Datasheet

YZP PACKAGE
Laser Marking View
Bump View
B
C
D
3 2
1
A
B
C
D
1
2
3
A
1
2
3
4
5
10
9
8
7
6
NO2
COM2
NC2
IN2
V
+
NO1
COM1
NC1
IN1 GND
1
2
3
4
5
10
9
8
7
6
NO2
COM2
NC2
IN2
V
+
NO1
COM1
NC1
IN1 GND
Exposed
Center
Pad
TS5A22362, TS5A22364
www.ti.com
SCDS261E MARCH 2008REVISED MAY 2013
0.65- DUAL SPDT ANALOG SWITCHES WITH NEGATIVE SIGNALING CAPABILITY
Check for Samples: TS5A22362, TS5A22364
1
FEATURES
DRC PACKAGE
Specified Break-Before-Make Switching
(TOP VIEW)
Negative Signaling Capability: Maximum
Swing From –2.75 V to 2.75 V (V
+
= 2.75 V)
Internal Shunt Switch Prevents Audible Click-
and-Pop When Switching Between Two
Sources (TS5A22364)
Low ON-State Resistance (0.65 Typical)
Low Charge Injection
Excellent ON-State Resistance Matching
2.3-V to 5.5-V Power Supply (V
+
)
Latch-Up Performance Exceeds 100 mA Per
The exposed center pad, if used, must be
connected as a secondary GND or left
JESD 78, Class II
electrically open.
ESD Performance Tested Per JESD 22
2500-V Human-Body Model
DGS PACKAGE
(A114-B, Class II)
(TOP VIEW)
1500-V Charged-Device Model (C101)
200-V Machine Model (A115-A)
APPLICATIONS
Cell Phones
PDAs
Portable Instrumentation
Audio Routing
Medical Imaging
YZP PACKAGE TERMINAL ASSIGNMENTS
D IN1 GND IN2
C NC1 NC2
B COM1 COM2
A NO1 V
+
NO2
3 2 1
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2008–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

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