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DRC PACKAGE

(TOP VIEW)

1 10

2 9

3 8

4 7

D+

D–

1D+

1D–

2D+

2D–

GND

5 6

RSE PACKAGE

(TOP VIEW)

D+

D–

1D+

1D–

2D+

2D–

GND

RSE PACKAGE

(BOTTOM VIEW)

D+

D–

1D+

1D–

2D+

2D–

GND

TS3USB221

www.ti.com

SCDS220G –NOVEMBER 2006–REVISED SEPTEMBER 2010

HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH

WITH SINGLE ENABLE

Check for Samples: TS3USB221

FEATURES

• V

Operation at 2.5 V and 3.3 V

• V

I/O

Accepts Signals up to 5.5 V

• 1.8-V Compatible Control-Pin Inputs

• Low-Power Mode When OE Is Disabled (1 mA)

• r

= 6 Ω Maximum

• Δr

= 0.2 Ω Typical

• C

io(on)

= 6 pF Maximum

• Low Power Consumption (30 mA Maximum)

• ESD > 2000-V Human-Body Model (HBM)

• High Bandwidth (1.1 GHz Typical)

APPLICATIONS

• Routes Signals for USB 1.0, 1.1, and 2.0

• Mobile Industry Processor Interface (MIPI)

Signal Routing

DESCRIPTION/

ORDERING INFORMATION

The TS3USB221 is a high-bandwidth switch specially

designed for the switching of high-speed USB 2.0

signals in handset and consumer applications, such

as cell phones, digital cameras, and notebooks with

hubs or controllers with limited USB I/Os. The wide

bandwidth (1.1 GHz) of this switch allows signals to

pass with minimum edge and phase distortion. The

device multiplexes differential outputs from a USB

host device to one of two corresponding outputs. The

switch is bidirectional and offers little or no

attenuation of the high-speed signals at the outputs. It

is designed for low bit-to-bit skew and high

channel-to-channel noise isolation, and is compatible

with various standards, such as high-speed USB 2.0

(480 Mbps).

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (21 pages)

PAGE 1
TS3USB221 www.ti.com SCDS220G – NOVEMBER 2006 – REVISED SEPTEMBER 2010 HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE Check for Samples: TS3USB221 FEATURES 1 • • • • • • • • • • VCC Operation at 2.5 V and 3.3 V VI/O Accepts Signals up to 5.5 V 1.8-V Compatible Control-Pin Inputs Low-Power Mode When OE Is Disabled (1 mA) rON = 6 Ω Maximum ΔrON = 0.
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TS3USB221 SCDS220G – NOVEMBER 2006 – REVISED SEPTEMBER 2010 www.ti.com ORDERING INFORMATION PACKAGE (1) TA –40°C to 85°C (1) (2) (3) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING (3) QFN – RSE Reel of 3000 TS3USB221RSER L5_ SON – DRC Reel of 3000 TS3USB221DRCR ZWG Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.
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TS3USB221 www.ti.com SCDS220G – NOVEMBER 2006 – REVISED SEPTEMBER 2010 ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VCC Supply voltage range MIN MAX –0.5 4.6 UNIT V –0.5 7 V –0.
PAGE 4
TS3USB221 SCDS220G – NOVEMBER 2006 – REVISED SEPTEMBER 2010 www.ti.com ELECTRICAL CHARACTERISTICS (1) over operating free-air temperature range (unless otherwise noted) PARAMETER VIK Control inputs IIN (3) IOZ TEST CONDITIONS TYP (2) MAX UNIT –1.8 V VIN = 0 V to 3.6 V ±1 mA VIN = VCC or GND, Switch OFF ±1 mA VI/O = 0 V to 3.6 V ±2 VI/O = 0 V to 2.7 V ±1 VCC = 3.6 V, 2.7 V, II = –18 mA VCC = 3.6 V, 2.7 V, 0 V, VCC = 3.6 V, 2.7 V, VO = 0 V to 3.
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TS3USB221 www.ti.com SCDS220G – NOVEMBER 2006 – REVISED SEPTEMBER 2010 DYNAMIC ELECTRICAL CHARACTERISTICS over operating range, TA = –40°C to 85°C, VCC = 2.5 V ± 10%, GND = 0 V PARAMETER TYP (1) TEST CONDITIONS UNIT XTALK Crosstalk RL = 50 Ω, f = 250 MHz –39 OIRR OFF isolation RL = 50 Ω, f = 250 MHz –40 dB BW Bandwidth (–3 dB) RL = 50 Ω 1.1 GHz (1) dB For Max or Min conditions, use the appropriate value specified under Electrical Characteristics for the applicable device type.
PAGE 6
TS3USB221 SCDS220G – NOVEMBER 2006 – REVISED SEPTEMBER 2010 www.ti.com APPLICATION INFORMATION 0 0 –1 VCC = 3.3 V VCC = 2.5 V –20 Attenuation (dB) Gain (dB) –2 –3 –4 –40 –60 –80 –5 VCC = 3.3 V VCC = 2.5 V –6 –100 –120 –7 100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 100.0E+3 10.0E+9 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9 Frequency (Hz) Frequency (Hz) Figure 1. Gain vs Frequency Figure 2. OFF Isolation vs Frequency 0 3.5 –20 3.4 ron (Ω) Attenuation (dB) 3.3 –40 –60 3.
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TS3USB221 SCDS220G – NOVEMBER 2006 – REVISED SEPTEMBER 2010 0.5 0.5 0.4 0.4 0.3 0.3 Differential Signal (V) Differential Signal (V) www.ti.com 0.2 0.1 0.0 –0.1 –0.2 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.3 –0.4 –0.4 –0.5 –0.5 0.0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.0 0.2 0.4 0.5 –9 0.8 1.0 1.2 1.4 1.6 1.8 2.0 –9 Time (X 10 ) (s) Time (X 10 ) (s) Figure 6. Eye Pattern: 480-Mbps USB Signal With No Switch (Through Path) Figure 7.
PAGE 8
TS3USB221 SCDS220G – NOVEMBER 2006 – REVISED SEPTEMBER 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION VCC 1D or 2D VOUT1 or VOUT2 VIN RL CL VCOM tON 500 Ω 50 pF V+ tOFF 500 Ω 50 pF V+ D CL(2) 1D or 2D VCTRL TEST RL S CL(2) Logic Input(1) RL GND 1.8 V Logic Input (VI) 50% 50% 0 tON tOFF Switch Output (VOUT1 or VOUT2) (1) (2) 90% 90% VOH VOL All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns.
PAGE 9
TS3USB221 www.ti.com SCDS220G – NOVEMBER 2006 – REVISED SEPTEMBER 2010 PARAMETER MEASUREMENT INFORMATION (continued) VCC Network Analyzer Channel ON: 1D to D 50 W VOUT1 1D Channel OFF: 2D to D VIN Source Signal VCTRL = VCC or GND VOUT2 2D 50 W Network Analyzer Setup 50 W VCTRL S + Source Power = 0 dBm (632-mV P-P at 50-W load) GND DC Bias = 350 mV Figure 11.
PAGE 10
TS3USB221 SCDS220G – NOVEMBER 2006 – REVISED SEPTEMBER 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) 800 mV 50% 50% Input 400 mV tPLH tPHL VOH 50% Output VOL tSK(P) = | tPHL – tPLH | PULSE SKEW tSK(P) 800 mV 50% 50% Input 400 mV tPLH1 tPHL1 VOH 50% 50% Output 1 VOL tSK(O) tSK(O) VOH 50% 50% Output 2 tPLH2 VOL tPHL2 tSK(O) = | tPLH1 – tPLH2 | or | tPHL1 – tPHL2 | OUTPUT SKEW tSK(P) Figure 14.
PAGE 11
TS3USB221 www.ti.com SCDS220G – NOVEMBER 2006 – REVISED SEPTEMBER 2010 PARAMETER MEASUREMENT INFORMATION (continued) VCC VOUT1 1D VIN D + VOUT2 2D VCTRL + S OFF-State Leakage Current Channel OFF VCTRL = VIH or VIL + GND Figure 16. OFF-State Leakage Current VCC VOUT1 1D Capacitance Meter VBIAS VBIAS = VCC or GND VOUT2 2D VCTRL = VCC or GND VIN D Capacitance is measured at 1D, 2D, D, and S inputs during ON and OFF conditions. VCTRL S GND Figure 17.
PAGE 12
PACKAGE OPTION ADDENDUM www.ti.
PAGE 13
PACKAGE OPTION ADDENDUM www.ti.com 9-Nov-2013 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.
PAGE 14
PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device TS3USB221DRCR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 3.3 1.0 8.0 12.0 Q2 SON DRC 10 3000 330.0 12.4 TS3USB221DRCR SON DRC 10 3000 330.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2 TS3USB221RSER UQFN RSE 10 3000 180.0 8.4 1.68 2.13 0.76 4.0 8.
PAGE 15
PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3USB221DRCR SON DRC 10 3000 370.0 355.0 55.0 TS3USB221DRCR SON DRC 10 3000 367.0 367.0 35.0 TS3USB221RSER UQFN RSE 10 3000 202.0 201.0 28.0 TS3USB221RSER UQFN RSE 10 3000 203.0 203.0 35.0 TS3USB221RSER UQFN RSE 10 3000 180.0 180.0 30.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.