Datasheet

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FEATURES

SENSE1

SENSE2

SENSE3

GND

RESET

D OR DGN PACKAGE

(TOP VIEW)

TYPICAL APPLICATIONS

SENSE 1

SENSE 2 RESET

TPS3307−33

SENSE 3

GND

100nF

RESET

GND

3.3V5V2.5V

470kΩ

620kΩ

• Applications using DSPs,

Microcontrollers or Microprocessors

w Industrial Equipment

w Programmable Controls

w Automotive Systems

w Portable/Battery Powered Equipment

w Intelligent Instruments

w Wireless Communication Systems

w Notebook/Desktop Computers

MSP430C325

DESCRIPTION

TPS3307-18 , TPS3307-25 , TPS3307-33

SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006

TRIPLE PROCESSOR SUPERVISORS

• Triple Supervisory Circuits for DSP and

Processor-Based Systems

• Power-On Reset Generator With Fixed Delay

Time of 200ms, No External Capacitor Needed

• Temperature-Compensated Voltage Reference

• Maximum Supply Current of 40 µ A

• Supply Voltage Range: 2V to 6V

• Defined RESET Output From V

≥ 1.1V

• MSOP-8 and SO-8 Packages

• Temperature Range : – 40 ° C to +85 ° C

Figure 1 lists some of the typical applications for the TPS3307 family, and a schematic diagram for a

processor-based system application. This application uses TI part numbers TPS3307-33 and MSP430C325 .

Figure 1. Applications Using the TPS3307 Family

The TPS3307 family is a series of micropower supply voltage supervisors designed for circuit initialization

primarily in DSP and processor-based systems, which require more than one supply voltage.

The product spectrum of the TPS3307-xx is designed for monitoring three independent supply voltages:

3.3V/1.8V/adj, 3.3V/2.5V/adj or 3.3V/5V/adj. The adjustable SENSE input allows the monitoring of any supply

voltage >1.25V.

The various supply voltage supervisors are designed to monitor the nominal supply voltage as shown in the

following supply voltage monitoring table .

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PowerPAD is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (20 pages)

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TPS3307-18, TPS3307-25, TPS3307-33 www.ti.com SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006 TRIPLE PROCESSOR SUPERVISORS FEATURES • • • • • • • • D OR DGN PACKAGE (TOP VIEW) Triple Supervisory Circuits for DSP and Processor-Based Systems Power-On Reset Generator With Fixed Delay Time of 200ms, No External Capacitor Needed Temperature-Compensated Voltage Reference Maximum Supply Current of 40µA Supply Voltage Range: 2V to 6V Defined RESET Output From VDD ≥ 1.
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TPS3307-18, TPS3307-25, TPS3307-33 www.ti.com SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006 During power-on, RESET is asserted when the supply voltage VDD becomes higher than 1.1V. Thereafter, the supply voltage supervisor monitors the SENSEn inputs and keeps RESET active as long as SENSEn remain below the threshold voltage VIT+. An internal timer delays the return of the RESET output to the inactive state (high) to ensure proper system reset.
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TPS3307-18, TPS3307-25, TPS3307-33 www.ti.com SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006 Functional Block Diagram VDD TPS3307 14 kΩ MR R1 + _ SENSE 1 R2 RESET R3 SENSE 2 R4 RESET Logic + Timer + _ RESET GND Reference Voltage of 1.
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TPS3307-18, TPS3307-25, TPS3307-33 www.ti.com SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006 TPS3307Y Chip Information These chips, when properly assembled, display characteristics similar to those of the TPS3307. Thermal compression or ultrasonic bonding may take place on the doped aluminium bonding pads. The chips may be mounted with conductive epoxy or a gold-silicon preform.
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TPS3307-18, TPS3307-25, TPS3307-33 www.ti.com SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006 Absolute Maximum Ratings (1) Over operating free-air temperature range (unless otherwise noted). UNIT Supply voltage, VDD (2) 7V MR pin –0.3V to VDD +0.3V All other pins (2) –0.
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TPS3307-18, TPS3307-25, TPS3307-33 www.ti.com SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006 Electrical Characteristics Over recommended operating free-air temperature range (unless otherwise noted). PARAMETER VOH VOL TEST CONDITIONS High-level output voltage Low-level output voltage VSENSE3 VDD = 3.3V, IOH = –2mA VDD – 0.4V VDD = 6V, IOH = –3mA VDD – 0.4V VSENSE3 0.2 0.4 VDD = 6V, IOL = 3mA 0.
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TPS3307-18, TPS3307-25, TPS3307-33 www.ti.com SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006 Timing Requirements At VDD = 2V to 6V, RL = 1MΩ, CL = 50pF, TA = +25°C. PARAMETER tw Pulse width TEST CONDITIONS SENSEn VSENSEnL = VIT–– 0.2V, VSENSEnH = VIT+ +0.2V MR VIH = 0.7 × VDD, VIL = 0.3 × VDD MIN TYP MAX UNIT 6 µs 100 ns Switching Characteristics At VDD = 2V to 6V, RL = 1MΩ, CL = 50pF, TA = +25°C. PARAMETER TEST CONDITIONS VI(SENSEn) ≥ VIT+ + 0.2V, MR ≥ 0.7 × VDD. See Timing Diagram.
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TPS3307-18, TPS3307-25, TPS3307-33 www.ti.com SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006 Typical Characteristics SUPPLY CURRENT vs SUPPLY VOLTAGE 18 1.005 16 VDD = 2V MR = Open 1.004 14 12 1.003 I DD − Supply Current − µ A Normalized Input Threshold Voltage − VIT(TA), VIT(25 °C) NORMALIZED SENSE THRESHOLD VOLTAGE vs FREE-AIR TEMPERATURE AT VDD 1.002 1.001 1 0.999 0.998 0.997 TPS3307−33 10 8 6 4 2 0 −2 −4 SENSEn = VDD MR = Open TA = 25°C −6 −8 −10 −0.5 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.
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TPS3307-18, TPS3307-25, TPS3307-33 www.ti.com SLVS199C – DECEMBER 1998 – REVISED DECEMBER 2006 Typical Characteristics (continued) HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT 2.5 6.5 VDD = 6V MR = Open 6 VOH − High-Level Output Voltage − V VOH − High-Level Output Voltage − V VDD = 2V MR = Open 2 1.5 −40°C 1 85°C 0.5 5.5 5 4.5 4 −40°C 3.5 3 85°C 2.5 2 1.5 1 0.5 0 0 0 −0.5 −1 −1.5 −2 −2.5 −3 −3.5 −4 −4.5 −5 −5.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
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PACKAGE MATERIALS INFORMATION www.ti.com 24-Oct-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TPS3307-18DGNR Package Package Pins Type Drawing MSOPPower PAD SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS3307-18DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TPS3307-25DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 24-Oct-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS3307-18DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 TPS3307-18DR SOIC D 8 2500 367.0 367.0 35.0 TPS3307-25DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 TPS3307-25DR SOIC D 8 2500 367.0 367.0 35.0 TPS3307-33DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 TPS3307-33DR SOIC D 8 2500 367.
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