Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - system monitor Reserve capacity circuit TSSOP 14

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    

SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007

features

D Supply Current of 40 µA (Max)

D Precision Supply Voltage Monitor

− 2.0 V, 2.5 V, 3.3 V, 5.0 V

− Other Versions on Request

D Watchdog Timer With 800-ms Time-Out

D Backup-Battery Voltage Can Exceed V

D Power-On Reset Generator With Fixed

100-ms Reset Delay Time

D Battery OK Output

D Voltage Monitor for Power-Fail or

Low-Battery Monitoring

D Manual Switchover to Battery-Backup

Mode

D Chip-Enable Gating −3 ns (at V

= 5 V)

Max. Propagation Delay

D Manual Reset

D Battery Freshness Seal

D 14-Pin TSSOP Package

D Temperature Range ...−40°C to 85°C

typical applications

D Fax Machines

D Set-Top Boxes

D Advanced Voice Mail Systems

D Portable Battery Powered Equipment

D Computer Equipment

D Advanced Modems

D Automotive Systems

D Portable Long-Time Monitoring Equipment

D Point of Sale Equipment

typical operating circuit

CEIN CEOUT

BAT

PFI

Backup

Battery

RESET

WDI

PFO

BATTOK

BATTON

OUT

GND

MSWITCH

Manual

Reset

External

Source

0.1 µF

Power

Supply

Address Bus

GND

RESET

I/O

Data Bus

Address

Decoder

Switchover

Capacitor

0.1 µF

TPS3600 uC

CMOS

RAM

CMOS

RAM

Real-

Time

Clock

www.ti.com

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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

BAT

RESET

WDI

CEOUT

BATTOK

PFO

OUT

GND

MSWITCH

CEIN

BATTON

PFI

TSSOP (PW) Package

(TOP VIEW)

ACTUAL SIZE

(5,10mm x 6,60mm)

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Summary of content (26 pages)

PAGE 1
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 features typical applications D Supply Current of 40 µA (Max) D Precision Supply Voltage Monitor D D D D D D D D D D D D D D D D D D D D − 2.0 V, 2.5 V, 3.3 V, 5.
PAGE 2
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 description The TPS3600 family of supervisory circuits monitor and control processor activity. In case of power-fail or brownout conditions, the backup-battery switchover function of TPS3600 allows to run a low-power processor and its peripherals from the installed backup battery without asserting a reset beforehand.
PAGE 3
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 FUNCTION TABLES VDD > VSW 0 VOUT > VIT 0 VDD > VBAT 0 MSWITCH MR 0 0 0 0 0 0 1 0 0 0 1 0 0 0 0 1 1 0 0 1 0 0 0 0 1 0 1 0 0 1 1 0 0 0 1 1 1 0 1 0 0 0 0 1 0 0 1 0 1 0 1 0 0 1 0 1 1 0 1 1 0 0 0 1 1 0 1 0 1 1 1 0 0 1 1 1 1 1 1 0 0 0 1 1 0 0 1 1 1 0 1 0 1 1 0 1 1 1 1 1
PAGE 4
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 functional schematic TPS3600 MR MSWITCH VBAT + _ Switch Control Internal Supply Voltage VDD VOUT BATTON + _ Reference Voltage or 1.15 V BATTOK R1 GND RESET Logic and Timer _ + R2 RESET _ PFO + PFI Oscillator WDI Transition Detector Watchdog Logic and Control VOUT 40 kΩ CEOUT CEIN www.ti.
PAGE 5
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 timing diagram VBAT V(BOK) V(SWP) V(SWN) V(IT) VDD t VOUT V(SWN) t RESET t BATTOK 1 0 t BATTON VBAT VDD VBAT VDD VBAT t NOTES: A. MSWITCH = 0, MR = 1 NOTES: B. Timing diagram shown under normal operation, not in freshness seal mode. www.ti.
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SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 Terminal Functions TERMINAL NAME NO.
PAGE 7
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 detailed description (continued) IBAT 25 µs 200 ms 100 µA t Figure 1. BATTOK Timing chip-enable signal gating The internal gating of chip-enable signals (CE) prevents erroneous data from corrupting CMOS RAM during an under-voltage condition. The TPS3600 use a series transmission gate from CEIN to CEOUT.
PAGE 8
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 detailed description (continued) power-fail comparator (PFI and PFO) An additional comparator is provided to monitor voltages other than the nominal supply voltage. The power-fail input (PFI) will be compared with an internal voltage reference of 1.15 V. If the input voltage falls below the power-fail threshold, V(PFI), of 1.
PAGE 9
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 detailed description (continued) manual switchover (MSWITCH) While operating in the normal mode from VDD, the device can be manually forced to operate in the battery-backup mode by connecting MSWITCH to VDD. The table below shows the different switchover modes.
PAGE 10
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage: VDD (see Note1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V MR and WDI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to (VDD + 0.
PAGE 11
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 electrical characteristics over recommended operating conditions (unless otherwise noted) PARAMETER VOH VOL Vres High-level output voltage Low-level output voltage TEST CONDITIONS VOUT = 1.8 V, IOH = −20 µA VOUT = 3.3 V, IOH = −80 µA VOUT = 5.0 V, IOH = −120 µA VOUT − 0.3 V CEOUT Enable mode CEIN = VOUT VOUT = 2.0 V, IOH = −1 mA VOUT = 3.
PAGE 12
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 electrical characteristics over recommended operating conditions (unless otherwise noted) (continued) PARAMETER TEST CONDITIONS VIT BATTOK Vhys Hysteresis MIN TYP 1.65 V < VIT < 2.5 V 20 2.5 V < VIT < 3.5 V 40 3.5 V < VIT < 5.5 V 50 1.65 V < V(BOK) < 2.5 V 30 2.5 V < V(BOK) < 3.5 V 60 3.5 V < V(BOK) < 5.
PAGE 13
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 timing requirements at RL = 1 MΩ, CL = 50 pF, TA = −40°C to 85°C PARAMETER tw TEST CONDITIONS VDD MR Pulse width WDI VIH = VIT + 0.2 V, VIL = VIT − 0.2 V MIN TYP 5 VDD > VIT + 0.2 V, VIL = 0.3 x VDD, VIH = 0.
PAGE 14
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 TYPICAL CHARACTERISTICS STATIC DRAIN SOURCE ON-STATE RESISTANCE (VBAT TO VOUT) vs OUTPUT CURRENT rDS(on) − Static Drain Source On-State Resistance (V BAT to VOUT) − Ω rDS(on) − Static Drain Source On-State Resistance (V DD to VOUT) − Ω STATIC DRAIN SOURCE ON-STATE RESISTANCE (VDD TO VOUT) vs OUTPUT CURRENT 1.5 TA = 85°C 1.4 1.3 TA = 25°C 1.2 TA = 0°C 1.
PAGE 15
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 TYPICAL CHARACTERISTICS NORMALIZED THRESHOLD VOLTAGE vs FREE-AIR TEMPERATURE SUPPLY CURRENT vs SUPPLY VOLTAGE 1.
PAGE 16
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 TYPICAL CHARACTERISTICS HIGH-LEVEL OUTPUT VOLTAGE AT PFO vs HIGH-LEVEL OUTPUT CURRENT HIGH-LEVEL OUTPUT VOLTAGE AT PFO vs HIGH-LEVEL OUTPUT CURRENT 5.55 5 VOH − High-Level Output Voltage at PFO − V VOH − High-Level Output Voltage at PFO − V 6 TA = −40°C TA = 25°C 4 TA = 0°C 3 TA = 85°C 2 VDD = 5.5 V PFI = 1.
PAGE 17
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 TYPICAL CHARACTERISTICS HIGH-LEVEL OUTPUT VOLTAGE AT CEOUT vs HIGH-LEVEL OUTPUT CURRENT 3.5 3.5 3 VOH − High-Level Output Voltage at CEOUT − V VOH − High-Level Output Voltage at CEOUT − V HIGH-LEVEL OUTPUT VOLTAGE AT CEOUT vs HIGH-LEVEL OUTPUT CURRENT TA = −40°C 2.5 TA = 25°C TA = 0°C 2 1.5 TA = 85°C 1 Disable Mode V(CEIN) = open VDD = 1.
PAGE 18
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 TYPICAL CHARACTERISTICS LOW-LEVEL OUTPUT VOLTAGE AT CEOUT vs LOW-LEVEL OUTPUT CURRENT LOW-LEVEL OUTPUT VOLTAGE AT CEOUT vs LOW-LEVEL OUTPUT CURRENT VOL− Low-Level Output Voltage at CEOUT − mV VOL− Low-Level Output Voltage at CEOUT − V 3.5 Enable Mode V(CEIN) = GND VDD = 5 V MSWITCH = GND 3 2.5 TA = 85°C 2 TA = 25°C TA = 0°C 1.5 TA = −40°C 1 0.
PAGE 19
SLVS336B − DECEMBER 2000 − REVISED JANUARY 2007 TYPICAL CHARACTERISTICS TPS3600D50 MINIMUM PULSE DURATION AT VDD vs THRESHOLD OVERDRIVE AT VDD Minimum Pulse Duration at VCC− µ s 10 9 8 7 6 5 4 3 2 1 0 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 VT(0) − Threshold Overdrive at VDD − V Figure 25 TPS3600D50 MINIMUM PULSE DURATION AT PFI vs THRESHOLD OVERDRIVE AT PFI Minimum Pulse Duration at PFI − µ s 5 4.
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PACKAGE OPTION ADDENDUM www.ti.
PAGE 21
PACKAGE OPTION ADDENDUM www.ti.com 27-Aug-2009 provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
PAGE 22
PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS3600D20PWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 TPS3600D25PWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1 TPS3600D33PWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.
PAGE 23
PACKAGE MATERIALS INFORMATION www.ti.com 29-Jul-2009 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS3600D20PWR TSSOP PW 14 2000 340.5 338.1 20.6 TPS3600D25PWR TSSOP PW 14 2000 340.5 338.1 20.6 TPS3600D33PWR TSSOP PW 14 2000 340.5 338.1 20.
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