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RSW PACKAGE

(TOP VIEW)

1 2

D1+

D2+

D1–

D2–

D–

GND

D+

RSW PACKAGE

(BOTTOM VIEW)

D1+

D1–

D+

1 2

310

D2+

D2–

GND

D–

TS3USB30E

www.ti.com

SCDS255E –DECEMBER 2008–REVISED AUGUST 2012

ESD PROTECTED, HIGH-SPEED USB 2.0 (480-Mbps)

1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE

Check for Samples: TS3USB30E

FEATURES

• V

Operation at 3 V to 4.3 V

• 1.8-V Compatible Control-Pin Inputs

• I

OFF

Supports Partial Power-Down-Mode

Operation

– D+/D– Pins Tolerate up to 5.25V

• r

= 10 Ω Max

• Δr

= 0.35 Ω Typ

• C

io(ON)

= 7.5 pF Typ

• Low Power Consumption (1 μA Max)

• –3 dB Bandwidth = 900 MHz Typ

• Latch-Up Performance Exceeds

100 mA Per JESD 78, Class II

(1)

• ESD Performance Tested Per JESD 22

– 8000-V Human-Body Model (A114-B,

Class II)

– 1000-V Charged-Device Model (C101)

• ESD Performance I/O Port to GND

(2)

– 15000-V Human-Body Model

• Packaged in 10-pin TQFN (1.4 mm × 1.8 mm)

APPLICATIONS

• Routes Signals for USB 1.0, 1.1, and 2.0

DGS PACKAGE

(TOP VIEW)

(1) Except OE and S inputs

(2) High-voltage HBM is performed in addition to the standard

HBM testing (A114-B, Class II) and applies to I/O ports tested

with respect to GND only.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (20 pages)

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TS3USB30E www.ti.com SCDS255E – DECEMBER 2008 – REVISED AUGUST 2012 ESD PROTECTED, HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE Check for Samples: TS3USB30E FEATURES 1 • • APPLICATIONS • Routes Signals for USB 1.0, 1.1, and 2.0 D1– D2– 7 6 5 D– VCC 9 4 GND S 10 3 D+ 1 2 D2+ 8 D1+ OE S 10 VCC 9 OE 8 D2+ RSW PACKAGE (BOTTOM VIEW) 1 2 7 6 D2– • RSW PACKAGE (TOP VIEW) D1+ • • • • • • VCC Operation at 3 V to 4.3 V 1.
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TS3USB30E SCDS255E – DECEMBER 2008 – REVISED AUGUST 2012 www.ti.com DESCRIPTION/ORDERING INFORMATION The TS3USB30E is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion.
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TS3USB30E www.ti.com SCDS255E – DECEMBER 2008 – REVISED AUGUST 2012 ABSOLUTE MAXIMUM RATINGS (1) (2) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT VCC Supply voltage range –0.5 7 V VIN Control input voltage range (3) –0.5 7 V –0.5 VCC + 0.3 D+, D– when VCC > 0 –0.5 VCC + 0.3 D+, D– when VCC = 0 –0.
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TS3USB30E SCDS255E – DECEMBER 2008 – REVISED AUGUST 2012 www.ti.com ELECTRICAL CHARACTERISTICS (1) over operating free-air temperature range (unless otherwise noted) PARAMETER VIK TEST CONDITIONS MIN TYP (2) MAX UNIT VCC = 3 V, II = –18 mA –1.2 V VCC = 4.3 V, 0 V, VIN = 0 to 4.3 V ±1 μA VCC = 4.3 V, VI = 0, VO = 0 to 3.6 V, Switch OFF ±1 μA VCC = 0 V, VI = 0, VO = 0 to 4.3 V, VIN = VCC or GND ±2 μA VCC = 4.3 V, II/O = 0, 1 μA Control inputs VCC = 4.3 V, VIN = 2.
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TS3USB30E www.ti.com SCDS255E – DECEMBER 2008 – REVISED AUGUST 2012 DYNAMIC ELECTRICAL CHARACTERISTICS over operating range, TA = –40°C to 85°C, VCC = 3.
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TS3USB30E SCDS255E – DECEMBER 2008 – REVISED AUGUST 2012 www.ti.com APPLICATION INFORMATION 0 0 –10 –2 –20 Attenuation (dB) Gain (dB) –4 –6 –8 –30 –40 –50 –60 –10 –70 –12 –80 –14 100.0E+3 –90 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9 100.0E+3 1.0E+6 10.0E+6 Frequency (Hz) 100.0E+6 1.0E+9 10.0E+9 Frequency (Hz) Figure 1. Gain vs Frequency Figure 2. OFF Isolation 0 Attenuation (dB) –20 –40 –60 –80 –100 –120 100.0E+3 1.0E+6 10.0E+6 100.0E+6 Frequency (Hz) 1.0E+9 10.
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TS3USB30E SCDS255E – DECEMBER 2008 – REVISED AUGUST 2012 0.5 0.5 0.4 0.4 0.3 0.3 Differential Signal (V) Differential Signal (V) www.ti.com 0.2 0.1 0.0 –0.1 –0.2 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.3 –0.4 –0.4 –0.5 –0.5 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 0.0 2.0 0.2 0.4 0.6 0.8 –9 1.0 1.2 1.4 1.6 1.8 2.0 –9 Time (x 10 ) (s) Time (x 10 ) (s) Figure 4. Eye Pattern: 480-Mbps USB Signal With No Switch (Through Path) Figure 5.
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TS3USB30E SCDS255E – DECEMBER 2008 – REVISED AUGUST 2012 www.ti.com VCC TS3USB30E 1D+ D+ USB2.0 Controller 1D– Set Top Box (STB) CPU or DSP Processor USB Connector D– 2D+ DVR or Mass Storage Controller 2D– Control S OE Figure 7. Application Diagram PARAMETER MEASUREMENT INFORMATION VCC 1D or 2D VOUT1 VIN TEST RL CL VIN tON 50 Ω 5 pF VCC tOFF 50 Ω 5 pF VCC D 1D or 2D VOUT2 CL(2) RL S VSEL(1) OE CL(2) GND (2) 50% 50% 0 tON VOE(1) (1) 1.
PAGE 9
TS3USB30E www.ti.com SCDS255E – DECEMBER 2008 – REVISED AUGUST 2012 PARAMETER MEASUREMENT INFORMATION (continued) VCC Network Analyzer Channel OFF: 1D to D 50 W VOUT1 1D VSEL = VCC VIN D Source Signal 50 W 2D Network Analyzer Setup Source Power = 0 dBm (632-mV P-P at 50-W load) VSEL S 50 W + GND DC Bias = 350 mV Figure 9.
PAGE 10
TS3USB30E SCDS255E – DECEMBER 2008 – REVISED AUGUST 2012 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) 400 mV Figure 12. Propagation Delay VOH VOL Pulse Skew tSK(P) VOH VOL VOH VOL Output Skew tSK(P) Figure 13.
PAGE 11
TS3USB30E www.ti.com SCDS255E – DECEMBER 2008 – REVISED AUGUST 2012 PARAMETER MEASUREMENT INFORMATION (continued) VCC VOUT1 1D D + VIN Channel ON VOUT2 2D r on + VSEL IIN S VIN * VOUT2 or VOUT1 W IIN VSEL = VIH or VIL + GND Figure 14. ON-State Resistance (ron) VCC VOUT1 1D VIN D + VOUT2 2D VSEL + S OFF-State Leakage Current Channel OFF VSEL = VIH or VIL + GND Figure 15.
PAGE 12
TS3USB30E SCDS255E – DECEMBER 2008 – REVISED AUGUST 2012 www.ti.com REVISION HISTORY Changes from Revision D (September 2010) to Revision E • 12 Page Updated ORDERING INFORMATION TABLE. ....................................................................................................................
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 20-May-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
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PACKAGE MATERIALS INFORMATION www.ti.com 19-Nov-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TS3USB30EDGSR VSSOP DGS 10 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 TS3USB30ERSWR UQFN RSW 10 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q1 TS3USB30ERSWR UQFN RSW 10 3000 179.0 8.4 1.7 2.1 0.7 4.0 8.
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PACKAGE MATERIALS INFORMATION www.ti.com 19-Nov-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3USB30EDGSR VSSOP DGS 10 2500 358.0 335.0 35.0 TS3USB30ERSWR UQFN RSW 10 3000 180.0 180.0 30.0 TS3USB30ERSWR UQFN RSW 10 3000 203.0 203.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.