Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - LDO voltage regulator Positive, fixed SOT 5

TPS782xxDDC

TSOT23-5

(TOPVIEW)

OUT

GND

TPS782xxDRV

2mmx2mmSON-6

(TOPVIEW)

GND

OUT

N/C

GND

Thermal

Pad

TPS782xx

www.ti.com

SBVS115B –AUGUST 2008–REVISED MAY 2010

500nA, I

150mA, Ultra-Low Quiescent Current

Low-Dropout Linear Regulator

FEATURES

DESCRIPTION

• Low I

: 500nA

The TPS782 family of low-dropout regulators (LDOs)

offers the benefits of ultra-low power (I

= 1mA), and

• 150mA, Low-Dropout Regulator

miniaturized packaging (2×2 SON).

• Low-Dropout at +25°C, 130mV at 150mA

This LDO is designed specifically for battery-powered

• Low-Dropout at +85°C, 175mV at 150mA

applications where ultra-low quiescent current is a

• 3% Accuracy Over Load/Line/Temperature

critical parameter. The TPS782, with ultra-low I

• Available in Fixed Voltage Options (2.5V, 2.7V,

(1mA), is ideal for microprocessors, memory cards,

and 2.8V) Using Innovative Factory EEPROM

and smoke detectors.

Programming

The ultra-low power and miniaturized packaging allow

• Stable with a 1.0mF Ceramic Capacitor

designers to customize power consumption for

specific applications. Consult with your local factory

• Thermal Shutdown and Overcurrent Protection

representative for exact voltage options and ordering

• CMOS Logic Level-Compatible Enable Pin

information; minimum order quantities may apply.

• Available in DDC (TSOT23-5) or DRV (2mm x

The TPS782 family is designed to be compatible with

2mm SON-6) Packages

the TI MSP430 and other similar products. The

enable pin (EN) is compatible with standard CMOS

APPLICATIONS

logic. This LDO is stable with any output capacitor

• TI MSP430 Attach Applications

greater than 1.0mF. Therefore, this device requires

• Power Rails with Programming Mode

minimal board space because of miniaturized

packaging and a potentially small output capacitor.

• Wireless Handsets, Smartphones, PDAs, MP3

The TPS782 series also features thermal shutdown

Players, and Other Battery-Operated Handheld

and current limit to protect the device during fault

Products

conditions. All packages have an operating

temperature range of T

= –40°C to +125°C. For

high-performance applications that require a

dual-level voltage option, consider the TPS780

series, with an I

of 500nA and dynamic voltage

scaling.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (25 pages)

PAGE 1
TPS782xx www.ti.com SBVS115B – AUGUST 2008 – REVISED MAY 2010 500nA, IQ 150mA, Ultra-Low Quiescent Current Low-Dropout Linear Regulator FEATURES DESCRIPTION • • • • • • The TPS782 family of low-dropout regulators (LDOs) offers the benefits of ultra-low power (IQ = 1mA), and miniaturized packaging (2×2 SON).
PAGE 2
TPS782xx SBVS115B – AUGUST 2008 – REVISED MAY 2010 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
PAGE 3
TPS782xx www.ti.com SBVS115B – AUGUST 2008 – REVISED MAY 2010 ELECTRICAL CHARACTERISTICS Over operating temperature range (TJ = –40°C to +125°C), VIN = VOUT(NOM) + 0.5V or 2.2V, whichever is greater; IOUT = 100mA, VEN = VIN, COUT = 1.0mF, fixed VOUT test conditions, unless otherwise noted. Typical values at TJ = +25°C. TPS782xx PARAMETER VIN TEST CONDITIONS Input voltage range ΔVOUT/ΔVIN DC output accuracy Line regulation (1) Operating junction temperature VIN = 4.3V, VOUT = 3.
PAGE 4
TPS782xx SBVS115B – AUGUST 2008 – REVISED MAY 2010 www.ti.com FUNCTIONAL BLOCK DIAGRAM IN OUT Current Limit Mux Thermal Shutdown EEPROM Bandgap EN Active PullDown 10kW Logic GND PIN CONFIGURATIONS DDC PACKAGE TSOT23-5 (TOP VIEW) IN GND (1) EN 1 5 DRV PACKAGE 2mm x 2mm SON-6 (TOP VIEW) OUT 2 3 4 GND (1) OUT 1 N/C 2 GND (1) All ground pins must be connected to ground for proper operation. (2) It is recommended that the thermal pad be grounded.
PAGE 5
TPS782xx www.ti.com SBVS115B – AUGUST 2008 – REVISED MAY 2010 TYPICAL CHARACTERISTICS Over the operating temperature range of TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater; IOUT = 100mA, VEN = VIN, COUT = 1mF, and CIN = 1mF, unless otherwise noted. LINE REGULATION IOUT = 5mA, VOUT = 2.7V (typ) TPS78227 LINE REGULATION IOUT = 150mA, VOUT = 2.7V (typ) TPS78227 1.0 3 0.8 TJ = -40°C 0.6 0.4 1 0.2 VOUT (%) VOUT (%) 2 TJ = +25°C 0 -0.2 TJ = +85°C -0.
PAGE 6
TPS782xx SBVS115B – AUGUST 2008 – REVISED MAY 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) Over the operating temperature range of TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater; IOUT = 100mA, VEN = VIN, COUT = 1mF, and CIN = 1mF, unless otherwise noted. DROPOUT VOLTAGE vs JUNCTION TEMPERATURE VOUT = 2.7V (typ), VIN = 0.95 × VOUT (typ) TPS78227 GROUND PIN CURRENT vs INPUT VOLTAGE IOUT = 0mA, VOUT = 3.
PAGE 7
TPS782xx www.ti.com SBVS115B – AUGUST 2008 – REVISED MAY 2010 TYPICAL CHARACTERISTICS (continued) Over the operating temperature range of TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater; IOUT = 100mA, VEN = VIN, COUT = 1mF, and CIN = 1mF, unless otherwise noted. CURRENT LIMIT vs INPUT VOLTAGE VOUT = 95% VOUT (typ), VOUT = 2.7V (typ) TPS78227 ENABLE PIN CURRENT vs INPUT VOLTAGE IOUT = 100mA, VOUT = 2.7V TPS78227 300 2.0 290 1.8 1.6 270 1.
PAGE 8
TPS782xx SBVS115B – AUGUST 2008 – REVISED MAY 2010 www.ti.com TYPICAL CHARACTERISTICS (continued) Over the operating temperature range of TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater; IOUT = 100mA, VEN = VIN, COUT = 1mF, and CIN = 1mF, unless otherwise noted. %ΔVOUT vs JUNCTION TEMPERATURE VIN = 3.7V, VOUT = 2.7V (typ) TPS78227 OUTPUT SPECTRAL NOISE DENSITY vs FREQUENCY CIN = 1mF, COUT = 2.2mF, VIN = 3.2V TPS78227 Output Spectral Noise Density (mV/ÖHz) 3 %DVOUT (V) 2 1 0.
PAGE 9
TPS782xx www.ti.com SBVS115B – AUGUST 2008 – REVISED MAY 2010 TYPICAL CHARACTERISTICS (continued) Over the operating temperature range of TJ = –40°C to +125°C, VIN = VOUT(TYP) + 0.5V or 2.2V, whichever is greater; IOUT = 100mA, VEN = VIN, COUT = 1mF, and CIN = 1mF, unless otherwise noted. OUTPUT VOLTAGE vs ENABLE (SLOW RAMP) TPS78233 Load Current VIN = 5.5V VOUT = 3.3V IOUT = 150mA COUT = 10mF 0A 0V 0V VIN Load Current Time (1ms/div) Figure 17. Figure 18.
PAGE 10
TPS782xx SBVS115B – AUGUST 2008 – REVISED MAY 2010 www.ti.com APPLICATION INFORMATION APPLICATION EXAMPLES The TPS782 family of LDOs is factory-programmable to have a fixed output. Note that during startup or steady-state conditions, it is important that the EN pin voltage never exceed VIN + 0.3V. 4.2V to 5.5V VIN 2.7V IN VOUT OUT 1 mF 1mF TPS78227 On Off EN GND Figure 22. Typical Application Circuit The TPS782 series are designed to be stable with standard ceramic capacitors with values of 1.
PAGE 11
TPS782xx www.ti.com SBVS115B – AUGUST 2008 – REVISED MAY 2010 SHUTDOWN DROPOUT VOLTAGE The enable pin (EN) is active high and is compatible with standard and low-voltage CMOS levels. When shutdown capability is not required, EN should be connected to the IN pin, as shown in Figure 23. The TPS782 series, with internal active output pull-down circuitry, discharges the output to within 5% VOUT with a time (t) shown in Equation 1: The TPS782 series use a PMOS pass transistor to achieve low dropout.
PAGE 12
TPS782xx SBVS115B – AUGUST 2008 – REVISED MAY 2010 www.ti.com THERMAL INFORMATION THERMAL PROTECTION Thermal protection disables the device output when the junction temperature rises to approximately +160°C, allowing the device to cool. Once the junction temperature cools to approximately +140°C, the output circuitry is enabled. Depending on power dissipation, thermal resistance, and ambient temperature, the thermal protection circuit may cycle on and off again.
PAGE 13
TPS782xx www.ti.com SBVS115B – AUGUST 2008 – REVISED MAY 2010 REVISION HISTORY NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (September, 2008) to Revision B Page • Updated title of data sheet .................................................................................................................................................... 1 • Changed first bullet of Features list .................................................
PAGE 14
PACKAGE OPTION ADDENDUM www.ti.
PAGE 15
PACKAGE OPTION ADDENDUM www.ti.
PAGE 16
PACKAGE OPTION ADDENDUM www.ti.
PAGE 17
PACKAGE OPTION ADDENDUM www.ti.com 22-Nov-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
PAGE 18
PACKAGE MATERIALS INFORMATION www.ti.com 22-Nov-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing TPS78218DRVR SON DRV 6 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS78218DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS78222DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS78222DRVT SON DRV 6 250 179.
PAGE 19
PACKAGE MATERIALS INFORMATION www.ti.com 22-Nov-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS78230DDCR SOT DDC 5 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS78230DDCT SOT DDC 5 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3 TPS78230DRVR SON DRV 6 3000 179.0 8.4 2.2 2.2 1.2 4.0 8.0 Q2 TPS78230DRVT SON DRV 6 250 179.0 8.4 2.2 2.2 1.2 4.0 8.
PAGE 20
PACKAGE MATERIALS INFORMATION www.ti.com 22-Nov-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS78225DRVT SON DRV 6 250 203.0 203.0 35.0 TPS78227DDCR SOT DDC 5 3000 195.0 200.0 45.0 TPS78227DDCT SOT DDC 5 250 195.0 200.0 45.0 TPS78227DRVR SON DRV 6 3000 203.0 203.0 35.0 TPS78227DRVT SON DRV 6 250 203.0 203.0 35.0 TPS78228DDCR SOT DDC 5 3000 195.0 200.0 45.0 TPS78228DDCT SOT DDC 5 250 195.0 200.0 45.
PAGE 21
PAGE 22
PAGE 23
PAGE 24
PAGE 25
IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.