Datasheet

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DBV PACKAGE

(TOP VIEW)

1IN

GND

OUT

Fixed Option

DBV PACKAGE

(TOP VIEW)

GND

OUT

Adjustable Option

TPS73028

RIPPLE REJECTION

FREQUENCY

10 100 1 k 10 k

100 k 1 M 10 M

Ripple Rejection (dB)

Frequency (Hz)

OUT

= 10 mA

= 3.8 V

OUT

= 10 µF

= 0.01 µF

OUT

= 200 mA

100

0.05

0.10

0.15

0.20

0.25

0.30

100 1 k 10 k 100 k

Frequency (Hz)

OUT

= 1 mA

= 3.8 V

OUT

= 2.2 µF

= 0.1 µF

OUT

= 200 mA

TPS73028

OUTPUT SPECTRAL NOISE DENSITY

FREQUENCY

Output Spectral Noise Density (µV/√Hz)

OUT

GND

YZQ PACKAGE

(TOP VIEW)

A3 A1

C3 C1

TPS730xx

www.ti.com

SBVS054I – NOVEMBER 2004– REVISED FEBRUARY 2011

LOW-NOISE, HIGH PSRR, RF 200-mA

LOW-DROPOUT LINEAR REGULATORS

Check for Samples: TPS730xx

FEATURES

DESCRIPTION

234

• 200-mA RF Low-Dropout Regulator

The TPS730xx family of low-dropout (LDO)

With Enable

low-power linear voltage regulators features high

power-supply rejection ratio (PSRR), ultralow-noise,

• Available in Fixed Voltages from 1.8V to 3.3V

fast start-up, and excellent line and load transient

and Adjustable (1.22V to 5.5V)

responses a small SOT23 package. NanoStar™

• High PSRR (68dB at 100Hz)

packaging gives an ultrasmall footprint as well as an

• Ultralow-Noise (33μV

RMS

, TPS73018)

ultralow profile and package weight, making it ideal

for portable applications such as handsets and PDAs.

• Fast Start-Up Time (50μs)

Each device in the family is stable, with a small 2.2μF

• Stable With a 2.2μF Ceramic Capacitor

ceramic capacitor on the output. The TPS730xx

• Excellent Load/Line Transient Response

family uses an advanced, proprietary BiCMOS

fabrication process to yield low dropout voltages (e.g.,

• Very Low Dropout Voltage (120mV at 200mA)

120mV at 200mA, TPS73030). Each device achieves

• 5- and 6-Pin SOT23 (DBV), and Wafer Chip

fast start-up times (approximately 50μs with a

Scale (YZQ) Packages

0.001μF bypass capacitor) while consuming low

quiescent current (170μA typical). Moreover, when

APPLICATIONS

the device is placed in standby mode, the supply

• RF: VCOs, Receivers, ADCs

current is reduced to less than 1μA. The TPS73018

exhibits approximately 33μV

RMS

of output voltage

• Audio

noise at 1.8V output with a 0.01μF bypass capacitor.

• Cellular and Cordless Telephones

Applications with analog components that are

• Bluetooth

, Wireless LAN

noise-sensitive, such as portable RF electronics,

• Handheld Organizers, PDAs

benefit from the high PSRR and low-noise features

as well as the fast response time.

Figure 1.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2NanoStar is a trademark of Texas Instruments.

3Bluetooth is a registered trademark of Bluetooth Sig, Inc.

4All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (24 pages)

PAGE 1
TPS730xx SBVS054I – NOVEMBER 2004 – REVISED FEBRUARY 2011 www.ti.com LOW-NOISE, HIGH PSRR, RF 200-mA LOW-DROPOUT LINEAR REGULATORS Check for Samples: TPS730xx FEATURES DESCRIPTION • 200-mA RF Low-Dropout Regulator With Enable • Available in Fixed Voltages from 1.8V to 3.3V and Adjustable (1.22V to 5.5V) • High PSRR (68dB at 100Hz) • Ultralow-Noise (33μVRMS, TPS73018) • Fast Start-Up Time (50μs) • Stable With a 2.
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TPS730xx SBVS054I – NOVEMBER 2004 – REVISED FEBRUARY 2011 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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TPS730xx SBVS054I – NOVEMBER 2004 – REVISED FEBRUARY 2011 www.ti.com DISSIPATION RATINGS TABLE TA ≤ +25°C POWER RATING TA = +70°C POWER RATING TA = +85°C POWER RATING BOARD PACKAGE RθJC RθJA DERATING FACTOR ABOVE TA = +25°C Low-K (1) DBV 65°C/W 255°C/W 3.9mW/°C 390mW 215mW 155mW (2) DBV 65°C/W 180°C/W 5.6mW/°C 560mW 310mW 225mW Low-K (1) YZQ 27°C/W 255°C/W 3.9mW/°C 390mW 215mW 155mW High-K (2) YZQ 27°C/W 190°C/W 5.
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TPS730xx SBVS054I – NOVEMBER 2004 – REVISED FEBRUARY 2011 www.ti.com FUNCTIONAL BLOCK DIAGRAMS ADJUSTABLE VERSION IN OUT UVLO 2.45V 59 k Current Sense ILIM GND R1 SHUTDOWN _ + FB EN R2 UVLO Thermal Shutdown Bandgap Reference 1.22V IN External to the Device QuickStart 250 kΩ Vref NR FIXED VERSION IN OUT UVLO 2.45V Current Sense GND SHUTDOWN ILIM _ R1 + EN UVLO R2 Thermal Shutdown R2 = 40 kΩ QuickStart Bandgap Reference 1.22V IN 250 kΩ Vref NR Table 1.
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TPS730xx SBVS054I – NOVEMBER 2004 – REVISED FEBRUARY 2011 www.ti.com TYPICAL CHARACTERISTICS (SOT23 PACKAGE) TPS73028 OUTPUT VOLTAGE vs OUTPUT CURRENT TPS73028 OUTPUT VOLTAGE vs JUNCTION TEMPERATURE 2.805 250 2.805 VIN = 3.8 V COUT = 10 µF TJ = 25°C 2.804 2.803 VIN = 3.8 V COUT = 10 µF 2.800 VOUT (V) 2.800 2.799 IGND (µA) 2.795 2.801 2.790 IOUT = 200 mA 2.785 2.798 2.797 2.795 0 50 100 150 2.775 200 IOUT = 200 mA 150 100 50 2.780 VIN = 3.8 V COUT = 10 µF 2.
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TPS730xx SBVS054I – NOVEMBER 2004 – REVISED FEBRUARY 2011 www.ti.com TYPICAL CHARACTERISTICS (SOT23 PACKAGE) (continued) TPS73028 LOAD TRANSIENT RESPONSE DROPOUT VOLTAGE vs OUTPUT CURRENT POWER-UP/POWER-DOWN 250 VIN = 3.8 V COUT = 10 µF TJ = 125°C −20 di 0.
PAGE 7
TPS730xx SBVS054I – NOVEMBER 2004 – REVISED FEBRUARY 2011 www.ti.com APPLICATION INFORMATION The TPS730xx family of low-dropout (LDO) regulators has been optimized for use in noise-sensitive battery-operated equipment. The device features extremely low dropout voltages, high PSRR, ultralow output noise, low quiescent current (170μA typically), and enable-input to reduce supply currents to less than 1μA when the regulator is turned off. A typical application circuit is shown in Figure 16.
PAGE 8
TPS730xx SBVS054I – NOVEMBER 2004 – REVISED FEBRUARY 2011 www.ti.com Power Dissipation and Junction Temperature Specified regulator operation is assured to a junction temperature of +125°C; the maximum junction temperature should be restricted to +125°C under normal operating conditions. This restriction limits the power dissipation the regulator can handle in any given application.
PAGE 9
TPS730xx SBVS054I – NOVEMBER 2004 – REVISED FEBRUARY 2011 www.ti.com OUTPUT VOLTAGE PROGRAMMING GUIDE VIN IN 1mF OUT TPS73001 EN NR GND 0.01mF VOUT R1 FB R2 C1 2.2mF OUTPUT VOLTAGE R1 R2 C1 1.22V short open 0pF 2.5V 31.6kW 30.1kW 22pF 3.3V 51kW 30.1kW 15pF 3.6V 59kW 30.1kW 15pF Figure 17.
PAGE 10
TPS730xx SBVS054I – NOVEMBER 2004 – REVISED FEBRUARY 2011 www.ti.com TPS730xxYZQ NanoStar™ Wafer Chip Scale Information 0,79 0,84 1,30 1,34 0.625 Max NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. NanoStar package configuration. D. This package is tin-lead (SnPb); consult the factory for availability of lead-free material. NanoStar is a trademark of Texas Instruments. Figure 18.
PAGE 11
TPS730xx SBVS054I – NOVEMBER 2004 – REVISED FEBRUARY 2011 www.ti.com REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision H (October, 2007) to Revision I • Page Corrected units in y-axis of Figure 6 .....................................................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 18-Jul-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
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PACKAGE MATERIALS INFORMATION www.ti.com 17-Jul-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) TPS73001DBVR SOT-23 DBV 6 3000 178.0 9.0 3.17 1.37 4.0 8.0 Q3 TPS73001DBVR SOT-23 DBV 6 3000 179.0 8.4 3.2 TPS73001DBVT SOT-23 DBV 6 250 178.0 9.0 3.23 3.2 1.4 4.0 8.0 Q3 3.17 1.37 4.0 8.0 TPS73018DBVR SOT-23 DBV 5 3000 178.0 9.0 3.
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PACKAGE MATERIALS INFORMATION www.ti.com 17-Jul-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) TPS73030DBVR SOT-23 DBV 5 3000 178.0 9.0 TPS73030DBVT SOT-23 DBV 5 250 178.0 9.0 TPS73033DBVR SOT-23 DBV 5 3000 178.0 TPS73033DBVT SOT-23 DBV 5 250 178.0 TPS73047DBVR SOT-23 DBV 5 3000 TPS73047DBVT SOT-23 DBV 5 250 W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 3.23 3.17 1.37 4.0 8.
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PACKAGE MATERIALS INFORMATION www.ti.com 17-Jul-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS730285DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS730285YZQR DSBGA YZQ 5 3000 217.0 193.0 35.0 TPS730285YZQT DSBGA YZQ 5 250 217.0 193.0 35.0 TPS73028DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS73028DBVT SOT-23 DBV 5 250 180.0 180.0 18.0 TPS73028YZQR DSBGA YZQ 5 3000 217.0 193.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.