Datasheet
VIN
NC
NC
ENA
GND
VSENSE
BOOT
PH
VIN VOUT
SimplifiedSchematic
EfficiencyvsOutputCurrent
50
55
60
65
70
75
80
85
90
95
100
I - Output Current - A
O
Efficiency-%
0 1 2 3 4 5 6
V =12V,
V =5V,
f =500kHz,
T =25°C
I
O
s
A
TPS5450
www.ti.com
SLVS757C –MARCH 2007–REVISED OCTOBER 2013
5-A, WIDE INPUT RANGE, STEP-DOWN CONVERTER
Check for Samples: TPS5450
1
FEATURES
APPLICATIONS
2
• Wide Input Voltage Range: 5.5 V to 36 V
• High Density Point-of-Load Regulators
• Up to 5-A Continuous (6-A Peak) Output • LCD Displays, Plasma Displays
Current
• Battery Chargers
• High Efficiency Greater than 90% Enabled by
• 12-V/24-V Distributed Power Systems
110-mΩ Integrated MOSFET Switch
• Wide Output Voltage Range: Adjustable Down DESCRIPTION
to 1.22 V with 1.5% Initial Accuracy
The TPS5450 is a high-output-current PWM
converter that integrates a low resistance high side
• Internal Compensation Minimizes External
N-channel MOSFET. Included on the substrate with
Parts Count
the listed features are a high performance voltage
• Fixed 500 kHz Switching Frequency for Small
error amplifier that provides tight voltage regulation
Filter Size
accuracy under transient conditions; an undervoltage-
• 18 μA Shut Down Supply Current
lockout circuit to prevent start-up until the input
voltage reaches 5.5 V; an internally set slow-start
• Improved Line Regulation and Transient
circuit to limit inrush currents; and a voltage feed-
Response by Input Voltage Feed Forward
forward circuit to improve the transient response.
• System Protected by Overcurrent Limiting,
Using the ENA pin, shutdown supply current is
Overvoltage Protection and Thermal Shutdown
reduced to 18 μA typically. Other features include an
active-high enable, overcurrent limiting, overvoltage
• –40°C to 125°C Operating Junction
protection and thermal shutdown. To reduce design
Temperature Range
complexity and external component count, the
• Available in Small Thermally Enhanced 8-Pin
TPS5450 feedback loop is internally compensated.
SOIC PowerPAD™ Package
The TPS5450 device is available in a thermally
enhanced, 8-pin SOIC PowerPAD™ package. TI
provides evaluation modules and software tool to aid
in achieving high-performance power supply designs
to meet aggressive equipment development cycles.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2PowerPAD is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.