Datasheet

SOT-23 OR SC-70 PACKAGE
(TOP VIEW)
1
2
3
4
5
NC
COM
GND
IN
V
+
3 4
5
2
1
YEP OR YZP PACKAGE
(BOTTOM VIEW)
GND
COM
NC
IN
V
+
TS5A3167
www.ti.com
SCDS187A FEBRUARY 2005REVISED OCTOBER 2012
0.9-Ω SPST ANALOG SWITCH
Check for Samples: TS5A3167
1
FEATURES
APPLICATIONS
Isolation in Powered-Off Mode, V
+
= 0 Cell Phones
Low ON-State Resistance (0.9 Ω) PDAs
Control Inputs Are 5.5-V Tolerant Portable Instrumentation
Low Charge Injection Audio and Video Signal Routing
Low Total Harmonic Distortion (THD) Low-Voltage Data-Acquisition Systems
1.65-V to 5.5-V Single-Supply Operation Communication Circuits
Latch-Up Performance Exceeds 100 mA Per Modems
JESD 78, Class II
Hard Drives
ESD Performance Tested Per JESD 22
Computer Peripherals
2000-V Human-Body Model
Wireless Terminals and Peripherals
(A114-B, Class II)
Microphone Switching – Notebook Docking
1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
The TS5A3167 is a single-pole single-throw (SPST) analog switch that is designed to operate from
1.65 V to 5.5 V. The device offers a low ON-state resistance. The device has excellent total harmonic distortion
(THD) performance and consumes very low power. These features make this device suitable for portable audio
applications.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoStar™ – WCSP (DSBGA)
Tape and reel TS5A3167YEPR PACKAGE PREVIEW
0.23-mm Large Bump – YEP
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb- Tape and reel TS5A3167YZPR JG_
free)
–40°C to 85°C
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb- Tape and reel TS5A3167YZPRB
(3)
JG_
free)
SOT (SOT-23) DBV Tape and reel TS5A3167DBVR JAT_
SOT (SC-70) – DCK Tape and reel TS5A3167DCKR JG_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
(3) **YZPRB is for backside coating
YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2005–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.

Summary of content (27 pages)