Datasheet

M0028-01
UseasMuchCopper Area
asPossibleforHeatSpread
PackageThermalPad
PackageOutline
IMPORTANT
TPS55065-Q1
www.ti.com ............................................................................................................................................................................................... SLIS132 – OCTOBER 2008
Figure 22. Land Configuration for Single-Layer PCB
Layout recommendation is to use as much copper area for the power-management section of a single-layer
board as possible. In a single-layer board application, the thermal pad is attached to a heat spreader (copper
areas) by using a low-thermal-impedance attachment method (solder paste or thermal-conductive epoxy). In both
of these cases, it is advisable to use as much copper and as many traces as possible to dissipate the heat.
When this attachment method is not implemented correctly, this product may operate inefficiently. Power dissipation capability
may be adversely affected when the device is incorrectly mounted onto the circuit board.
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