Datasheet

ManualsBrandsTEXAS INSTRUMENTS ManualsInterface ICsInterface IC - analogue switches UQFN 10

D+

D–

1D+

1D–

2D+

2D–

GND

D+

D–

1D+

1D–

2D+

2D–

GND

TS3USB221A-Q1

www.ti.com

SCDS300 –JULY 2010

ESD PROTECTED, HIGH-SPEED USB 2.0 (480-Mbps)

1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE

Check for Samples: TS3USB221A-Q1

FEATURES

• Qualified for Automotive Applications • ESD Performance Tested Per JESD 22

• V

Operation at 2.5 V to 3.3 V – 7000-V Human-Body Model

(A114-B, Class II)

• V

I/O

Accepts Signals Up to 5.5 V

– 1000-V Charged-Device Model (C101)

• 1.8-V Compatible Control-Pin Inputs

• ESD Performance I/O to GND

• Low-Power Mode When OE Is Disabled (1 mA)

– 12-kV Human-Body Model

• r

= 16 Ω Maximum

• Δr

= 0.2 Ω Typical

APPLICATIONS

• C

io(on)

= 6 pF Typical

• Routes Signals for USB 1.0, 1.1, and 2.0

• Low Power Consumption (30 mA Maximum)

• High Bandwidth (900 MHz Typical)

RSE PACKAGE RSE PACKAGE

(TOP VIEW) (BOTTOM VIEW)

DESCRIPTION

The TS3USB221A is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals

in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or

controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with

minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of

two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals

at the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible

with various standards, such as high-speed USB 2.0 (480 Mbps).

The TS3USB221A integrates ESD protection cells on all pins, is available in a tiny mQFN package (2.0 mm × 1.5

mm) and is charaterized over the free air temperature range from –40°C to 125°C.

ORDERING INFORMATION

(1)

PACKAGE

(2)

ORDERABLE PART NUMBER TOP-SIDE MARKING

–40°C to 125°C QFN – RSE Reel of 3000 TS3USB221AQRSERQ1 OFW

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (19 pages)

PAGE 1
TS3USB221A-Q1 www.ti.com SCDS300 – JULY 2010 ESD PROTECTED, HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE Check for Samples: TS3USB221A-Q1 FEATURES 1 • • • • • • • • • • Qualified for Automotive Applications VCC Operation at 2.5 V to 3.3 V VI/O Accepts Signals Up to 5.5 V 1.8-V Compatible Control-Pin Inputs Low-Power Mode When OE Is Disabled (1 mA) rON = 16 Ω Maximum ΔrON = 0.
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TS3USB221A-Q1 SCDS300 – JULY 2010 www.ti.com PIN DESCRIPTION NAME DESCRIPTION OE Bus-switch enable S Select input D Bus A nD Bus B TRUTH TABLE S OE FUNCTION X H Disconnect L L D = 1D H L D = 2D BLOCK DIAGRAM D+ 1D+ D− 1D− 2D+ 2D− S OE SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW) A B VCC Charge Pump EN (see Note A) A. 2 EN is the internal enable signal applied to the switch.
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TS3USB221A-Q1 www.ti.com SCDS300 – JULY 2010 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range VIN Control input voltage range (2) VI/O Switch I/O voltage range (2) IIK Control input clamp current VIN < 0 II/OK I/O port clamp current VI/O < 0 II/O ON-state switch current (5) Continuous current through VCC or GND ±100 mA 150 °C Tstg (1) (2) (3) (4) (5) –0.5 4.6 V (3) –0.5 7 V (3) (4) –0.
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TS3USB221A-Q1 SCDS300 – JULY 2010 www.ti.com ELECTRICAL CHARACTERISTICS (1) over operating free-air temperature range (unless otherwise noted) PARAMETER VIK Control inputs IIN IOZ (3) TEST CONDITIONS MIN TYP (2) MAX UNIT –1.8 V VCC = 3.6 V, 2.7 V, II = –18 mA VCC = 3.6 V, 2.7 V, 0 V, VIN = 0 V to 3.6 V ±1 mA VCC = 3.6 V, 2.7 V, VO = 0 V to 5.25 V, VI = 0 V, VIN = VCC or GND, Switch OFF ±1 mA VI/O = 0 V to 5.25 V ±2 VI/O = 0 V to 3.6 V ±2 I(OFF) VCC = 0 V VI/O = 0 V to 2.
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TS3USB221A-Q1 www.ti.com SCDS300 – JULY 2010 DYNAMIC ELECTRICAL CHARACTERISTICS over operating range, TA = –40°C to 125°C, VCC = 2.5 V ±10%, GND = 0 V PARAMETER TEST CONDITIONS TYP UNIT dB XTALK Crosstalk RL = 50 , f = 250 MHz -39 OIRR OFF isolation RL = 50 , f = 250 MHz -40 dB BW Bandwidth (3 dB) RL = 50 0.9 GHz SWITCHING CHARACTERISTICS over operating range, TA = –40°C to 125°C, VCC = 3.3 V ±10%, GND = 0 V PARAMETER tpd Propagation delay MIN (2) (3) TYP (1) MAX 0.
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TS3USB221A-Q1 SCDS300 – JULY 2010 www.ti.com APPLICATION INFORMATION 0 0 –1 –20 Attenuation (dB) Gain (dB) –2 –3 –4 –40 –60 –80 –5 –100 –6 –120 –7 100.0E+3 100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 1.0E+6 10.0E+6 1.0E+9 10.0E+9 Frequency (Hz) Frequency (Hz) Figure 1. Gain vs Frequency Figure 2. OFF Isolation vs Frequency 0 3.5 –20 3.4 3.3 –40 VCC = 3 V ron (Ω) Attenuation (dB) 100.0E+6 10.0E+9 –60 3.2 VCC = 2.3 V 3.1 –80 3.0 –100 2.9 –120 2.8 100.0E+3 1.
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TS3USB221A-Q1 www.ti.com SCDS300 – JULY 2010 3.5 3.4 3.3 ron (Ω) VCC = 3 V 3.2 VCC = 2.3 V 3.1 3.0 2.9 2.8 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 VIN (V) 0.5 0.5 0.4 0.4 0.3 0.3 Differential Signal (V) Differential Signal (V) Figure 5. rON vs VIN (IOUT = 30 mA) 0.2 0.1 0.0 –0.1 –0.2 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.3 –0.4 –0.4 –0.5 –0.5 0.0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.0 0.2 –9 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.
PAGE 8
TS3USB221A-Q1 SCDS300 – JULY 2010 www.ti.com 0.5 0.4 Differential Signal (V) 0.3 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.4 –0.5 0.0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0 –9 Time (X 10 ) (s) Figure 8.
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TS3USB221A-Q1 www.ti.com SCDS300 – JULY 2010 PARAMETER MEASUREMENT INFORMATION VCC 1D or 2D VOUT1 or VOUT2 VIN RL CL VCOM tON 500 Ω 50 pF V+ tOFF 500 Ω 50 pF V+ D CL(2) 1D or 2D VCTRL TEST RL S CL(2) Logic Input(1) RL GND 1.8 V Logic Input (VI) 50% 50% 0 tON tOFF Switch Output (VOUT1 or VOUT2) (1) (2) 90% 90% VOH VOL All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns.
PAGE 10
TS3USB221A-Q1 SCDS300 – JULY 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VCC Network Analyzer Channel ON: 1D to D 50 W VOUT1 1D Channel OFF: 2D to D VIN Source Signal VCTRL = VCC or GND VOUT2 2D 50 W Network Analyzer Setup 50 W VCTRL S + Source Power = 0 dBm (632-mV P-P at 50-W load) GND DC Bias = 350 mV Figure 11.
PAGE 11
TS3USB221A-Q1 www.ti.com SCDS300 – JULY 2010 PARAMETER MEASUREMENT INFORMATION (continued) 800 mV 50% 50% Input 400 mV tPLH tPHL VOH 50% Output VOL tSK(P) = | tPHL – tPLH | PULSE SKEW tSK(P) 800 mV 50% 50% Input 400 mV tPLH1 tPHL1 VOH 50% 50% Output 1 VOL tSK(O) tSK(O) VOH 50% 50% Output 2 tPLH2 VOL tPHL2 tSK(O) = | tPLH1 – tPLH2 | or | tPHL1 – tPHL2 | OUTPUT SKEW tSK(P) Figure 14.
PAGE 12
TS3USB221A-Q1 SCDS300 – JULY 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VCC VOUT1 1D VIN D + VOUT2 2D VCTRL + S OFF-State Leakage Current Channel OFF VCTRL = VIH or VIL + GND Figure 16. OFF-State Leakage Current VCC VOUT1 1D Capacitance Meter VBIAS = VCC or GND VOUT2 2D VCTRL = VCC or GND VIN D VBIAS Capacitance is measured at 1D, 2D, D, and S inputs during ON and OFF conditions. VCTRL S GND Figure 17.
PAGE 13
PACKAGE OPTION ADDENDUM www.ti.com 9-Nov-2013 PACKAGING INFORMATION Orderable Device Status (1) TS3USB221AQRSERQ1 ACTIVE Package Type Package Pins Package Drawing Qty UQFN RSE 10 3000 Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Green (RoHS & no Sb/Br) CU NIPDAUAG Level-3-260C-168 HR Op Temp (°C) Device Marking (4/5) -40 to 125 OFW (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.
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PACKAGE OPTION ADDENDUM www.ti.
PAGE 15
PACKAGE MATERIALS INFORMATION www.ti.com 22-Feb-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS3USB221AQRSERQ1 Package Package Pins Type Drawing UQFN RSE 10 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 180.0 8.4 Pack Materials-Page 1 1.68 B0 (mm) K0 (mm) P1 (mm) 2.13 0.76 4.0 W Pin1 (mm) Quadrant 8.
PAGE 16
PACKAGE MATERIALS INFORMATION www.ti.com 22-Feb-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3USB221AQRSERQ1 UQFN RSE 10 3000 202.0 201.0 28.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.