Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - system monitor Reset/power-on reset SOT 23-3

DBZ PACKAGE

SOT23-3

(TOP VIEW)

VDD

GND

RESET

TPS3839

DQN PACKAGE

1-mm 1-mm X2SON

(TOP VIEW)

VDD

GND

RESET

Thermal

Pad

TPS3831

DQN PACKAGE

1-mm 1-mm X2SON

(TOP VIEW)

VDD

GND

RESET

Thermal

Pad

VDD

RESET

GND

TPS383xK33

RST

Microprocessor

3.3 V

0.1 Fm

TPS3831

Only

TYPICAL APPLICATION

TPS3831

TPS3839

www.ti.com

SBVS193B –JUNE 2012–REVISED APRIL 2013

Ultralow Power, Supply Voltage Supervisor

Check for Samples: TPS3831, TPS3839

FEATURES

DESCRIPTION

The TPS3831 and TPS3839 (both referred to as the

• Ultralow Supply Current: 150 nA (typ)

TPS383x) are ultralow current (150 nA, typical),

• Operating Supply Voltage: 0.6 V to 6.5 V

voltage supervisory circuit that monitor a single

• Valid Reset for V

> 0.6 V

voltage. Both devices assert an active-low reset

signal whenever the V

supply voltage drops below

• Push-Pull RESET Output

the factory-trimmed reset threshold voltage. The reset

• Factory-Trimmed Reset Threshold Voltages

output remains asserted for 200 ms (typical) after the

• Temperature Range: –40°C to +85°C

voltage rises above the threshold voltage. These

devices are designed to ignore fast transients on the

• Packages: 1-mm × 1-mm X2SON or 3-Pin

pin. Note that the TPS3831 includes a manual

SOT23

reset input.

APPLICATIONS

The ultralow current consumption of 150 nA makes

these voltage supervisors ideal for use in low-power

• Portable and Battery-Powered Equipment

and portable applications. The TPS383x are specified

• Industrial Equipment

to have the correct output logic state for supply

• Cell Phones

voltages down to 0.6 V.

• Glucose Monitors

The TPS383x feature precision factory-trimmed

• Metering threshold voltages and extremely low-power

operation. The TPS3831 is available is a 4-pin 1-mm

• Televisions

× 1-mm (DQN) X2SON package. The TPS3839 is

available in a 3-pin SOT23 (DBZ) package or a 4-pin

1-mm × 1-mm (DQN) X2SON package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (26 pages)

PAGE 1
TPS3831 TPS3839 www.ti.com SBVS193B – JUNE 2012 – REVISED APRIL 2013 Ultralow Power, Supply Voltage Supervisor Check for Samples: TPS3831, TPS3839 FEATURES DESCRIPTION • • • • • • • The TPS3831 and TPS3839 (both referred to as the TPS383x) are ultralow current (150 nA, typical), voltage supervisory circuit that monitor a single voltage. Both devices assert an active-low reset signal whenever the VDD supply voltage drops below the factory-trimmed reset threshold voltage.
PAGE 2
TPS3831 TPS3839 SBVS193B – JUNE 2012 – REVISED APRIL 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
PAGE 3
TPS3831 TPS3839 www.ti.com SBVS193B – JUNE 2012 – REVISED APRIL 2013 THERMAL INFORMATION THERMAL METRIC TPS3839 TPS3831 TPS3839 DBZ (SOT23-3) DQN (X2SON) 3 PINS 4 PINS (1) θJA Junction-to-ambient thermal resistance 286.9 249.9 θJCtop Junction-to-case (top) thermal resistance 105.6 N/A θJB Junction-to-board thermal resistance 123.4 N/A ψJT Junction-to-top characterization parameter 25.8 6.0 ψJB Junction-to-board characterization parameter 107.
PAGE 4
TPS3831 TPS3839 SBVS193B – JUNE 2012 – REVISED APRIL 2013 www.ti.com TIMING REQUIREMENTS PARAMETER MIN TYP MAX UNIT 120 200 350 ms td RESET delay time (power-up delay) tpd_vdd Propagation delay, VDD falling (power-down delay) 20 µs tpd_mr Propagation delay from MR low to RESET low 46 ns TIMING DIAGRAM VDD 0.6 V 0.0 V RESET td = Reset Delay td td td = Undefined State VIT- + VHYS VIT- MR 0.7VDD 0.3VDD Time Figure 1.
PAGE 5
TPS3831 TPS3839 www.ti.com SBVS193B – JUNE 2012 – REVISED APRIL 2013 PIN CONFIGURATIONS TPS3831 DQN PACKAGE 1-mm × 1-mm X2SON (TOP VIEW) 4 1 RESET TPS3839 DQN PACKAGE 1-mm × 1-mm X2SON (TOP VIEW) VDD RESET 1 Thermal Pad MR 2 3 4 VDD 3 GND Thermal Pad GND NC 2 TPS3839 DBZ PACKAGE SOT23-3 (TOP VIEW) GND 1 3 VDD 2 RESET PIN ASSIGNMENTS PIN NUMBER NAME TPS3839DBZ TPS3839DQN TPS3831DQN DESCRIPTION GND 1 3 3 Ground MR N/A N/A 2 Manual reset.
PAGE 6
TPS3831 TPS3839 SBVS193B – JUNE 2012 – REVISED APRIL 2013 www.ti.com DEVICE INFORMATION FUNCTIONAL BLOCK DIAGRAM VDD Delay RESET VREF GND VDD MR (TPS3831 Only) Figure 2. TPS383x Block Diagram APPLICATION CIRCUIT 3.3 V C1 0.1 mF VDD TPS383xK33 MR TPS3831 Only RESET Microprocessor RST GND Figure 3.
PAGE 7
TPS3831 TPS3839 www.ti.com SBVS193B – JUNE 2012 – REVISED APRIL 2013 TYPICAL CHARACTERISTICS At TA = +25°C and C1 = 0.1 µF, unless otherwise noted. 200 220 VDD = 1.2 V VDD = 3.3 V VDD = 5.0 V VDD = 6.5 V Supply Current (nA) 180 170 TPS3839K33 Reset Delay Time (ms) 190 160 150 140 130 120 210 200 190 110 100 −40 −15 10 35 Temperature (°C) 60 180 −40 85 −15 10 35 Temperature (°C) G001 Figure 4. SUPPLY CURRENT vs INPUT VOLTAGE AND TEMPERATURE 60 85 G002 Figure 5.
PAGE 8
TPS3831 TPS3839 SBVS193B – JUNE 2012 – REVISED APRIL 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) At TA = +25°C and C1 = 0.1 µF, unless otherwise noted. 1.6 1.6 TA = −40°C TA = 0°C TA = +25°C TA = +25°C 1.4 1.2 1.2 1 VOL (V) 1 VOL (V) TA = −40°C TA = 0°C TA = +25°C TA = +85°C 1.4 0.8 0.8 0.6 0.6 0.4 0.4 0.2 0.2 VDD = 1.8 V 0 1 2 3 4 VDD = 3.3 V IOL (mA) 1.4 TA = −40°C TA = 0°C TA = +25°C TA = +85°C VOL (V) 1 0.8 0.6 0.4 0.2 VDD = 4.
PAGE 9
TPS3831 TPS3839 www.ti.com SBVS193B – JUNE 2012 – REVISED APRIL 2013 APPLICATION INFORMATION VDD TRANSIENT REJECTION The TPS383x (TPS3831 and TPS3839) has built-in rejection of fast transients on the VDD pin. Transient rejection depends on both the duration and amplitude of the transient. Transient amplitude is measured from the bottom of the transient to the negative threshold voltage (VIT–) of the device, as shown in Figure 14. VDD VITTransient Amplitude Transient Duration (tW) Figure 14.
PAGE 10
TPS3831 TPS3839 SBVS193B – JUNE 2012 – REVISED APRIL 2013 www.ti.com MANUAL RESET (MR) INPUT (TPS3831 Only) The manual reset (MR) input allows a processor, or other logic devices, to initiate a reset (TPS3831 only). A logic low (0.3 VDD) on MR causes RESET to assert. After MR returns to a logic high and VDD is greater than the threshold voltage, RESET is deasserted after the reset delay time, td, elapses.
PAGE 11
TPS3831 TPS3839 www.ti.com SBVS193B – JUNE 2012 – REVISED APRIL 2013 APPLICATION EXAMPLE: SINGLE ALKALINE CELL MONITORING Low operating voltage and threshold options make the TPS383x well-suited for monitoring single-cell, alkalinebattery applications. Figure 18 shows the TPS3839A09 used to disable a boost converter when the cell voltage reaches 0.9 V, which is the end of the discharge voltage for a single alkaline battery cell. When the cell voltage reaches 0.9 V, the TPS61261 enable pin is driven low.
PAGE 12
TPS3831 TPS3839 SBVS193B – JUNE 2012 – REVISED APRIL 2013 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current verison. Changes from Revision A (September 2012) to Revision B • Changed VDD test conditions for high-level output voltage parameter .................................................................................
PAGE 13
PACKAGE OPTION ADDENDUM www.ti.
PAGE 14
PACKAGE OPTION ADDENDUM www.ti.
PAGE 15
PACKAGE OPTION ADDENDUM www.ti.
PAGE 16
PACKAGE OPTION ADDENDUM www.ti.com 21-May-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PAGE 17
PACKAGE MATERIALS INFORMATION www.ti.com 12-Jul-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing TPS3831A09DQNR X2SON DQN 4 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3831A09DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3831E16DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.
PAGE 18
PACKAGE MATERIALS INFORMATION www.ti.com 12-Jul-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS3839A09DQNR X2SON DQN 4 3000 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3839A09DQNT X2SON DQN 4 250 180.0 9.5 1.16 1.16 0.63 4.0 8.0 Q2 TPS3839E16DBZR SOT-23 DBZ 3 3000 179.0 8.4 3.15 2.95 1.22 4.0 8.0 Q3 TPS3839E16DBZT SOT-23 DBZ 3 250 179.0 8.4 3.15 2.95 1.22 4.
PAGE 19
PACKAGE MATERIALS INFORMATION www.ti.com 12-Jul-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS3831A09DQNR X2SON DQN 4 3000 180.0 180.0 30.0 TPS3831A09DQNT X2SON DQN 4 250 180.0 180.0 30.0 TPS3831E16DQNR X2SON DQN 4 3000 180.0 180.0 30.0 TPS3831E16DQNT X2SON DQN 4 250 180.0 180.0 30.0 TPS3831G12DQNR X2SON DQN 4 3000 180.0 180.0 30.0 TPS3831G12DQNT X2SON DQN 4 250 180.0 180.0 30.
PAGE 20
PACKAGE MATERIALS INFORMATION www.ti.com 12-Jul-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS3839E16DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 TPS3839E16DBZT SOT-23 DBZ 3 250 203.0 203.0 35.0 TPS3839E16DQNR X2SON DQN 4 3000 180.0 180.0 30.0 TPS3839E16DQNT X2SON DQN 4 250 180.0 180.0 30.0 TPS3839G12DBZR SOT-23 DBZ 3 3000 203.0 203.0 35.0 TPS3839G12DBZT SOT-23 DBZ 3 250 203.0 203.0 35.
PAGE 21
PAGE 22
PAGE 23
PAGE 24
PAGE 25
PAGE 26
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.