Datasheet

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VIN

MODE

GND

OUT

2.85 V @ 500mA

TPS82690SIP

BAT

3.25 V .. 4.35 V

MODE

SELECTION

ENABLE

DC/DC Converter

GND

0.1 1 10 100 1000

I - Load Current - mA

100

Efficiency - %

105

120

135

150

Power Loss - mW

V = 3.6 V,

V = 2.85 V

Efficiency

PFM/PWM Operation

Power Loss

PFM/PWM Operation

TPS82690

TPS82695

TPS82697

www.ti.com

SLVSA66B –JUNE 2011– REVISED FEBRUARY 2012

500-mA, HIGH-EFFICIENCY MicroSiP™ STEP-DOWN CONVERTER (PROFILE <1mm)

Check for Samples: TPS82690, TPS82695, TPS82697

FEATURES

DESCRIPTION

• Total Solution Size <6.7 mm

The TPS8269xSIP device is a complete 500mA,

• 95% Efficiency at 4MHz Operation

DC/DC step-down power supply intended for

low-power applications. Included in the package are

• 24μA Quiescent Current

the switching regulator, inductor and input/output

• High Duty-Cycle Operation

capacitors. No additional components are required to

• Best in Class Load and Line Transient

finish the design.

• ±2% Total DC Voltage Accuracy

The TPS8269xSIP is based on a high-frequency

• Automatic PFM/PWM Mode Switching

synchronous step-down dc-dc converter optimized for

battery-powered portable applications. The

• Low Ripple Light-Load PFM Mode

MicroSIP™ DC/DC converter operates at a regulated

• Excellent AC Load Regulation

4-MHz switching frequency and enters the

• Internal Soft Start, 130-µs Start-Up Time

power-save mode operation at light load currents to

• Integrated Active Power-Down Sequencing

maintain high efficiency over the entire load current

range.

(Optional)

• Current Overload and Thermal Shutdown

The PFM mode extends the battery life by reducing

Protection

the quiescent current to 24μA (typ) during light load

operation. For noise-sensitive applications, the device

• Sub 1-mm Profile Solution

has PWM spread spectrum capability providing a

lower noise regulated output, as well as low noise at

APPLICATIONS

the input. These features, combined with high PSRR

• LDO Replacement

and AC load regulation performance, make this

device suitable to replace a linear regulator to obtain

• Cell Phones, Smart-Phones

better power conversion efficiency.

• PoL Applications

The TPS8269xSIP is packaged in a compact (2.3mm

x 2.9mm) and low profile (1.0mm) BGA package

suitable for automated assembly by standard surface

mount equipment.

Figure 1. Typical Application

Figure 2. Efficiency vs. Load Current

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2MicroSiP, MicroSIP are trademarks of Texas Instruments.

UNLESS OTHERWISE NOTED this document contains

PRODUCTION DATA information current as of publication date.

Products conform to specifications per the terms of Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (26 pages)

PAGE 1
TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com 500-mA, HIGH-EFFICIENCY MicroSiP™ STEP-DOWN CONVERTER (PROFILE <1mm) Check for Samples: TPS82690, TPS82695, TPS82697 FEATURES 1 • • • • • • • • • • • 2 • • Total Solution Size <6.
PAGE 2
TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION (1) PART NUMBER TA -40°C to 85°C (2) (3) (4) DEVICE SPECIFIC FEATURE PACKAGE MARKING ORDERING (3) TPS82695 2.5V TPS82695SIP UF TPS82690 (4) 2.85V TPS82690SIP RC TPS82696 (4) 2.
PAGE 3
TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.
PAGE 4
TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com ELECTRICAL CHARACTERISTICS (continued) Minimum and maximum values are at VI = 2.3V to 4.35V, VO = 2.5V, EN = 1.8V, AUTO mode and TA = –40°C to 85°C; Circuit of Parameter Measurement Information section (unless otherwise noted). Typical values are at VI = 3.6V, VO = 2.5V, EN = 1.8V, AUTO mode and TA = 25°C (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 3.25V ≤ VI ≤ 4.
PAGE 5
TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com PIN ASSIGNMENTS SIP-8 (TOP VIEW) VOUT A1 A2 MODE B1 B2 GND C1 C2 A3 C3 SIP-8 (BOTTOM VIEW) VIN VIN EN EN GND GND A3 A1 VOUT B2 B1 MODE C2 C1 GND A2 C3 TERMINAL FUNCTIONS TERMINAL NAME VOUT I/O NO. DESCRIPTION A1 O Power output pin. Apply output load between this pin and GND. VIN A2, A3 I The VIN pins supply current to the TPS8269xSIP's internal regulator.
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TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.
PAGE 7
TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) TPS82695 EFFICIENCY vs LOAD CURRENT 100 TPS82695 EFFICIENCY vs LOAD CURRENT 100 VI = 3 V VO = 2.5 V 90 Forced PWM 90 80 80 VI = 3.2 V 70 Efficiency - % Efficiency - % 70 VI = 3.6 V 60 50 VI = 4.2 V 40 30 Forced PWM Operation 10 100 1 10 100 IO - Load Current - mA 1 10 100 IO - Load Current - mA Figure 3. Figure 4.
PAGE 8
TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) EFFICIENCY vs INPUT VOLTAGE PEAK-TO-PEAK OUTPUT RIPPLE VOLTAGE vs LOAD CURRENT 100 VO = 2.85 V 98 PFM/PWM Operation 96 IO = 100 mA IO = 300 mA 92 90 IO = 1 mA 88 IO = 10 mA 86 84 82 2.9 VO - Peak-to-Peak Output Ripple Voltage - mV 55 50 3.1 3.3 3.5 3.7 3.9 4.1 4.3 VI - Input Voltage - V 4.5 4.7 4.9 VI = 3.3 V 70 60 50 VI = 4.5 V 40 30 VI = 3.
PAGE 9
TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) DC OUTPUT VOLTAGE vs LOAD CURRENT DC OUTPUT VOLTAGE vs LOAD CURRENT 2.936 2.907 VI = 3 V, TA = 85°C VI = 3 V VI = 3 V, TA = 25°C VI = 3.2 V VI = 4.5 V 2.907 2.879 VO - Output Voltage - V VO - Output Voltage - V 2.879 VI = 3.2 V, TA = 25°C 2.85 VI = 3.1 V, TA = 85°C 2.822 VI = 3.2 V, TA = 85°C 2.793 VI = 3.6 V 2.85 2.822 VO = 2.85 V 2.793 CO (additional) = 4.
PAGE 10
TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION 10 to 400 mA Load Step VI = 3.6 V, VO = 2.85 V 5 to 250 mA Load Step MODE = Low VI = 3.6 V, VO = 2.85 V MODE = Low Figure 15. Figure 16. LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION LOAD TRANSIENT RESPONSE IN PFM/PWM OPERATION 10 to 400 mA Load Step 10 to 400 mA Load Step VI = 3.
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TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) AC LOAD TRANSIENT RESPONSE VI = 3.6 V, VO = 2.5 V AC LOAD TRANSIENT RESPONSE VI = 3.0 V, VO = 2.5 V 5 to 500 mA Load Sweep 5 to 500 mA Load Sweep MODE = Low MODE = Low Figure 19. Figure 20. AC LOAD TRANSIENT RESPONSE AC LOAD TRANSIENT RESPONSE VI = 2.85 V, VO = 2.5 V VI = 3.05 V, VO = 2.85 V 5 to 600 mA Load Sweep 5 to 600 mA Load Sweep MODE = Low Figure 21.
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TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) AC LOAD TRANSIENT RESPONSE VI = 3.15 V, VO = 2.85 V AC LOAD TRANSIENT RESPONSE VI = 3.6 V, VO = 2.85 V 5 to 500 mA Load Sweep 5 to 500 mA Load Sweep MODE = Low MODE = Low Figure 23. Figure 24. AC LOAD TRANSIENT RESPONSE PFM/PWM BOUNDARIES 280 VI = 3.6 V, VO = 2.85 V 260 VO = 2.85 V Always PWM 240 220 IO - Load Current - mA 5 to 500 mA Load Sweep MODE = Low CO = add. 4.
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TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) PWM SWITCHING FREQUENCY vs INPUT VOLTAGE 4.2 38 36 34 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 2 0 2.7 TA = 85°C 4 3.8 TA = 25°C fs - Switching Frequency - MHz IQ - Quiescent Current - mA QUIESCENT CURRENT vs INPUT VOLTAGE TA = -40°C 3.6 3.4 IO = 500 mA 3.2 3 IO = 300 mA 2.8 IO = 150 mA 2.6 IO = 50 mA 2.4 2.2 2 VO = 2.85 V MODE = High 1.8 3 3.3 3.6 3.9 4.
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TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) POWER SUPPLY REJECTION RATIO vs FREQUENCY START-UP VI = 3.6 V, VO = 2.85 V, RL = 39 W MODE = Low PSRR - Power Supply Rejection Ratio - dB 60 IO = 20 mA PWM Operation 55 50 45 40 IO = 250 mA 35 PWM Operation IO = 400 mA 30 PWM Operation 25 20 15 IO = 20 mA PFM Operation 10 5 0 0.1 1 Figure 31. 14 Submit Documentation Feedback 10 100 f - Frequency - kHz 1000 Figure 32.
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TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com DETAILED DESCRIPTION OPERATION The TPS8269xSIP is a standalone synchronous step-down converter operating at a regulated 4-MHz frequency pulse width modulation (PWM) at moderate to heavy load currents (up to 500mA output current). At light load currents, the TPS8269xSIP's converter operates in power-save mode with pulse frequency modulation (PFM).
PAGE 16
TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com MODE SELECTION The MODE pin allows to select the operating mode of the device. Connecting this pin to GND enables the automatic PWM and power-save mode operation. The converter operates in regulated frequency PWM mode at moderate to heavy loads and in the PFM mode during light loads, which maintains high efficiency over a wide load current range.
PAGE 17
TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com APPLICATION INFORMATION INPUT CAPACITOR SELECTION Because of the pulsating input current nature of the buck converter, a low ESR input capacitor is required to prevent large voltage transients that can cause misbehavior of the device or interference in other circuits in the system. For most applications, the input capacitor that is integrated into the TPS8269x should be sufficient.
PAGE 18
TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com LAYOUT CONSIDERATION In making the pad size for the SiP LGA balls, it is recommended that the layout use non-solder-mask defined (NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the opening size is defined by the copper pad width. Figure 34 shows the appropriate diameters for a MicroSiPTM layout. Figure 34.
PAGE 19
TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com THERMAL INFORMATION The die temperature of the TPS8269x must be lower than the maximum rating of 125°C, so care should be taken in the layout of the circuit to ensure good heat sinking of the TPS8269x.
PAGE 20
TPS82690 TPS82695 TPS82697 SLVSA66B – JUNE 2011 – REVISED FEBRUARY 2012 www.ti.com Note: Page numbers of current version may differ from previous versions. Changes from Original (June 2011) to Revision A • Page Deleted Product Preview status from TPS82695 device in Ordering Information table. ...................................................... 2 Changes from Revision A (October 2011) to Revision B Page • Added device number TPS82697 ................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 5-Dec-2013 (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line.
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PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS82695SIPR uSiP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.0 Q2 TPS82697SIPR uSiP SIP 8 3000 178.0 9.0 2.45 3.05 1.1 4.0 8.
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PACKAGE MATERIALS INFORMATION www.ti.com 5-Dec-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS82695SIPR uSiP SIP 8 3000 223.0 194.0 35.0 TPS82697SIPR uSiP SIP 8 3000 223.0 194.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.