Datasheet

DCUPACKAGE
(TOP VIEW)
1
2
3
8
6
COM
EN
GND NO
V
+
7 NC
Logic
Control
4 5
INGND
2
YZP PACKAGE
(BOTTOMVIEW)
GND
GND
EN
COM
NC
NO
IN
V
+
1
A1
B1
C1
D1
3
4
8
7
5
6
Logic
Control
A2
B2
C2
D2
TS5A3154
www.ti.com
SCDS191C MARCH 2005 REVISED FEBRUARY 2012
0.9- SPDT ANALOG SWITCH
5-V/3.3-V SINGLE-CHANNEL 2:1 MULTIPLEXER/DEMULTIPLEXER
Check for Samples: TS5A3154
1
FEATURES
APPLICATIONS
2
Specified Make-Before-Break Switching
Cell Phones
Low ON-State Resistance (0.9 ) PDAs
Control Inputs Are 5.5-V Tolerant Portable Instrumentation
Low Charge Injection Audio and Video Signal Routing
Excellent ON-State Resistance Matching Low-Voltage Data-Acquisition Systems
Low Total Harmonic Distortion (THD) Communication Circuits
1.65-V to 5.5-V Single-Supply Operation Modems
Latch-Up Performance Exceeds 100 mA Per Hard Drives
JESD 78, Class II
Computer Peripherals
ESD Performance Tested Per JESD 22
Wireless Terminals and Peripherals
2000-V Human-Body Model
(A114-B, Class II)
1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
The TS5A3154 is a single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to
5.5 V. The device offers a low ON-state resistance and an excellent channel-to-channel ON-state resistance
matching. The device has excellent total harmonic distortion (THD) performance and consumes very low power.
These features make this device suitable for portable audio applications.
Table 1. ORDERING INFORMATION
T
A
PACKAGE
(1) (2)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(3)
NanoFree WCSP (DSBGA)
0.23-mm Large Bump YZP Reel of 3000 TS5A3154YZPR _ _ _JX_
40°C to 85°C
(Pb-free)
SSOP DCU Reel of 3000 TS5A3154DCUR JCF_
(1) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(3) DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 20052012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Summary of content (28 pages)