Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsLinear ICsLinear IC - Video editing Video switcher WQFN 42 (3.5x9.0)

Primary HDMI Source

Primary Source

DDC & CEC or

Aux & HPD

TS3DV621

Data

Channel

HDMI Receiver

Graphic

Processor

Secondary Source

DDC & CEC or

Aux & HPD

Secondary HDMI or

DisplayPort Source

TS3DV621

Sideband

Video Imaging

Processor

Display

TS3DV621

www.ti.com

SCDS330C –JANUARY 2012–REVISED MAY 2013

12-Channel 1:2 MUX/DEMUX Switch with Integrated 4-Channel Sideband Signal Switching

for DVI/HDMI and DisplayPort (DP) Applications

Check for Samples: TS3DV621

FEATURES

APPLICATIONS

• Switch Type: 2:1 or 1:2 • DVI/HDMI/DisplayPort Signal Switching

• Data Rate Compatibility • General Purpose TMDS/LVDS Signal Switching

– HDMI v1.4 spacer

DESCRIPTION

– DVI 1.0

The TS3DV621 is a 1:2 or 2:1 bi-directional

– DisplayPort 1.1a

multiplexer/demultiplexer with a integrated 4 side-

• Bandwidth (-3dB) – 2.2 GHz

band control channel (DDC, AUX, CEC, or HPD)

• R

– 8 Ω

signal switcher. Operating from a 3 to 3.6V supply,

the TS3DV621 offers low and flat ON-state resistance

• C

– 5.6 pF

as well as low I/O capacitance, which allows the

• V

Range – 3.0V–3.6 V

TS3DV621 to achieve a typical bandwidth of 2.2

• I/O Voltage Range – 0–5 V

GHz. The device provides the high bandwidth

necessary for HDMI, DVI, and DisplayPort

• Bit-to-Bit Skew – 6 ps Typical

applications. The TS3DV621 expands the high-speed

• Propagation Delay – 40 ps Typical

physical link interface from a single HDMI port to two

• Special Features

HDMI ports (A or B port) or vise-versa. It can also be

used for DisplayPort (DP) source/sink applications.

– Dedicated Enable Logic Supports Hi-Z

The integrated side-band control channels allow 5V

Mode

signals to pass through, making the TS3DV621

– I

OFF

Protection Prevents Current Leakage in

suitable for HDMI applications.

Powered Down State (V

= 0 V)

The most common application for the TS3DV621 is

• ESD Performance

the sink application. In this case, there are two

– 2kV Human Body Model (A114B, Class II)

possible sources (DVD, set-top box, or game

– 1kV Charged Device Model (C101)

console) that are routed to one receiver. The

unselected port is in the high-impedance mode, such

• 42-pin QFN Package (9 x 3.5 mm, 0.5 mm

that the receiver receives information from only one

Pitch)

source. HDCP encryption is passed through the

switch for the receiver to decode.

ORDERING INFORMATION

For package and ordering information, see the Package Option Addendum at the end of this document.

Figure 1. Multiplexing Dual Video Input Source (HDMI/DisplayPort)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (21 pages)

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TS3DV621 www.ti.com SCDS330C – JANUARY 2012 – REVISED MAY 2013 12-Channel 1:2 MUX/DEMUX Switch with Integrated 4-Channel Sideband Signal Switching for DVI/HDMI and DisplayPort (DP) Applications Check for Samples: TS3DV621 FEATURES APPLICATIONS • • • • 1 • • • • • • • • • • Switch Type: 2:1 or 1:2 Data Rate Compatibility – HDMI v1.4 – DVI 1.0 – DisplayPort 1.1a Bandwidth (-3dB) – 2.2 GHz RON – 8 Ω CON – 5.6 pF VCC Range – 3.0V–3.
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TS3DV621 SCDS330C – JANUARY 2012 – REVISED MAY 2013 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure.
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TS3DV621 www.ti.com SCDS330C – JANUARY 2012 – REVISED MAY 2013 LOGIC DIAGRAM D0+ D0+A D0– D0–A D1+ D1+A D1– D1–A D2+ D2+A D2– D3+ D2–A D3+A D3– D3–A D0+B D0–B D1+B D1–B D2+B D2–B D3+B D3–B AUX+ AUX+A AUX– AUX–A HPD HPDA CEC CECA AUX+B AUX–B HPDB CECB EN Control Logic SEL1 SEL2 Table 1.
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TS3DV621 SCDS330C – JANUARY 2012 – REVISED MAY 2013 www.ti.com APPLICATION EXAMPLES HDMI Transmitter 1 D0+A D0-A D1+A D1-A D2+A D2-A D3+A D3-A DDC CLK _A DDC DATA _A CEC_A HPD_A TS3DV621 HDMI Switch HDMI Transmitter 1 D0+B D0-B D1+B D1-B D2+B D2-B D3+B D3-B DDC CLK _B DDC DATA _B CEC_B HPD_B D0+ D0D1+ D1D2+ D2D3+ D3DDC CLK DDC DATA CEC HPD Display HDMI HDMI Scalar/ (DLP, LCD, TV, Receiver Video Decoder PDP, HDTV) Figure 2.
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TS3DV621 www.ti.com SCDS330C – JANUARY 2012 – REVISED MAY 2013 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range -0.5 4.6 V VI/O Analog voltage range (2) (3) (4) All I/O –0.5 7 V VIN Digital input voltage range (2) (3) SEL1, SEL2 –0.
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TS3DV621 SCDS330C – JANUARY 2012 – REVISED MAY 2013 www.ti.com ELECTRICAL CHARACTERISTICS TEST CONDITIONS (1) PARAMETER MIN TYP (2) VIK Digital input clamp voltage SEL1,SEL2 VCC = 3.6 V, IIN = -18 mA – 1. 2 RON On-state resistance All I/O VCC = 3 V, 1.5 V ≤ VI/O ≤ VCC, II/O = –40 mA RON(flat) (3) On-state resistance flatness All I/O VCC = 3 V, VI/O = 1.5 V and VCC, II/O = –40mA 1.5 ΔRON (4) On-state resistance match between channels All I/O VCC = 3 V, 1.
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TS3DV621 www.ti.com SCDS330C – JANUARY 2012 – REVISED MAY 2013 OPERATING CHARACTERISTICS 0 0 -20 -2 Attenuation - dB Attenuation - dB -40 -4 -6 -60 -80 -8 -100 -10 -120 -12 1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10 f - Frequency - Hz Figure 4. Gain vs Frequency -140 1.00E+05 1.00E+06 1.00E+07 1.00E+08 1.00E+09 1.00E+10 f - Frequency - Hz Figure 5. Off Isolation vs Frequency 9.0 0 8.8 -20 8.6 8.4 RON - W Attenuation - dB -40 -60 -80 8.2 8.0 -100 7.8 -120 7.6 -140 1.
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TS3DV621 SCDS330C – JANUARY 2012 – REVISED MAY 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION Enable and Disable Times VDD Input Generator VIN 50 Ω 50 Ω VG1 TEST CIRCUIT DUT 2 × VDD Input Generator S1 RL VO VI GND 50 Ω CL (see Note A) 50 Ω VG2 RL TEST VDD S1 RL Vin CL V∆ t PLZ/t PZL 3.3 V ± 0.3 V 2 × VDD 200 Ω GND 4 pF 0.3 V t PHZ/t PZH 3.3 V ± 0.3 V GND 200 Ω VDD 4 pF 0.3 V VSEL VO 3.33 V Output Control (VIN) 1.65 V 1.
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TS3DV621 www.ti.com SCDS330C – JANUARY 2012 – REVISED MAY 2013 PARAMETER MEASUREMENT INFORMATION (continued) Skew VDD Input Generator VSEL 50 Ω 50 Ω VG1 TEST CIRCUIT DUT 2 × VDD Input Generator 50 Ω t sk(o) t sk(p) RL S1 RL Vin CL 3.3 V ± 0.3 V Open 200 Ω VCC or GND 4 pF 3.3 V ± 0.3V Open 200 Ω VCC or GND 4 pF VCC 3.5 V 2.5 V 1.
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TS3DV621 SCDS330C – JANUARY 2012 – REVISED MAY 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC AX BX DUT SEL VSEL Figure 10. Test Circuit for Frequency Response (BW) Frequency response is measured at the output of the ON channel. For example, when VSEL = 0 and A0 is the input, the output is measured at B0. All unused analog I/O ports are left open. HP8753ES Setup Average = 4 RBW = 3 kHz VBIAS = 0.
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TS3DV621 www.ti.com SCDS330C – JANUARY 2012 – REVISED MAY 2013 PARAMETER MEASUREMENT INFORMATION (continued) EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VCC A0 BX RL = 50 W A1 BX BX BX A2 BX RL = 50 W A3 BX BX SEL BX VSEL A. CL includes probe and jig capacitance. B. A 50 W termination resistor is needed to match the loading of the network analyzer. Figure 11. Test Circuit for Crosstalk (XTALK) Crosstalk is measured at the output of the nonadjacent ON channel.
PAGE 12
TS3DV621 SCDS330C – JANUARY 2012 – REVISED MAY 2013 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) EXT TRIGGER BIAS VBIAS Network Analyzer (HP8753ES) P1 P2 VDD A0 0B1 RL = 50 W A1 1B1 DUT 0B2 1BX2 SEL VSEL A. CL includes probe and jig capacitance. B. A 50 W termination resistor is needed to match the loading of the network analyzer. Figure 12. Test Circuit for OFF Isolation (OIRR) OFF isolation is measured at the output of the OFF channel.
PAGE 13
TS3DV621 www.ti.com SCDS330C – JANUARY 2012 – REVISED MAY 2013 REVISION HISTORY Changes from Original (January 2012) to Revision A Page • Changed CON value in FEATURES from 5.6 pF to 4 pF. ..................................................................................................... 1 • Deleted LEVEL-SHIFTING REQUIREMENT FOR DUAL-MODE DP/HDMI APPLICATION section from document. ......... 4 • Added CON TYP value to the ELECTRICAL CHARACTERISTICS table. .........................................
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PACKAGE OPTION ADDENDUM www.ti.com 18-Oct-2013 PACKAGING INFORMATION Orderable Device Status (1) TS3DV621RUAR ACTIVE Package Type Package Pins Package Drawing Qty WQFN RUA 42 3000 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) CU NIPDAU | Call TI Level-1-260C-UNLIM Op Temp (°C) Device Marking (4/5) -40 to 85 SD621 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE MATERIALS INFORMATION www.ti.com 4-Jun-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS3DV621RUAR Package Package Pins Type Drawing WQFN RUA 42 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 330.0 16.4 Pack Materials-Page 1 3.8 B0 (mm) K0 (mm) P1 (mm) 9.3 1.0 8.0 W Pin1 (mm) Quadrant 16.
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PACKAGE MATERIALS INFORMATION www.ti.com 4-Jun-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3DV621RUAR WQFN RUA 42 3000 358.0 335.0 35.
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