Datasheet

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TS3DV20812

www.ti.com

SCDS302 –JUNE 2010

2-Gbps DIFFERENTIAL SWITCH 8-Bit, 1:2 MULTIPLEXER/DEMULTIPLEXER

WITH 3-SIDE BAND SIGNALS

Check for Samples: TS3DV20812

FEATURES

APPLICATIONS

• HDMI/DVI Video MUX

• Four High-Speed Bidirectional Differential Pair

Channel MUX/DEMUX

• Panel LVDS Bus MUX

• LVDS, LVPECL, CML

• Supports up to 2 Gbps Data Rate

• Analog Signals VGA

• V

Operating Range 2.5 V or 3.3

• Gigabit LAN Signal MUX

– -0 V to 3.3 V Rail To Rail at 2.5 V

• Serial Backplane Signal MUX

– -0 V to 5 V Rail To Rail at 3.3V

• Optical Module

• I

OFF

partial Powerdown and Back-Drive

• Central Office Telecommunication

Protection.

• Wireless Base Station

• 5-V Input Tolerant on Control Pin

• High-Speed Logic Data I/O MUX

• Supports Both AC- and DC-Coupled Signals

• Low Crosstalk: -38 dB at 825 MHz,

RHH PACKAGE

(TOP VIEW)

2.5 V or 3.3 V

• Insertion Loss: -1.5 dB at 825 MHz,

2.5 V or 3.3 V

• Off Isolation -24.67 dB at 825 MHz

• Low Bit-to-Bit Skew within Pair 5 ps Maximum

• Channel-to-Channel Skew: 30 ps Maximum

• Propagation Delay Times: 250 ps Maximum

• ESD Performance Tested per JESD 22

– 2000-V Human Body Model

(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

DESCRIPTION/ORDERING INFORMATION

TS3DV20812 is a High Speed Data Rate up to 2Gbps for Differential Signal Passive bi-directional Multiplexer

and De-multiplexer for I/O rails up to 5V Level with Low Crosstalk and Insertion Loss.

TS3DV20812 can be used in either HDMI/DVI sink side or source side with 4-differential pair supporting the high

speed and control pins.

The Ioff and back drive protection allowing to connect the external cable and prevent the back flow current when

the Vcc is into 0V.

The 3 side band signals can be used in DDC (SDAL, SCL) and CEC Signal MUX.

TS3DS20812 is characterized for operation from -40C to 85C.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (22 pages)

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TS3DV20812 www.ti.com SCDS302 – JUNE 2010 2-Gbps DIFFERENTIAL SWITCH 8-Bit, 1:2 MULTIPLEXER/DEMULTIPLEXER WITH 3-SIDE BAND SIGNALS Check for Samples: TS3DV20812 FEATURES APPLICATIONS • • • • • • • • • • • 1 • • • • • • • • • • • • Four High-Speed Bidirectional Differential Pair Channel MUX/DEMUX Supports up to 2 Gbps Data Rate VDD Operating Range 2.5 V or 3.3 – -0 V to 3.3 V Rail To Rail at 2.5 V – -0 V to 5 V Rail To Rail at 3.3V IOFF partial Powerdown and Back-Drive Protection.
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TS3DV20812 SCDS302 – JUNE 2010 www.ti.com Table 1. ORDERING INFORMATION PACKAGE (1) TA –40°C to 85°C (1) (2) QFN – RHH (2) ORDERABLE PART NUMBER Tape and reel TS3DV20812RHH TOP-SIDE MARKING TBD Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com.
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TS3DV20812 www.ti.com SCDS302 – JUNE 2010 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VDD Supply voltage range VIN Control input voltage range (2) (3) VIO Switch I/O voltage range (all three I/O ports) (4) MIN MAX –0.5 4.6 V SEL –0.5 7 V I/O –0.5 7 V D0-D3, Aux, HPD, CAD/CEC –0.5 VCC + 0.5 V A port and B port –0.5 VCC + 0.
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TS3DV20812 SCDS302 – JUNE 2010 www.ti.com ELECTRICAL CHARACTERISTICS for high-frequency switching over recommended operating free-air temperature range VDD = 3.3 V ± 0.3 V (unless otherwise noted) TEST CONDITIONS (1) PARAMETER VIK SEL VDD = 3.6 V, IIN = –18 mA IIH SEL VDD = 3.6 V, VIN = VDD IIL SEL VDD = 3.6 V, VIN = GND VDD = 06 V, VO = 0 to 3.6 V , VI = 0 , VIN = 0 Switch ON or OFF IOFF ICC MIN TYP (2) MAX –0.7 –1.2 V ±1 mA ±1 mA 1 mA 250 500 mA 2 2.
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TS3DV20812 www.ti.com SCDS302 – JUNE 2010 SWITCHING CHARACTERISTICS over recommended operating free-air temperature range, VDD = 3.3 V ± 0.3 V, RL = 200 Ω, CL = 10 pF (unless otherwise noted) (see Figure 9 and Figure 10) MIN TYP (1) FROM (INPUT) TO (OUTPUT) tpd (2) Dn DA or DB tPZH, tPZL SEL DA or DB 0.5 15 ns tPHZ, tPLZ SEL DA or DB 0.
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TS3DV20812 SCDS302 – JUNE 2010 www.ti.com DYNAMIC CHARACTERISTICS over recommended operating free-air temperature range, VDD = 3.3 V ± 0.3 V, RL = 50 Ω, CL = 10 pF (unless otherwise noted) PARAMETER TEST CONDITIONS TYP UNIT XTALK Differential crosstalk 825 MHz, 1.65Gbps, RL = 50 Ω, CL = 10 pF, see Figure 11 -34.67 dB OIRR Differential OFF isolation 825 MHz, 1.65Gbps, RL = 50 Ω, CL = 10 pF, see Figure 12 -19.09 dB ILOSS Differential insertion loss 825 MHz, 1.
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TS3DV20812 www.ti.com SCDS302 – JUNE 2010 TYPICAL PERFORMANCE Figure 1. Differential Gain vs Frequency Figure 2. Differential Off Isolation vs Frequency Figure 3. Differential Crosstalk vs Frequency Figure 4.
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TS3DV20812 SCDS302 – JUNE 2010 www.ti.com APPLICATION INFORMATION Figure 5. Typical Application Switching HDMI 1.
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TS3DV20812 www.ti.com SCDS302 – JUNE 2010 Figure 6. Typical Application for Dual LVDS A. The switch already has IOFF circuit and it will reduce the current flow leakage limit to 10 mA maximum and it will prevent the damage from back drive current flow from the power-on circuit. Figure 7.
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TS3DV20812 SCDS302 – JUNE 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION Figure 8.
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TS3DV20812 www.ti.com SCDS302 – JUNE 2010 PARAMETER MEASUREMENT INFORMATION (continued) Figure 9.
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TS3DV20812 SCDS302 – JUNE 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) Figure 10.
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TS3DV20812 www.ti.com SCDS302 – JUNE 2010 PARAMETER MEASUREMENT INFORMATION (continued) Figure 11.
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TS3DV20812 SCDS302 – JUNE 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) Figure 12.
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TS3DV20812 www.ti.com SCDS302 – JUNE 2010 PARAMETER MEASUREMENT INFORMATION (continued) Figure 13.
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PACKAGE OPTION ADDENDUM www.ti.com 20-May-2013 PACKAGING INFORMATION Orderable Device Status (1) TS3DV20812RHHR ACTIVE Package Type Package Pins Package Drawing Qty VQFN RHH 36 2500 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) MSL Peak Temp Op Temp (°C) Device Marking (3) CU NIPDAU Level-3-260C-168 HR (4/5) -40 to 85 SY812 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS3DV20812RHHR Package Package Pins Type Drawing VQFN RHH 36 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 2500 330.0 16.4 Pack Materials-Page 1 6.3 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 6.3 1.5 12.0 16.
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PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3DV20812RHHR VQFN RHH 36 2500 367.0 367.0 38.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.