMETER tON Turn-ON time TEST CONDITIONS RL = 500 Ω MIN CL = 0.1 μF 350 CL = 1 μF 390 CL = 3 μF 450 CL = 0.1 μF tOFF tr Turn-OFF time VOUT rise time RL = 500 Ω RL = 500 Ω VOUT fall time RL = 500 Ω MAX UNIT μs 30 CL = 1 μF 70 CL = 3 μF 160 CL = 0.1 μF 240 CL = 1 μF 240 CL = 3 μF 260 CL = 0.
PAGE 8
TPS22932B SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 www.ti.com SWITCHING CHARACTERISTICS VIN = 1.8 V, RL_CHIP = 120 Ω, TA = 25°C (unless otherwise noted) PARAMETER tON TEST CONDITIONS RL = 500 Ω Turn-ON time MIN CL = 0.1 μF 215 CL = 1 μF 240 CL = 3 μF 260 CL = 0.1 μF tOFF tr RL = 500 Ω Turn-OFF time VOUT rise time RL = 500 RL = 500 Ω VOUT fall time MAX UNIT μs 24 CL = 1 μF 60 CL = 3 μF 142 CL = 0.1 μF 165 CL = 1 μF 165 CL = 3 μF 175 CL = 0.
PAGE 9
TPS22932B www.ti.com SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 SWITCHING CHARACTERISTICS VIN = 3 V, RL_CHIP = 120 Ω, TA = 25°C (unless otherwise noted) PARAMETER tON Turn-ON time TEST CONDITIONS RL = 500 Ω MIN CL = 0.1 μF 170 CL = 1 μF 190 CL = 3 μF 210 CL = 0.1 μF tOFF tr Turn-OFF time VOUT rise time RL = 500 Ω RL = 500 Ω VOUT fall time RL = 500 Ω MAX UNIT μs 2 CL = 1 μF 60 CL = 3 μF 140 CL = 0.1 μF 140 CL = 1 μF 140 CL = 3 μF 150 CL = 0.
PAGE 10
TPS22932B SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 www.ti.com TYPICAL CHARACTERISTICS 0.6 ON-State Resistance, rON (Ω) 0.5 0.4 0.3 0.2 0.1 0 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 Input Voltage, VIN (V) Figure 8. rON vs VIN 0.070 VIN = 1.1 V 0.07 VIN = 1.2 V 0.06 VIN = 1.8 V V Drop (V) 0.05 VIN = 2.5 V 0.04 VIN = 3.6 V 0.03 0.02 0.01 0.00 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 ON-State Resistance, R on (ohms) 0.08 0.065 0.060 0.
PAGE 11
TPS22932B www.ti.com SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 TYPICAL CHARACTERISTICS (continued) 250 Quiescent Current, IIN (nA) Quiescent Current, IIN (nA) 250 200 150 100 50 0 200 150 100 50 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 –40 Input Voltage, VIN (V) Figure 11. Quiescent Current vs VIN (ON2 = VIN, ON1–ON3 = 0 V, Iout= 0) (VIN 100 25 85 Temperature (°C) Figure 12. Quiescent Current vs TA = 3.
PAGE 12
TPS22932B SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) 4.0 VIN = 3.6 V 3.5 VIN = 3.3 V 3.0 VIN = 3 V Vout (V) 2.5 VIN = 2.5 V 2.0 VIN = 1.8 V VIN = 1.5 V VIN = 1.2 V 1.5 1.0 VIN = 1.1 V 0.5 0.0 –0.5 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 Input Voltage, VON (V) Figure 17. ON-Input Threshold 200 160 180 140 160 120 tON 120 trise/tfall (µs) CL = 0.1 µF RL = 500 Ω VIN = 3.3 V 100 80 60 CL = 0.1 µF RL = 500 Ω VIN = 3.
PAGE 13
TPS22932B www.ti.com SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 TYPICAL CHARACTERISTICS (continued) 1.2 0 VON IOUT 0.8 0.4 00 16 00 14 00 12 00 10 0 0 80 60 0 40 0 0 20 00 –2 00 –4 Time (µs) Figure 24. tON Response 3.5 3.2 7.0 6.5 6.0 5.5 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 –0.5 –1.0 CL = 3 µF RL = 500 Ω VIN = 1.2 V 2.8 2.4 2.0 VON 1.2 IOUT 0.8 0.4 00 00 16 00 Time (µs) Figure 26. tON Response 14 00 12 10 0 0 0 80 60 0 40 0 20 –2 00 0.0 –0.
PAGE 14
TPS22932B SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 www.ti.com CL = 3 µF RL = 500 Ω VIN = 3.3 V 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 –0.5 CL = 0.1 µF RL = 500 Ω VIN = 1.2 V IOUT VON 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 –0.5 –1.0 –1.0 –1.5 –2.0 –2.5 –3.0 –10 –1.5 –2.0 –2.5 –3.0 0 10 30 40 50 60 70 80 Time (µs) Figure 32. tOFF Response 20 90 –1.0 10 30 40 50 60 70 80 Time (µs) Figure 29. tOFF Response 20 500 450 400 350 300 IOUT 250 200 150 100 50 0.0 VON –50 –100 –1.
PAGE 15
TPS22932B www.ti.com SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 VON –1.0 –1.5 –2.0 –2.5 –3.0 –200 0 –1.0 –1.5 –2.0 –2.5 –3.0 200 400 600 800 1.0 1.2 1.4 1.6 1.8 Time (µs) Figure 34. tOFF Response 250 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 –0.5 CL = 3 µF RL = 11 Ω VIN = 1.2 V IOUT VON –1.0 –1.5 –2.0 –2.5 –3.0 –50 0 220 200 180 160 140 120 100 80 60 40 20 0.0 –20 –40 –60 –80 –100 –120 –150 50 100 150 200 250 300 350 400 450 Time (µs) Figure 35.
PAGE 16
TPS22932B SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION VIN ON VOUT (A) RL CL + – OFF DUT CIN =1 µF GND GND GND TEST CIRCUIT 1.8 V VON VON VON/2 VON/2 tr 0V tON tOFF VIN/2 VIN/2 90% VOUT VOH VOUT tf 0V 10% 90% 10% VOL tON/tOFF WAVEFORMS A. trise and tfall of the control signal is 100 ns. Figure 36.
PAGE 17
TPS22932B www.ti.com SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 APPLICATION INFORMATION ON/OFF Control The ON pin controls the state of the switch. Activating ON continuously holds the switch in the on state so long as there is no fault. ON is active HI and has a low threshold making it capable of interfacing with low voltage signals. The ON pin is compatible with standard GPIO logic threshold. It can be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V or 3.3-V GPIOs.
PAGE 18
TPS22932B SLVS802B – AUGUST 2009 – REVISED AUGUST 2013 www.ti.com REVISION HISTORY Changes from Revision A (November 2009) to Revision B • 18 Page Aligned package description throughout datasheet. .............................................................................................................
PAGE 19
PACKAGE OPTION ADDENDUM www.ti.
PAGE 20
PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) TPS22932BYFPR DSBGA YFP 6 3000 180.0 8.4 TPS22932BYFPT DSBGA YFP 6 250 180.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 0.89 1.29 0.62 4.0 8.0 Q1 0.89 1.29 0.62 4.0 8.
PAGE 21
PACKAGE MATERIALS INFORMATION www.ti.com 12-Aug-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS22932BYFPR DSBGA YFP 6 3000 220.0 220.0 34.0 TPS22932BYFPT DSBGA YFP 6 250 220.0 220.0 34.
PAGE 22
D: Max = 1.19 mm, Min = 1.13 mm E: Max = 0.79 mm, Min = 0.
PAGE 23
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.