Datasheet
TPS54311, TPS54312
TPS54313, TPS54314
TPS54315, TPS54316
SLVS416B − FEBRUARY 2002 − REVISED APRIL 2005
www.ti.com
2
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during
storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
T
A
OUTPUT
VOLTAGE
PACKAGED DEVICES
PLASTIC HTSSOP
(PWP)
(1)(2)
T
A
OUTPUT
VOLTAGE
PACKAGED DEVICES
PLASTIC HTSSOP
(PWP)
(1)(2)
0.9 V TPS54311PWP 1.8 V TPS54314PWP
−40°C to 85°C
1.2 V TPS54312PWP
−40°C to 85°C
2.5 V TPS54315PWP
40 C to 85 C
1.5 V TPS54313PWP
40 C to 85 C
3.3 V TPS54316PWP
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website
at www.ti.com.
(2))
The PWP package is also available taped and reeled. Add an R suffix to the device type (i.e., TPS54316PWPR). See application section of data
sheet for PowerPAD drawing and layout information.
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range unless otherwise noted
(1)
TPS54310
VIN, SS/ENA, SYNC −0.3 V to 7 V
Input voltage range V
RT −0.3 V to 6 V
Input voltage range, V
I
VSENSE −0.3 V to 4 V
BOOT −0.3 V to 17 V
Output voltage range V
VBIAS, PWRGD, COMP −0.3 V to 7 V
Output voltage range, V
O
PH −0.6 V to 10 V
Source current I
PH Internally Limited
Source current, I
O
COMP, VBIAS 6 mA
PH 6 A
Sink current
COMP 6 mA
Sink current
SS/ENA,PWRGD 10 mA
Voltage differential AGND to PGND ±0.3 V
Operating virtual junction temperature range, T
J
−40°C to 125°C
Storage temperature, T
stg
−65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 300°C
(1)
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING CONDITIONS
MIN NOM MAX UNIT
Input voltage range, V
I
3 6 V
Operating junction temperature, T
J
−40 125 °C
PACKAGE DISSIPATION RATINGS
(1)
(2)
PACKAGE
THERMAL IMPEDANCE
JUNCTION-TO-AMBIENT
T
A
= 25°C
POWER RATING
T
A
= 70°C
POWER RATING
T
A
= 85°C
POWER RATING
20-Pin PWP with solder 26.0°C/W 3.85 W
(3)
2.12 W 1.54 W
20-Pin PWP without solder 57.5°C/W 1.73 W 0.96 W 0.69 W
(1)
For more information on the PWP package, refer to TI technical brief (SLMA002).
(2)
Test board conditions:
1. 3” × 3”, 2 layers, Thickness: 0.062”
2. 1.5 oz copper traces located on the top of the PCB
3. 1.5 oz copper ground plane on the bottom of the PCB
4. Ten thermal vias (see recommended land pattern in application section of this data sheet)
(3)
Maximum power dissipation may be limited by overcurrent protection.