Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - DC/DC voltage regulator Holder VQFN 24

SimplifiedSchematic

100

0 0.5

1.5

32.5 3.5

I -Output

Current − A

Efficiency − %

EFFICIENCY

LOAD CURRENT

VIN

PWRGD

SS/ENA

SYNC

BOOT

PGND

VSENSE

Output

COMPAGND

VBIAS

Input

TPS54317

T =25 C,

V =3.3V,

V =1.8V,

fs=1.1MHz

TPS54317

www.ti.com

..................................................................................................................................... SLVS619B –NOVEMBER 2005–REVISED SEPTEMBER 2009

1.6 MHz, 3-V TO 6-V INPUT, 3-A SYNCHRONOUS STEP-DOWN SWIFT™ CONVERTER

Check for Samples: TPS54317

FEATURES

DESCRIPTION

• 60-mΩ MOSFET Switches for High Efficiency

at 3-A Continuous Output Current

As members of the SWIFT™ family of dc/dc

regulators, the TPS54317 low-input-voltage

• Adjustable Output Voltage Down to 0.9 V With

high-output-current synchronous-buck PWM

1% Accuracy

converter integrates all required active components.

• Switching Frequency: Adjustable From

Included on the substrate with the listed features are

280 kHz to 1600 kHz

a true, high performance, voltage error amplifier that

• Externally Compensated for Design Flexibility

provides high performance under transient conditions;

an undervoltage-lockout circuit to prevent start-up

• Fast Transient Response

until the input voltage reaches 3 V; an internally and

• Load Protected by Peak Current Limit and

externally set slow-start circuit to limit in-rush

Thermal Shutdown

currents; and a power good output useful for

• Integrated Solution Reduces Board Area and

processor/logic reset, fault signaling, and supply

Total Cost

sequencing.

• Spacing Saving 4mm x 5mm QFN Packaging

The TPS54317 device is available in a thermally

enhanced 24-pin QFN (RHF) PowerPAD™ package,

• For SWIFT Documentation, Application Notes,

which eliminates bulky heatsinks. TI provides

and Design Software, see the TI website at

evaluation modules and the SWIFT designer software

www.ti.com/swift

tool to aid in achieving high-performance power

supply designs to meet aggressive equipment

APPLICATIONS

development cycles.

• Low-Voltage, High-Density Systems With

Power Distributed at 5 V or 3.3 V

• Point of Load Regulation for High

Performance DSPs, FPGAs, ASICs, and

Microprocessors

• Broadband, Networking and Optical

Communications Infrastructure

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2SWIFT, PowerPAD are trademarks of Texas Instruments.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (21 pages)

PAGE 1
TPS54317 www.ti.com ..................................................................................................................................... SLVS619B – NOVEMBER 2005 – REVISED SEPTEMBER 2009 1.6 MHz, 3-V TO 6-V INPUT, 3-A SYNCHRONOUS STEP-DOWN SWIFT™ CONVERTER Check for Samples: TPS54317 FEATURES 1 • 2 • • • • • • • • 60-mΩ MOSFET Switches for High Efficiency at 3-A Continuous Output Current Adjustable Output Voltage Down to 0.
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TPS54317 SLVS619B – NOVEMBER 2005 – REVISED SEPTEMBER 2009 ..................................................................................................................................... www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
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TPS54317 www.ti.com ..................................................................................................................................... SLVS619B – NOVEMBER 2005 – REVISED SEPTEMBER 2009 PACKAGE DISSIPATION RATINGS (1) (1) (2) (2) PACKAGE THERMAL IMPEDANCE JUNCTION-TO-AMBIENT THERMAL IMPEDANCE JUNCTION-TO-CASE 24-Pin RHF with solder 19.7°C/W 1.7°C/W Maximum power dissipation may be limited by overcurrent protection.
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TPS54317 SLVS619B – NOVEMBER 2005 – REVISED SEPTEMBER 2009 ..................................................................................................................................... www.ti.
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TPS54317 www.ti.com .....................................................................................................................................
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TPS54317 SLVS619B – NOVEMBER 2005 – REVISED SEPTEMBER 2009 ..................................................................................................................................... www.ti.com FUNCTIONAL BLOCK DIAGRAM VBIAS AGND VIN Enable Comparator SS/ENA Falling Edge Deglitch 1.2 V Hysteresis: 0.03 V VIN UVLO Comparator VIN 2.95 V Hysteresis: 0.16 V VIN ILIM Comparator Thermal Shutdown o 150 C 2.
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TPS54317 www.ti.com ..................................................................................................................................... SLVS619B – NOVEMBER 2005 – REVISED SEPTEMBER 2009 TYPICAL CHARACTERISTICS DRAIN-SOURCE ON-STATE RESISTANCE vs JUNCTION TEMPERATURE DRAIN-SOURCE ON-STATE RESISTANCE vs JUNCTION TEMPERATURE VI = 3.3 V 100 80 60 40 20 0 −40 0 25 85 125 VI = 5 V 80 60 40 20 0 −40 25 85 125 650 SYNC ≥ 2.5 V 550 450 SYNC ≤ 0.
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TPS54317 SLVS619B – NOVEMBER 2005 – REVISED SEPTEMBER 2009 ..................................................................................................................................... www.ti.com APPLICATION INFORMATION Figure 10 shows the schematic diagram for a typical TPS54317 application. The TPS54317 (U1) provides up to 3 A of output current at a nominal output voltage of 1.8 V.
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TPS54317 www.ti.com ..................................................................................................................................... SLVS619B – NOVEMBER 2005 – REVISED SEPTEMBER 2009 The TPS54317 has two internal grounds (analog and power). Inside the TPS54317, the analog ground ties to all of the noise sensitive signals, while the power ground ties to the noisier power signals.
PAGE 10
TPS54317 SLVS619B – NOVEMBER 2005 – REVISED SEPTEMBER 2009 ..................................................................................................................................... www.ti.com Figure 11. TPS54317 PCB Layout LAYOUT CONSIDERATIONS FOR THERMAL PERFORMANCE For operation at full rated load current, the analog ground plane must provide adequate heat dissipating area.
PAGE 11
TPS54317 www.ti.com ..................................................................................................................................... SLVS619B – NOVEMBER 2005 – REVISED SEPTEMBER 2009 PERFORMANCE GRAPHS TA = 25°C, fs = 1.1 MHz, VI = 3.3 V, VO = 1.8 V (unless otherwise specified) EFFICIENCY vs OUTPUT CURRENT OUTPUT VOLTAGE vs OUTPUT CURRENT LOOP RESPONSE 0.3 180 60 50 VI = 4 V 90 85 VI = 5 V 80 0.1 0 1 60 20 10 GAIN 0 0 −10 −60 −20 -0.1 −30 −40 −120 −50 -0.3 0.
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TPS54317 SLVS619B – NOVEMBER 2005 – REVISED SEPTEMBER 2009 ..................................................................................................................................... www.ti.com DETAILED DESCRIPTION t (SS) +C (SS) 0.7 V 5 mA (3) Undervoltage Lock Out (UVLO) The TPS54317 incorporates an undervoltage lockout circuit to keep the device disabled when the input voltage (VIN) is insufficient.
PAGE 13
TPS54317 www.ti.com ..................................................................................................................................... SLVS619B – NOVEMBER 2005 – REVISED SEPTEMBER 2009 Table 1. Summary of the Frequency Selection Configurations SWITCHING FREQUENCY SYNC PIN RT PIN 350 kHz, internally set Float or AGND Float 550 kHz, internally set ≥ 2.5 V Float Externally set 280 kHz to 1600 kHz Float R = 27.
PAGE 14
TPS54317 SLVS619B – NOVEMBER 2005 – REVISED SEPTEMBER 2009 ..................................................................................................................................... www.ti.com VOmax = 0.9 x VImin - IOmax [ (-0.016 x VImin + 0.184) + RL] Thermal Shutdown The device uses the thermal shutdown to turn off the power MOSFETs and disable the controller if the junction temperature exceeds 150°C.
PAGE 15
PACKAGE OPTION ADDENDUM www.ti.
PAGE 16
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS54317RHFR VQFN RHF 24 3000 330.0 12.4 4.3 5.3 1.3 8.0 12.0 Q1 TPS54317RHFT VQFN RHF 24 250 180.0 12.4 4.3 5.3 1.3 8.0 12.
PAGE 17
PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS54317RHFR VQFN RHF 24 3000 367.0 367.0 35.0 TPS54317RHFT VQFN RHF 24 250 210.0 185.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.