Datasheet

TPS56221
SLUSAH5B –MARCH 2011–REVISED SEPTEMBER 2012 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
PACKAGE MINIMUM QUANTITY ORDERABLE
T
A
PINS TRANSPORT MEDIA
NUMBER
250 TPS56221DQPT
-40°C to 150°C Plastic QFN (DQP) 22 Tape-and-reel
2500 TPS56221DQPR
ABSOLUTE MAXIMUM RATINGS
over operating free-air temperature range (unless otherwise noted)
(1)
VALUE
UNIT
MIN TYP
VDD, VIN –0.3 16.5 V
SW –3 25
SW (< 100 ns pulse width, 10 µJ) -5
Voltage Range
BOOT –0.3 30
BOOT-SW (differential from BOOT to SW) –0.3 7
COMP, PGOOD, FB, BP, EN/SS, ILIM –0.3 7
(HBM) QSS 009-105 (JESD22-A114A) 2 kV
Electrostatic discharge
(CBM) QSS 009-147 (JESD22-C101B.01) 1.5
Junction, T
J
–40 150 °C
Temperature
Storage, T
stg
–55 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other condition beyond those included under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods of time may affect device reliability.
THERMAL INFORMATION
TPS56221
THERMAL METRIC
(1)
PQFN UNITS
22 PINS
θ
JA
Junction-to-ambient thermal resistance 34.6
θ
JCtop
Junction-to-case (top) thermal resistance 22.9
ψ
JT
Junction-to-top characterization parameter 0.6 °C/W
ψ
JB
Junction-to-board characterization parameter 5.0
θ
JCbot
Junction-to-case (bottom) thermal resistance 0.3
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN TYP MAX UNIT
V
DD
VIN Input voltage 4.5 14 V
T
J
Operating junction temperature –40 125 °C
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