Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsPMICsPMIC - LDO voltage regulator Positive, fixed SOT 23 5

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FEATURES DESCRIPTION

APPLICATIONS

DBV PACKAGE

(TOP VIEW)

1IN

GND

OUT

Fixed Option

DBV PACKAGE

(TOP VIEW)

GND

OUT

Adjustable Option

TPS79328

RIPPLE REJECTION

FREQUENCY

OUT

GND

YEQ, YZQ

PACKAGE

(TOP VIEW)

10 100 1 k 10 k

100 k 1 M 10 M

Ripple Rejection (dB)

Frequency (Hz)

OUT

= 10 mA

= 3.8 V

OUT

= 10 µF

= 0.01 µF

OUT

= 200 mA

100

A3 A1

C3 C1

0.05

0.10

0.15

0.20

0.25

0.30

100 1 k 10 k 100 k

Frequency (Hz)

OUT

= 1 mA

= 3.8 V

OUT

= 2.2 µF

= 0.1 µF

OUT

= 200 mA

TPS79328

OUTPUT SPECTRAL NOISE DENSITY

FREQUENCY

Output Spectral Noise Density (µV/√Hz)

TPS793xx

SLVS348K – JULY 2001 – REVISED OCTOBER 2007

www.ti.com

ULTRALOW-NOISE, HIGH PSRR, FAST RF 200mA LOW-DROPOUT LINEAR

REGULATORS IN NanoStar™ WAFER CHIP SCALE AND SOT23

234

• 200mA RF Low-Dropout Regulator

The TPS793xx family of low-dropout (LDO)

With Enable

low-power linear voltage regulators features high

power-supply rejection ratio (PSRR), ultralow-noise,

• Available in Fixed Voltage Versions from 1.8V

fast start-up, and excellent line and load transient

to 4.75V and Adjustable (1.22V to 5.5V)

responses in NanoStar wafer chip scale and SOT23

• High PSRR (70dB at 10kHz)

packages. NanoStar packaging gives an ultrasmall

• Ultralow-Noise (32 μ V

RMS

, TPS79328)

footprint as well as an ultralow profile and package

weight, making it ideal for portable applications such

• Fast Start-Up Time (50 μ s)

as handsets and PDAs. Each device in the family is

• Stable With a 2.2 μ F Ceramic Capacitor

stable, with a small 2.2 μ F ceramic capacitor on the

• Excellent Load/Line Transient Response

output. The TPS793xx family uses an advanced,

proprietary BiCMOS fabrication process to yield

• Very Low Dropout Voltage (112mV at 200mA,

extremely low dropout voltages (for example, 112mV

TPS79330)

at 200mA, TPS79330). Each device achieves fast

• 5- and 6-Pin SOT23 (DBV) and NanoStar Wafer

start-up times (approximately 50 μ s with a 0.001 μ F

Chip Scale (YEQ, YZQ) Packages

bypass capacitor) while consuming very low

quiescent current (170 μ A typical). Moreover, when

the device is placed in standby mode, the supply

• RF: VCOs, Receivers, ADCs current is reduced to less than 1 μ A. The TPS79328

exhibits approximately 32 μ V

RMS

of output voltage

• Audio

noise at 2.8V output with a 0.1 μ F bypass capacitor.

• Cellular and Cordless Telephones

Applications with analog components that are

• Bluetooth

, Wireless LAN

noise-sensitive, such as portable RF electronics,

• Handheld Organizers, PDAs

benefit from the high PSRR and low-noise features

as well as the fast response time.

Figure 1.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2 NanoStar is a trademark of Texas Instruments.

3 Bluetooth is a registered trademark of Bluetooth SIG, Inc.

4 All other trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (20 pages)

PAGE 1
TPS793xx www.ti.com SLVS348K – JULY 2001 – REVISED OCTOBER 2007 ULTRALOW-NOISE, HIGH PSRR, FAST RF 200mA LOW-DROPOUT LINEAR REGULATORS IN NanoStar™ WAFER CHIP SCALE AND SOT23 FEATURES DESCRIPTION 1 • 200mA RF Low-Dropout Regulator With Enable • Available in Fixed Voltage Versions from 1.8V to 4.75V and Adjustable (1.22V to 5.5V) • High PSRR (70dB at 10kHz) • Ultralow-Noise (32μVRMS, TPS79328) • Fast Start-Up Time (50μs) • Stable With a 2.
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TPS793xx www.ti.com SLVS348K – JULY 2001 – REVISED OCTOBER 2007 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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TPS793xx www.ti.com SLVS348K – JULY 2001 – REVISED OCTOBER 2007 ELECTRICAL CHARACTERISTICS Over recommended operating temperature range TJ = –40°C to +125°C, VEN = VIN, VIN = VOUT(nom) + 1V (1), IOUT = 1mA, COUT = 10μF, CNR = 0.01μF (unless otherwise noted). Typical values are at +25°C. PARAMETER TEST CONDITIONS VIN Input voltage (1) IOUT Continuous output current VFB Internal reference (TPS79301) V 0 200 mA 1.225 VFB 1.250 V 5.5 – VDO V 2.8V < VIN < 5.5V 1.764 1.8 1.
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TPS793xx www.ti.com SLVS348K – JULY 2001 – REVISED OCTOBER 2007 FUNCTIONAL BLOCK DIAGRAMS ADJUSTABLE VERSION IN OUT UVLO 2.45V 59 k Current Sense ILIM GND R1 SHUTDOWN _ + FB EN R2 UVLO Thermal Shutdown Bandgap Reference 1.22V IN External to the Device QuickStart 250 kΩ Vref NR FIXED VERSION IN OUT UVLO 2.45V Current Sense GND SHUTDOWN ILIM _ R1 + EN UVLO R2 Thermal Shutdown R2 = 40 kΩ QuickStart Bandgap Reference 1.22V IN 250 kΩ Vref NR Table 1.
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TPS793xx www.ti.com SLVS348K – JULY 2001 – REVISED OCTOBER 2007 TYPICAL CHARACTERISTICS (SOT23 PACKAGE) TPS79328 OUTPUT VOLTAGE vs OUTPUT CURRENT TPS79328 OUTPUT VOLTAGE vs JUNCTION TEMPERATURE 2.805 250 2.805 VIN = 3.8 V COUT = 10 µF TJ = 25°C 2.804 2.803 VIN = 3.8 V COUT = 10 µF 2.800 VOUT (V) 2.800 2.799 IGND (µA) 2.795 2.801 2.790 IOUT = 200 mA 2.785 2.798 100 50 2.780 VIN = 3.8 V COUT = 10 µF 2.796 2.795 0 50 100 150 2.
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TPS793xx www.ti.com SLVS348K – JULY 2001 – REVISED OCTOBER 2007 TYPICAL CHARACTERISTICS (SOT23 PACKAGE) (continued) TPS79328 RIPPLE REJECTION vs FREQUENCY TPS79328 RIPPLE REJECTION vs FREQUENCY 100 90 90 IOUT = 200 mA Ripple Rejection (dB) 70 60 50 40 IOUT = 10 mA 30 20 VIN = 3.8 V COUT = 10 µF CNR = 0.
PAGE 7
TPS793xx www.ti.com SLVS348K – JULY 2001 – REVISED OCTOBER 2007 TYPICAL CHARACTERISTICS (SOT23 PACKAGE) (continued) TYPICAL REGIONS OF STABILITY EQUIVALENT SERIES RESISTANCE (ESR) vs OUTPUT CURRENT 100 COUT = 2.2 µF VIN = 5.5 V, VOUT ≥ 1.5 V TJ = −40°C to 125°C ESR, Equivalent Series Resistance (Ω) ESR, Equivalent Series Resistance (Ω) 100 TYPICAL REGIONS OF STABILITY EQUIVALENT SERIES RESISTANCE (ESR) vs OUTPUT CURRENT 10 Region of Instability 1 0.1 Region of Stability 0.
PAGE 8
TPS793xx www.ti.com SLVS348K – JULY 2001 – REVISED OCTOBER 2007 APPLICATION INFORMATION The TPS793xx family of low-dropout (LDO) regulators has been optimized for use in noise-sensitive battery-operated equipment. The device features extremely low dropout voltages, high PSRR, ultralow output noise, low quiescent current (170μA typically), and enable-input to reduce supply currents to less than 1μA when the regulator is turned off. A typical application circuit is shown in Figure 22.
PAGE 9
TPS793xx www.ti.com SLVS348K – JULY 2001 – REVISED OCTOBER 2007 Power Dissipation and Junction Temperature Specified regulator operation is assured to a junction temperature of +125°C; the maximum junction temperature should be restricted to +125°C under normal operating conditions. This restriction limits the power dissipation the regulator can handle in any given application.
PAGE 10
TPS793xx www.ti.com SLVS348K – JULY 2001 – REVISED OCTOBER 2007 OUTPUT VOLTAGE PROGRAMMING GUIDE VIN IN 1m F OUT TPS79301 EN NR GND 0.01mF VOUT R1 FB R2 C1 2.2mF OUTPUT VOLTAGE R1 R2 C1 1.22V short open 0pF 2.5V 31.6kW 30.1kW 22pF 3.3V 51kW 30.1kW 15pF 3.6V 59kW 30.1kW 15pF Figure 23.
PAGE 11
TPS793xx www.ti.com SLVS348K – JULY 2001 – REVISED OCTOBER 2007 TPS793xxYEQ, YZQ NanoStar™ Wafer Chip Scale Information 0,79 0,84 1,30 1,34 0.625 Max NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. NanoStar package configuration. NanoStar is a trademark of Texas Instruments. Figure 24.
PAGE 12
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 3-Jun-2014 (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined.
PAGE 17
PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) TPS79301DBVR SOT-23 DBV 6 3000 178.0 9.0 3.17 1.37 4.0 8.0 Q3 TPS79301DBVR SOT-23 DBV 6 3000 179.0 8.4 3.2 TPS79318DBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.2 1.4 4.0 8.0 Q3 3.17 1.37 4.0 8.0 TPS79318DBVT SOT-23 DBV 5 250 178.0 9.0 3.
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PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) TPS79333DBVR SOT-23 DBV 5 3000 178.0 9.0 TPS79333DBVR SOT-23 DBV 5 3000 179.0 8.4 TPS793475DBVR SOT-23 DBV 5 3000 178.0 TPS793475DBVR SOT-23 DBV 5 3000 179.0 W Pin1 (mm) Quadrant 3.23 3.17 1.37 4.0 8.0 Q3 3.2 3.2 1.4 4.0 8.0 Q3 9.0 3.23 3.17 1.37 4.0 8.0 Q3 8.4 3.2 3.2 1.4 4.0 8.
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PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS79328YZQR DSBGA YZQ 5 3000 217.0 193.0 35.0 TPS79328YZQT DSBGA YZQ 5 250 217.0 193.0 35.0 TPS79330DBVR SOT-23 DBV 5 3000 180.0 180.0 18.0 TPS79330YZQR DSBGA YZQ 5 3000 217.0 193.0 35.0 TPS79330YZQT DSBGA YZQ 5 250 217.0 193.0 35.0 TPS79333DBVR SOT-23 DBV 5 3000 180.0 180.0 18.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.