Datasheet

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381

GND

Exposed

Center Pad

(GND)

SEL

GND

1 1

5 1

1 2

5 2

3 1

7 1

3 2

7 2

0 2

4 2

2 1

6 1

2 2

6 2

TS2PCIE412

www.ti.com

SCDS269C –MARCH 2009–REVISED APRIL 2010

4-CHANNEL 8:16 MULTIPLEXER/DEMULTIPLEXER PCI EXPRESS SWITCH

Check for Samples: TS2PCIE412

FEATURES

RUA PACKAGE

• Compatible With PCI Express (PCIe) Standard

(TOP VIEW)

• Wide Bandwidth of over 3 Gbps

• Low Crosstalk (X

TALK

= –32 dB Typ at

1.25 GHz)

• O

IRR

= –36.3 dB Typical at 1.25 GHz

• Low Bit-to-Bit Skew (t

sk(O)

= 0.06 ns Typical)

• V

Operating Range: 1.5 V to 2 V

• I

off

Supports Partial Power-Down Mode

Operation

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Performance Tested Per JESD 22

– 2000-V Human-Body Model

(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

APPLICATIONS

• PCIe Bus Multiplexing and Expansion

• Routing PCI Express Data and/or Display Port

Signals

• Notebook PCs

• Desktop PCs

• Servers/Storage Area Networks

If the exposed center pad is used, it must

be connected to ground.

DESCRIPTION/ ORDERING INFORMATION

The TS2PCIE412 is a 4-channel PCIe 2:1 multiplexer/demultiplexer switch that can be used to route one PCIe

data lane between two possible destinations or two PCIe data lanes to one destination. Each channel consists of

differential pairs of receive (RX) and transmit (TX) signals and operates at a signal-processing bandwidth speed,

which supports the PCIe standard of 2.5 Gbps. The device is controlled with one select input (SEL) pin, where

SEL controls the data path of the multiplexer/demultiplexer and can be connected to any GPIO in the system.

The unselected channel is set in a high-impedance state.

ORDERING INFORMATION

PACKAGE

(1) (2)

ORDERABLE PART NUMBER TOP-SIDE MARKING

–40°C to 85°C QFN – RUA Tape and reel TS2PCIE412RUAR SH412

(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (17 pages)

PAGE 1
TS2PCIE412 www.ti.
PAGE 2
TS2PCIE412 SCDS269C – MARCH 2009 – REVISED APRIL 2010 www.ti.com FUNCTION TABLE SEL FUNCTION L An to nB1 H An to nB2 FUNCTIONAL DIAGRAM A0 A1 A2 A3 2 38 3 37 6 36 7 35 34 33 32 31 A4 A5 A6 A7 11 29 12 28 15 27 16 26 25 24 23 22 9 0B1 1B1 2B1 3B1 0B2 1B2 2B2 3B2 4B1 5B1 6B1 7B1 4B2 5B2 6B2 7B2 Control Logic SEL TERMINAL FUNCTIONS TERMINAL 2 I/O DESCRIPTION NAME NO.
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TS2PCIE412 www.ti.com SCDS269C – MARCH 2009 – REVISED APRIL 2010 ABSOLUTE MAXIMUM RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX –0.5 2.5 V (3) –0.5 2.5 V (3) (4) –0.5 2.
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TS2PCIE412 SCDS269C – MARCH 2009 – REVISED APRIL 2010 www.ti.com ELECTRICAL CHARACTERISTICS FOR 1.8-V SUPPLY (1) VDD = 1.5 V to 2.0 V, TA = –40°C to 85°C (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP (2) MAX –0.7 –1.3 V UNIT VIK SEL VDD = 2.0 V, IIN = –18 mA IIH SEL VDD = 2.0 V, VIN = VDD ±1 mA IIL SEL VDD =2.0 V, VIN = GND ±1 mA Ioff VDD = 0, VO = 0 to 2 V, VI = 0 1 mA ICC VDD = 2.
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TS2PCIE412 www.ti.com SCDS269C – MARCH 2009 – REVISED APRIL 2010 TYPICAL PERFORMANCE 0 –1 –3 Gain at –3 dB: 2.1 GHz Magnitude (dB) –5 –7 –9 –11 –13 1 10 100 1000 10000 Frequency (MHz) Figure 1. Frequency Response (Insertion Loss) –20 –30 OIRR at 1.25 GHz: –36.3 dB –40 Magnitude (dB) –50 –60 –70 OIRR at 10 MHz: –73.7 dB –80 –90 –100 1 10 100 1000 10000 Frequency (MHz) Figure 2.
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TS2PCIE412 SCDS269C – MARCH 2009 – REVISED APRIL 2010 www.ti.com TYPICAL PERFORMANCE (continued) -20 -30 XTALK at 1.25 GHz: –31.9 dB -40 Magnitude (dB) -50 -60 -70 -80 XTALK at 10 MHz: –80.4 dB -90 -100 1 10 100 1000 10000 Frequency (MHz) Figure 3. Crosstalk vs Frequency Eye Diagrams 10-inch trace board for real implementation, VDD = 1.8 V, f = 1.25 GHz, transitional signal and non-transitional signal eye from Tektronix TDS6154C and Tektronix RT-Eye＝ software Figure 4.
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TS2PCIE412 www.ti.com SCDS269C – MARCH 2009 – REVISED APRIL 2010 TYPICAL PERFORMANCE (continued) 10-inch trace board for real implementation, VDD = 1.8 V, f = 1.25 GHz, transitional signal and non-transitional signal eye from Tektronix TDS6154C and Tektronix RT-Eye＝ software Figure 5.
PAGE 8
TS2PCIE412 SCDS269C – MARCH 2009 – REVISED APRIL 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (Enable and Disable Times) VDD Input Generator VSEL 50 Ω 50 Ω VG1 TEST CIRCUIT DUT Input Generator VI 50 Ω CL (see Note A) 50 Ω VDD S1 RL VI CL V∆ 1.5 V to 2 V 2 × VDD 200 Ω GND 10 pF 0.15 V tPHZ/tPZH 1.5 V to 2 V GND 200 Ω VDD 10 pF 0.
PAGE 9
TS2PCIE412 www.ti.com SCDS269C – MARCH 2009 – REVISED APRIL 2010 PARAMETER MEASUREMENT INFORMATION (Skew) VDD Input Generator VSEL 50 Ω 50 Ω VG1 TEST CIRCUIT DUT 2 × VDD Input Generator 50 Ω tsk(o) VDD tsk(p) RL S1 RL VSEL CL 1.5 V to 2 V Open 200 Ω VDD or GND 10 pF 1.
PAGE 10
TS2PCIE412 SCDS269C – MARCH 2009 – REVISED APRIL 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC 0B1 A0 SEL DUT VSEL Figure 8. Test Circuit for Frequency Response (BW) Frequency response is measured at the output of the ON channel. For example, when VSEL = 0 V and A0 is the input, the output is measured at 0B1. All unused analog I/O ports are left open. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.
PAGE 11
TS2PCIE412 www.ti.com SCDS269C – MARCH 2009 – REVISED APRIL 2010 PARAMETER MEASUREMENT INFORMATION (continued) EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC A0 0B1 RL = 50 Ω A1 1B1 0B2 DUT A2 1B2 2B1 RL = 50 Ω A3 3B1 2B2 3B2 SEL VSEL Figure 9. Test Circuit for Crosstalk (XTALK) Crosstalk is measured at the input of the nonadjacent ON channel. For example, when VSEL = 0 V and A1 is the input, the output is measured at A3.
PAGE 12
TS2PCIE412 SCDS269C – MARCH 2009 – REVISED APRIL 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC A0 0B1 RL = 50 Ω A1 1B1 DUT 0B2 1B2 SEL VSEL Figure 10. Test Circuit for Off Isolation (OIRR) OFF isolation is measured at the output of the OFF channel. For example, when VSEL = 0 V and A1 is the input, the output is measured at 1B2.
PAGE 13
PACKAGE OPTION ADDENDUM www.ti.com 20-May-2013 PACKAGING INFORMATION Orderable Device Status (1) TS2PCIE412RUAR ACTIVE Package Type Package Pins Package Drawing Qty WQFN RUA 42 3000 Eco Plan Lead/Ball Finish (2) TBD MSL Peak Temp Op Temp (°C) Device Marking (3) Call TI Call TI (4/5) -40 to 85 SH412 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.