Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - system monitor Reset/power-on reset MSOP 8



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    

SLVS184C − NOVEMBER 1998 − REVISED DECEMBER 2005

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

features

D Power-On Reset Generator with Fixed

Delay Time of 200 ms, no External

Capacitor Needed

D Precision Supply Voltage Monitor 2.5 V, 3 V,

3.3 V, and 5 V

D Pin-For-Pin Compatible with the MAX705

through MAX708 Series

D Integrated Watchdog Timer (TPS3705 only)

D Voltage Monitor for Power-Fail or

Low-Battery Warning

D Maximum Supply Current of 50 µA

D MSOP-8 and SO-8 Packages

D Temperature Range ...−40°C to 85°C

typical applications

D Designs Using DSPs, Microcontrollers or

Microprocessors

D Industrial Equipment

D Programmable Controls

D Automotive Systems

D Portable/Battery Powered Equipment

D Intelligent Instruments

D Wireless Communication Systems

D Notebook/Desktop Computers

Figure 1. Typical MSP430 Application

MR RESET

TPS3705−50

PFI

GND

100 nF

RESET/NMI

GND

5 V12 V

910 kΩ

120 kΩ

MSP430P112

PFO

WDI

WDO

I/O

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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

GND

PFI

WDO

RESET

WDI

PFO

TPS3705 ...D PACKAGE

(TOP VIEW)

RESET

PFO

TPS3707 ...D PACKAGE

(TOP VIEW)

NC − No internal connection

GND

PFI

RESET

WDO

WDI

PFO

PFI

GND

TPS3705 . . . DGN PACKAGE

(TOP VIEW)

PFO

PFI

GND

TPS3707 . . . DGN PACKAGE

(TOP VIEW)

NC − No internal connection

RESET

Summary of content (23 pages)

PAGE 1
SLVS184C − NOVEMBER 1998 − REVISED DECEMBER 2005 TPS3705 . . . D PACKAGE (TOP VIEW) features D Power-On Reset Generator with Fixed Delay Time of 200 ms, no External Capacitor Needed Precision Supply Voltage Monitor 2.5 V, 3 V, 3.3 V, and 5 V Pin-For-Pin Compatible with the MAX705 through MAX708 Series Integrated Watchdog Timer (TPS3705 only) Voltage Monitor for Power-Fail or Low-Battery Warning Maximum Supply Current of 50 µA MSOP-8 and SO-8 Packages Temperature Range . . .
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SLVS184C − NOVEMBER 1998 − REVISED DECEMBER 2005 description The TPS3705, TPS3707 family of microprocessor supply-voltage supervisors provide circuit initialization and timing supervision, primarily for DSP and processor-based systems. During power-on, RESET is asserted when the supply voltage VDD becomes higher than 1.1 V.
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SLVS184C − NOVEMBER 1998 − REVISED DECEMBER 2005 Function Tables TRUTH TABLE, TPS3705 MR VDD>VIT RESET TYPICAL DELAY H→L 1 H→L 30 ns L→H 1 L→H 200 ms H 1→0 H→L 3 µs H 0→1 L→H 200 ms TRUTH TABLE, TPS3707 MR VDD>VIT RESET RESET TYPICAL DELAY H→L 1 H→L L→H 30 ns 200 ms L→H 1 L→H H→L H 1→0 H→L L→H 3 µs H 0→1 L→H H→L 200 ms TRUTH TABLE, TPS370x PFI>VIT PFO TYPICAL DELAY 0→1 L→H 0.5 µs 1→0 H→L 0.
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SLVS184C − NOVEMBER 1998 − REVISED DECEMBER 2005 timing diagrams VDD 5V 4.5 V 1.1 V 0V t MR 5V 4.5 V 1.1 V 0V RESET t td td td 5V 4.5 V 1.1 V 0V t Don’t Care 1.1 V Don’t Care 5V 4.5 V Don’t Care Undefined Behavior WDI 0V t WDO t t(out) 5V 4.5 V 1.
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SLVS184C − NOVEMBER 1998 − REVISED DECEMBER 2005 TPS370xY chip information These chips, when properly assembled, display characteristics similar to those of the TPS370x. Thermal compression or ultrasonic bonding may be caused on the doped-aluminum bonding pads. The chips may be mounted with conductive epoxy or a gold-silicon preform.
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SLVS184C − NOVEMBER 1998 − REVISED DECEMBER 2005 absolute maximum ratings over operating free-air temperature (unless otherwise noted)† Supply voltage, VDD (see Note1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V PFI voltage range, VPFI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VDD + 0.
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SLVS184C − NOVEMBER 1998 − REVISED DECEMBER 2005 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS TPS370x-xx VDD = 1.1 V IOH = − 4 µA MIN TYP MAX UNIT 0.8 TPS3707-25 TPS370x-30 VOH High-level output voltage TPS370x-33 VDD = VIT+ + 0.2 V, IOH = −500 µA TPS370x-50 VDD = VIT+ + 0.2 V, IOH = −800 µA TPS370x-xx VDD = 6 V, 0.7×V 0.7 VDD V VDD −1.
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SLVS184C − NOVEMBER 1998 − REVISED DECEMBER 2005 timing requirements at RL = 1 MΩ, CL = 50 pF, TA = 25°C PARAMETER tw Pulse width TEST CONDITIONS at VDD at MR VDD = VIT+ + 0.2 V, VDD ≥ VIT++ 0.2 V, at WDI VDD ≥ VIT++ 0.2 V, MIN VDD = VIT−−0.2 V VIL = 0.3 × VDD, VIH = 0.7 × VDD VIL = 0.3 × VDD, VIH = 0.
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SLVS184C − NOVEMBER 1998 − REVISED DECEMBER 2005 Normalized Input Threshold Voltage VIT(TA), VIT (25 °C ) TYPICAL CHARACTERISTICS NORMALIZED INPUT THRESHOLD VOLTAGE vs FREE-AIR TEMPERATURE AT VDD 1.002 VDD = 6 V PFI = 1.05 V MR = Open 1.001 1 0.999 −40 60 −15 10 35 TA − Free-Air Temperature − °C 85 Figure 2 INPUT CURRENT vs INPUT VOLTAGE AT MR SUPPLY CURRENT vs SUPPLY VOLTAGE 100 50 VDD = 6 V PFI = 1.
PAGE 10
SLVS184C − NOVEMBER 1998 − REVISED DECEMBER 2005 TYPICAL CHARACTERISTICS MINIMUM PULSE DURATION AT VDD vs VDD THRESHOLD OVERDRIVE HIGH-LEVEL OUTPUT VOLTAGE vs HIGH-LEVEL OUTPUT CURRENT 3.5 PFI = 1.05 V MR = Open VOH − High-Level Output Voltage − V tw − Minimum Pulse Duration at VDD − µ s 10 8 6 4 2 0 0 200 400 800 600 VDD = 3.2 V PFI = 1.05 V MR = Open 3 2.5 2 1.5 −40°C 1 85°C 0.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.
PAGE 15
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS3705-30DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TPS3705-33DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS3705-33DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS3707-33DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 TPS3707-50DGNR MSOPPower PAD DGN 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TPS3707-50DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS3707-50DGNR MSOP-PowerPAD DGN 8 2500 358.0 335.0 35.0 TPS3707-50DR SOIC D 8 2500 367.0 367.0 35.
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