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RSWPACKAGE

(TOP VIEW)

1 2

D1+

D2+

D1–

D2–

D–

GND

D+

RSWPACKAGE

(BOTTOMVIEW)

D1+

D1–

D+

1 2

310

D2+

D2–

GND

D–

TS3USB30

www.ti.com

SCDS237E –AUGUST 2007–REVISED SEPTEMBER 2010

HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH

WITH SINGLE ENABLE

Check for Samples: TS3USB30

FEATURES

• V

Operation at 3 V and 4.3 V

• 1.8-V Compatible Control-Pin Inputs

• I

OFF

Supports Partial Power-Down-Mode

Operation

• r

= 10 Ω Max

• Δr

<0.35 Ω Typ

• C

io(ON)

= 7 pF Typ

• Low Power Consumption (1 mA Max)

• ESD Performance Tested Per JESD 22

– 6000-V Human-Body Model (HBM)

(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

– 250-V Machine Model (A115-A)

• –3-dB Bandwidth = 955 MHz Typ

• Packaged in 10-pin TQFN (1.4 mm × 1.8 mm)

APPLICATIONS

• Routes Signals for USB 1.0, 1.1, and 2.0

• Mobile Industry Processor Interface (MIPI)

Signal Routing

DESCRIPTION/ORDERING INFORMATION

The TS3USB30 is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in

handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers

with limited USB I/Os. The wide bandwidth (750 MHz) of this switch allows signals to pass with minimum edge

and phase distortion. The device multiplexes differential outputs from a USB host device to one of two

corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at

the outputs. It is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible

with various standards, such as high-speed USB 2.0 (480 Mbps).

Table 1. ORDERING INFORMATION

PACKAGE

(1) (2)

ORDERABLE PART NUMBER TOP-SIDE MARKING

(3)

–40°C to 85°C TQFN – RSW Tape and reel TS3USB30RSWR L6_

(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(3) RSW: The actual top-side marking has one additional character that designates the assembly/test site.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (19 pages)

PAGE 1
TS3USB30 www.ti.com SCDS237E – AUGUST 2007 – REVISED SEPTEMBER 2010 HIGH-SPEED USB 2.0 (480-Mbps) 1:2 MULTIPLEXER/DEMULTIPLEXER SWITCH WITH SINGLE ENABLE Check for Samples: TS3USB30 FEATURES 1 APPLICATIONS • • Routes Signals for USB 1.0, 1.1, and 2.
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TS3USB30 SCDS237E – AUGUST 2007 – REVISED SEPTEMBER 2010 www.ti.
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TS3USB30 www.ti.com SCDS237E – AUGUST 2007 – REVISED SEPTEMBER 2010 PACKAGE THERMAL IMPEDANCE (1) qJA (1) Package thermal impedance RSW package TYP UNIT 175 °C/W The package thermal impedance is calculated in accordance with JESD 51-7.
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TS3USB30 SCDS237E – AUGUST 2007 – REVISED SEPTEMBER 2010 www.ti.com RECOMMENDED OPERATING CONDITIONS (1) VCC Supply voltage VIH High-level control input voltage VIL Low-level control input voltage VI/O Data input/output voltage TA Operating free-air temperature (1) MIN MAX 3 4.3 VCC = 3 V to 3.6 V 1.3 VCC = 4.3 V 1.7 UNIT V V VCC = 3 V to 3.6 V 0.5 VCC = 4.3 V 0.
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TS3USB30 www.ti.com SCDS237E – AUGUST 2007 – REVISED SEPTEMBER 2010 SWITCHING CHARACTERISTICS over operating range, TA = –40°C to 85°C, VCC = 3.
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TS3USB30 SCDS237E – AUGUST 2007 – REVISED SEPTEMBER 2010 www.ti.com APPLICATION INFORMATION 0 –1 –2 Gain (dB) –3 –4 –5 –6 –7 –8 100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9 1.0E+9 10.0E+9 Frequency (Hz) Figure 1. Gain vs Frequency 0 –10 Attenuation (dB) –20 –30 –40 –50 –60 –70 –80 –90 100.0E+3 1.0E+6 10.0E+6 100.0E+6 Frequency (Hz) Figure 2.
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TS3USB30 www.ti.com SCDS237E – AUGUST 2007 – REVISED SEPTEMBER 2010 0 –10 Attenuation (dB) –20 –30 –40 –50 –60 –70 –80 –90 –100 100.0E+3 1.0E+6 10.0E+6 100.0E+6 1.0E+9 10.0E+9 Frequency (Hz) Figure 3. Crosstalk VCC TS3USB30 1D+ USB2.0 Controller D+ 1D– Set Top Box (STB) CPU or DSP Processor USB Connector D– 2D+ DVR or Mass Storage Controller 2D– Control S OE Figure 4.
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TS3USB30 SCDS237E – AUGUST 2007 – REVISED SEPTEMBER 2010 www.ti.com 0.5 0.4 Differential Signal (V) 0.3 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.4 –0.5 0.0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0 –9 Time (X 10 ) (s) Figure 5. Eye Pattern: 480-Mbps USB Signal With No Switch (Through Path) 0.5 0.4 Differential Signal (V) 0.3 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.4 –0.5 0.0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0 –9 Time (X 10 ) (s) Figure 6.
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TS3USB30 www.ti.com SCDS237E – AUGUST 2007 – REVISED SEPTEMBER 2010 0.5 0.4 Differential Signal (V) 0.3 0.2 0.1 0.0 –0.1 –0.2 –0.3 –0.4 –0.5 0.0 0.2 0.4 0.5 0.8 1.0 1.2 1.4 1.6 1.8 2.0 –9 Time (X 10 ) (s) Figure 7.
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TS3USB30 SCDS237E – AUGUST 2007 – REVISED SEPTEMBER 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION VCC 1D or 2D VOUT1 VIN D 1D or 2D VOUT2 (B) CL RL TEST RL CL VIN tON 50 Ω 5 pF VCC tOFF 50 Ω 5 pF VCC S OE VSEL(A) 1.8 V Logic RL Input (VSEL or V OE) CL(B) GND 50% 50% 0 tON VOE(A) tOFF Switch Output (VOUT1 or V OUT2) 90% 90% VOH VOL A. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr < 5 ns, tf < 5 ns. B.
PAGE 11
TS3USB30 www.ti.com SCDS237E – AUGUST 2007 – REVISED SEPTEMBER 2010 PARAMETER MEASUREMENT INFORMATION (continued) VCC Network Analyzer Channel ON: 1D to D 50 W VOUT1 1D Channel OFF: 2D to D VIN Source Signal VSEL = VCC VOUT2 2D 50 W Network Analyzer Setup 50 W VSEL S + Source Power = 0 dBm (632-mV P-P at 50-W load) GND DC Bias = 350 mV Figure 10.
PAGE 12
TS3USB30 SCDS237E – AUGUST 2007 – REVISED SEPTEMBER 2010 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) VOH VOL Pulse Skew tSK(P) VOH VOL VOH VOL Output Skew tSK(P) Figure 13.
PAGE 13
TS3USB30 www.ti.com SCDS237E – AUGUST 2007 – REVISED SEPTEMBER 2010 PARAMETER MEASUREMENT INFORMATION (continued) VCC VOUT1 1D D + VIN Channel ON VOUT2 2D r on + VSEL IIN S VIN * VOUT2 or VOUT1 W IIN VSEL = VIH or VIL + GND Figure 14. ON-State Resistance (ron) VCC VOUT1 1D VIN D + VOUT2 2D VSEL + S OFF-State Leakage Current Channel OFF VSEL = VIH or VIL + GND Figure 15.
PAGE 14
PACKAGE OPTION ADDENDUM www.ti.com 20-May-2013 PACKAGING INFORMATION Orderable Device Status (1) TS3USB30RSWR ACTIVE Package Type Package Pins Package Drawing Qty UQFN RSW 10 3000 Eco Plan Lead/Ball Finish (2) Green (RoHS & no Sb/Br) MSL Peak Temp Op Temp (°C) Device Marking (3) CU NIPDAU Level-1-260C-UNLIM (4/5) -40 to 85 (L67 ~ L6O) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs.
PAGE 15
PACKAGE MATERIALS INFORMATION www.ti.com 6-Nov-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TS3USB30RSWR UQFN RSW 10 3000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q1 TS3USB30RSWR UQFN RSW 10 3000 179.0 8.4 1.7 2.1 0.7 4.0 8.
PAGE 16
PACKAGE MATERIALS INFORMATION www.ti.com 6-Nov-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS3USB30RSWR UQFN RSW 10 3000 180.0 180.0 30.0 TS3USB30RSWR UQFN RSW 10 3000 203.0 203.0 35.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.