Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - LDO voltage regulator Positive, fixed SOT 223 6

N/C

OUT

N/C

NR/FB

GND

DRB PACKAGE

3mm x 3mm SON

(TOP VIEW)

DCQ PACKAGE

SOT223

(TOP VIEW)

1 2 3 4 5

OUT

GND

NR/FB

TAB IS GND6

N/C

OUT

NR/FB

GND

DRV PACKAGE

(1)

2mm x 2mm SON

(TOP VIEW)

TypicalApplicationCircuit

TPS737xx

GNDEN

IN OUT

OUT

Optional

1.0 Fm

OFF

TPS737xx

www.ti.com

SBVS067P –JANUARY 2006–REVISED JULY 2013

1A Low-Dropout Regulator

with Reverse Current Protection

FEATURES

DESCRIPTION

The TPS737xx family of linear low-dropout (LDO)

• Stable with 1.0μF or Larger Ceramic Output

voltage regulators uses an NMOS pass element in a

Capacitor

voltage-follower configuration. This topology is

• Input Voltage Range: 2.2V to 5.5V

relatively insensitive to output capacitor value and

• Ultra-Low Dropout Voltage: 130mV typ at 1A

ESR, allowing a wide variety of load configurations.

Load transient response is excellent, even with a

• Excellent Load Transient Response—Even

small 1.0μF ceramic output capacitor. The NMOS

With Only 1.0μF Output Capacitor

topology also allows very low dropout.

• NMOS Topology Delivers Low Reverse

The TPS737xx family uses an advanced BiCMOS

Leakage Current

process to yield high precision while delivering very

• 1.0% Initial Accuracy

low dropout voltages and low ground pin current.

• 3% Overall Accuracy Over Line, Load, and

Current consumption, when not enabled, is under

Temperature

20nA and ideal for portable applications. These

devices are protected by thermal shutdown and

• Less Than 20nA typical I

in Shutdown Mode

foldback current limit.

• Thermal Shutdown and Current Limit for Fault

For applications that require higher output voltage

Protection

accuracy, consider TI's TPS7A37xx family of 1%

• Available in Multiple Output Voltage Versions

overall accuracy, 1A low-dropout voltage regulators.

– Adjustable Output: 1.20V to 5.5V

– Custom Outputs Available Using Factory

Package-Level Programming

APPLICATIONS

• Point of Load Regulation for DSPs, FPGAs,

ASICs, and Microprocessors

• Post-Regulation for Switching Supplies

• Portable/Battery-Powered Equipment

space

(1) Power dissipation may limit operating

range. Check Thermal Information table.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (31 pages)

PAGE 1
TPS737xx www.ti.com SBVS067P – JANUARY 2006 – REVISED JULY 2013 1A Low-Dropout Regulator with Reverse Current Protection FEATURES DESCRIPTION • The TPS737xx family of linear low-dropout (LDO) voltage regulators uses an NMOS pass element in a voltage-follower configuration. This topology is relatively insensitive to output capacitor value and ESR, allowing a wide variety of load configurations. Load transient response is excellent, even with a small 1.0μF ceramic output capacitor.
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TPS737xx SBVS067P – JANUARY 2006 – REVISED JULY 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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TPS737xx www.ti.com SBVS067P – JANUARY 2006 – REVISED JULY 2013 THERMAL INFORMATION TPS737xx (2) THERMAL METRIC (1) Junction-to-ambient thermal resistance (4) θJA (5) DRB DCQ DRV (3) 8 PINS 6 PINS 6 PINS 49.5 53.1 67.2 θJCtop Junction-to-case (top) thermal resistance 58.9 35.2 87.6 θJB Junction-to-board thermal resistance (6) 25.1 7.8 36.8 ψJT Junction-to-top characterization parameter (7) 1.7 2.9 1.8 ψJB Junction-to-board characterization parameter (8) 25.2 7.7 37.
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TPS737xx SBVS067P – JANUARY 2006 – REVISED JULY 2013 www.ti.com ELECTRICAL CHARACTERISTICS Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(nom) + 1.0V (1), IOUT = 10mA, VEN = 2.2V, and COUT = 2.2μF, unless otherwise noted. Typical values are at TJ = +25°C. TPS737xx PARAMETER VIN TEST CONDITIONS Input voltage range VFB (1) (2) 2.2 1.2 1.210 Internal reference (DRB and DRV packages) TJ = +25°C 1.192 1.2 1.216 Accuracy (1) , over VIN, IOUT, and T Line regulation (1) VFB 5.
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TPS737xx www.ti.com SBVS067P – JANUARY 2006 – REVISED JULY 2013 FUNCTIONAL BLOCK DIAGRAMS IN 4MHz Charge Pump EN Thermal Protection Ref Servo 27kΩ Bandgap Error Amp Current Limit OUT 8kΩ GND R1 R1 + R2 = 80kΩ R2 NR Figure 1. Fixed Voltage Version IN Standard 1% Resistor Values for Common Output Voltages VO 4-MHZ Charge Pump EN Thermal Protection Ref Servo 27 kW Bandgap Error Amp GND 80 kW 8 kW R2 1.2 V Short Open 1.5 V 23.2 kW 95.3 kW 1.8 V 28.0 kW 56.2 kW 2.5 V 39.2 kW 36.
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TPS737xx SBVS067P – JANUARY 2006 – REVISED JULY 2013 www.ti.com PIN CONFIGURATIONS DCQ PACKAGE SOT223-6 (TOP VIEW) 6 1 IN 2 3 DRB PACKAGE 3mm x 3mm SON (TOP VIEW) TAB IS GND 4 5 OUT 1 8 IN N/C 2 7 N/C NR/FB 3 6 N/C GND 4 5 EN GND EN OUT NR/FB DRV PACKAGE(1) 2mm x 2mm SON (TOP VIEW) (1) OUT 1 6 IN NR/FB 2 5 N/C GND 3 4 EN Power dissipation may limit operating range. Check Thermal Information table. Table 1. Pin Descriptions 6 PIN NAME SOT223 (DCQ) PIN NO.
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TPS737xx www.ti.com SBVS067P – JANUARY 2006 – REVISED JULY 2013 TYPICAL CHARACTERISTICS For all voltage versions at TJ = +25°C, VIN = VOUT(nom) + 1.0V, IOUT = 10mA, VEN = 2.2V, and COUT = 2.2μF, unless otherwise noted. LOAD REGULATION 0.5 LINE REGULATION 0.4 Referred to VIN = VOUT + 1.0V at IOUT = 10mA 0.2 0.1 0 -0.1 -0.2 Change in VOUT (%) 0.15 -40°C +25°C +125°C 0.3 Change in VOUT (%) 0.20 Referred to IOUT = 10mA -0.3 0.10 0 -0.05 -40°C -0.10 -0.15 -0.4 -0.5 -0.
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TPS737xx SBVS067P – JANUARY 2006 – REVISED JULY 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) For all voltage versions at TJ = +25°C, VIN = VOUT(nom) + 1.0V, IOUT = 10mA, VEN = 2.2V, and COUT = 2.2μF, unless otherwise noted. GROUND PIN CURRENT vs OUTPUT CURRENT GROUND PIN CURRENT vs TEMPERATURE 3000 2500 IOUT = 1A VIN = 5.0V 2500 2000 IGND (mA) VIN = 5.0V IGND (mA) 1500 VIN = 3.3V 2000 VIN = 3.3V 1500 1000 1000 VIN = 2.2V VIN = 2.
PAGE 9
TPS737xx www.ti.com SBVS067P – JANUARY 2006 – REVISED JULY 2013 TYPICAL CHARACTERISTICS (continued) For all voltage versions at TJ = +25°C, VIN = VOUT(nom) + 1.0V, IOUT = 10mA, VEN = 2.2V, and COUT = 2.2μF, unless otherwise noted.
PAGE 10
TPS737xx SBVS067P – JANUARY 2006 – REVISED JULY 2013 www.ti.com TYPICAL CHARACTERISTICS (continued) For all voltage versions at TJ = +25°C, VIN = VOUT(nom) + 1.0V, IOUT = 10mA, VEN = 2.2V, and COUT = 2.2μF, unless otherwise noted. TPS73733 LINE TRANSIENT RESPONSE TPS73733 LOAD TRANSIENT RESPONSE CNR = 10nF CNR = 10nF COUT = 10mF VOUT 200mV/div COUT = 10mF 100mV/div VOUT 1A 5.3V 10mA 4.3V IOUT VIN 10ms/div 10ms/div Figure 21. Figure 22.
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TPS737xx www.ti.com SBVS067P – JANUARY 2006 – REVISED JULY 2013 TYPICAL CHARACTERISTICS (continued) For all voltage versions at TJ = +25°C, VIN = VOUT(nom) + 1.0V, IOUT = 10mA, VEN = 2.2V, and COUT = 2.2μF, unless otherwise noted. 60 160 55 140 50 120 45 100 IFB (nA) VN (VRMS) TPS73701 RMS NOISE VOLTAGE vs CFB 40 25 80 60 35 30 TPS73701 IFB vs TEMPERATURE VOUT = 2.5V COUT = 0mF R1 = 39.
PAGE 12
TPS737xx SBVS067P – JANUARY 2006 – REVISED JULY 2013 www.ti.com APPLICATION INFORMATION The TPS737xx belongs to a family of new generation LDO regulators that use an NMOS pass transistor to achieve ultra-low-dropout performance, reverse current blockage, and freedom from output capacitor constraints. These features combined with an enable input make the TPS737xx ideal for portable applications. This regulator family offers a wide selection of fixed output voltage versions and an adjustable output version.
PAGE 13
TPS737xx www.ti.com SBVS067P – JANUARY 2006 – REVISED JULY 2013 An internal 27kΩ resistor in series with the noise reduction pin (NR) forms a low-pass filter for the voltage reference when an external noise reduction capacitor, CNR, is connected from NR to ground. For CNR = 10nF, the total noise in the 10Hz to 100kHz bandwidth is reduced by a factor of ~3.2, giving the approximate relationship: mVRMS VN(mVRMS) = 8.5 x VOUT(V) V (3) ( ) for CNR = 10nF.
PAGE 14
TPS737xx SBVS067P – JANUARY 2006 – REVISED JULY 2013 www.ti.com TRANSIENT RESPONSE The low open-loop output impedance provided by the NMOS pass element in a voltage follower configuration allows operation without a 1.0µF output capacitor. As with any regulator, the addition of additional capacitance from the OUT pin to ground reduces undershoot magnitude but increases its duration.
PAGE 15
TPS737xx www.ti.com SBVS067P – JANUARY 2006 – REVISED JULY 2013 Knowing the device power dissipation and proper sizing of the thermal plane that is connected to the tab or pad is critical to avoiding thermal shutdown and ensuring reliable operation.
PAGE 16
TPS737xx SBVS067P – JANUARY 2006 – REVISED JULY 2013 www.ti.com ESTIMATING JUNCTION TEMPERATURE 35 YJB: TJ = TB + YJB · PD (8) Where PD is the power dissipation shown by Equation 6, TT is the temperature at the center-top of the IC package, and TB is the PCB temperature measured 1mm away from the IC package on the PCB surface (as Figure 35 shows). NOTE: Both TT and TB can be measured on actual application boards using a thermo-gun (an infrared thermometer).
PAGE 17
TPS737xx www.ti.com SBVS067P – JANUARY 2006 – REVISED JULY 2013 REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision O (June 2012) to Revision P • Page Added last paragraph to Description section ........................................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 2-Nov-2013 Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
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PACKAGE MATERIALS INFORMATION www.ti.com 25-Jun-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) TPS73701DCQRG4 SOT-223 DCQ 6 2500 330.0 12.4 TPS73701DRBR SON DRB 8 3000 330.0 TPS73701DRBR SON DRB 8 3000 330.
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PACKAGE MATERIALS INFORMATION www.ti.com 25-Jun-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS73701DCQRG4 SOT-223 DCQ 6 2500 358.0 335.0 35.0 TPS73701DRBR SON DRB 8 3000 552.0 367.0 36.0 TPS73701DRBR SON DRB 8 3000 367.0 367.0 35.0 TPS73701DRBT SON DRB 8 250 552.0 185.0 36.0 TPS73701DRBT SON DRB 8 250 210.0 185.0 35.0 TPS73701DRVR SON DRV 6 3000 195.0 200.0 45.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.