Datasheet

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HSD–
HSD+
OE
D–
D+
N.C.
GND
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CC
RSEPACKAGE
(TOP VIEW)
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RSEPACKAGE
(BOTTOMVIEW)
HSD+
N.C.
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N.C. Nointernalconnection-
TS3USB31E
www.ti.com
SCDS256 OCTOBER 2009
HIGH-SPEED USB 2.0 (480-Mbps) 1-PORT SWITCH
WITH SINGLE ENABLE AND ESD PROTECTION
Check for Samples: TS3USB31E
1
FEATURES
V
CC
Operation 2.25 V to 4.3 V
1.8-V Compatible Control-Pin Inputs
I
OFF
Supports Partial Power-Down Mode
Operation
r
on
= 10 Maximum
Δr
on
<0.35 Typical
C
io(ON)
= 6 pF Typical
Low Power Consumption (1 μA Maximum)
ESD Performance Tested Per JESD 22
8000-V Human-Body Model
(A114-B, Class II)
1000-V Charged-Device Model (C101)
250-V Machine Model (A115-A)
ESD Performance COM Port to GND
15000-V Human-Body Model
(A114-B, Class II)
Wide –3-dB Bandwidth = 1100 MHz Typical
Packaged in 8-Pin TQFN (1.5 mm × 1.5 mm)
APPLICATIONS
Routes Signals for USB 1.0, 1.1, and 2.0
DESCRIPTION/ORDERING INFORMATION
The TS3USB31E is a high-bandwidth switch specially
designed for the switching of high-speed USB 2.0
signals in handset and consumer applications, such
as cell phones, digital cameras, and notebooks with
hubs or controllers with limited USB I/Os. The wide
bandwidth (1100 MHz) of this switch allows signals to
pass with minimum edge and phase distortion. The
switch is bidirectional and offers little or no
attenuation of the high-speed signals at the outputs. It
is designed for low bit-to-bit skew and high
channel-to-channel noise isolation, and is compatible
with various standards, such as high-speed USB 2.0
(480 Mbps).
Table 1. ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
–40°C to 85°C QFN – RSE Tape and reel TS3USB31ERSER LJ
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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