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GND

8 9

TS5V330C

www.ti.com

SCDS276B –APRIL 2009–REVISED DECEMBER 2009

QUAD SPDT WIDE BANDWIDTH VIDEO SWITCH WITH LOW ON-STATE RESISTANCE

Check for Samples: TS5V330C

FEATURES

D, DB, DBQ, OR PW PACKAGE

• Low Differential Gain and Phase

(TOP VIEW)

(Typical D

= 0.24%, Typical D

= 0.039°)

• Wide Bandwidth (Typical BW > 288 MHz)

• Low Cross-Talk (Typical X

TALK

= –87 dB)

• Low Power Consumption

(Maximum I

= 3 μA)

• Bidirectional Data Flow, With Near-Zero

Propagation Delay

• Low ON-State Resistance (Typical r

= 3 Ω)

• V

Operating Range From 4.5 V to 5.5 V

• I

off

Supports Partial-Power-Down Mode

RGY PACKAGE

Operation

(TOP VIEW)

• Data and Control Inputs Provide Undershoot

Clamp Diode

• Control Inputs Can be Driven by TTL or

5-V/3.3-V CMOS Outputs

• Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

• ESD Performance Tested Per JESD 22

– 2000-V Human-Body Model

(A114-B, Class II)

– 1000-V Charged-Device Model (C101)

• Suitable for Both RGB and Composite Video

Switching

DESCRIPTION/ORDERING INFORMATION

The TS5V330C is a 4-bit 1-of-2 multiplexer/demultiplexer video switch with a single switch-enable (EN) input.

The select (IN) input controls the data path of the multiplexer/demultiplexer. When EN is low, the switch is

enabled and the D port is connected to the S port. When EN is high, the switch is disabled and a high impedance

state exists between the D and S ports.

Low differential gain and phase makes this switch ideal for video applications. The device has a wide bandwidth

and low cross talk which makes it suitable for high frequency video applications. The device can be used for

RGB and composite video switching applications.

This device is fully specified for partial-power-down applications using I

off

. The I

off

feature ensures that damaging

current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, EN should be tied to V

through a pullup

resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

Summary of content (22 pages)

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TS5V330C www.ti.
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TS5V330C SCDS276B – APRIL 2009 – REVISED DECEMBER 2009 www.ti.
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TS5V330C www.ti.com SCDS276B – APRIL 2009 – REVISED DECEMBER 2009 PARAMETER DEFINITIONS PARAMETER DESCRIPTION rON Resistance between the D and S ports with the switch in the ON-state IOZ Output leakage current measured at the D and S ports with the switch in the OFF-state IOS Short circuit current measured at the I/O pins.
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TS5V330C SCDS276B – APRIL 2009 – REVISED DECEMBER 2009 www.ti.com LOGIC DIAGRAM (POSITIVE LOGIC) 4 2 DA S1A 3 S2A 7 5 DB S1B 6 S2B 9 11 DC S1C 10 S2C DD 12 14 13 S1D S2D 1 IN 15 EN ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT –0.5 7 V –0.5 7 V –0.
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TS5V330C www.ti.com SCDS276B – APRIL 2009 – REVISED DECEMBER 2009 PACKAGE THERMAL IMPEDANCE over operating free-air temperature range (unless otherwise noted) UNIT θJA Package thermal impedance D package (1) 73 DB package (1) 82 DBQ package (1) 90 PW package (1) 108 RGY package (2) (1) (2) °C/W 39 The package thermal impedance is calculated in accordance with JESD 51-7. The package thermal impedance is calculated in accordance with JESD 51-5.
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TS5V330C SCDS276B – APRIL 2009 – REVISED DECEMBER 2009 www.ti.com ELECTRICAL CHARACTERISTICS (1) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER MIN TYP (2) TEST CONDITIONS VIK EN, IN VH EN, IN IIH EN, IN VCC = 5.5 V, EN, IN UNIT V 400 mV VIN and VEN = VCC ±1 μA VCC = 5.5 V, VIN and VEN = GND ±1 μA VCC = 5.5 V, VO = 0 to 5.5 V, VI = 0, Switch OFF ±10 μA IOS VCC = 5.5 V, VO = 0 to 5.
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TS5V330C www.ti.com SCDS276B – APRIL 2009 – REVISED DECEMBER 2009 TYPICAL PERFORMANCE 0 0 -1 0.00 -0.405 -0.410 -0.05 -10 -0.415 -0.10 -2 -4 -40 -5 Differential Gain (%) -30 Phase (°) Gain (dB) -3 -0.15 -0.425 -0.430 -0.20 -0.435 -0.25 Differential Phase (°) -0.420 -20 -0.440 -0.30 -50 -6 -0.445 Phase at = –3 dB, –35° Gain at -3 dB , 288 MHz -7 -60 -8 1 -0.35 10 -0.40 0.0 -70 1000 100 Differential phase at 0.714 V, 0.427° Differential gain at 0.714 V, 0.24% 0.1 0.2 0.
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TS5V330C SCDS276B – APRIL 2009 – REVISED DECEMBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION VCC Input Generator VIN IN 50 Ω 50 Ω VG1 S1 DUT TEST CIRCUIT VS1 S2 D VO EN VS2 CL (see Note A) RL TEST VCC RL CL VS1 V S2 tON 5 V ± 0.5 V 5 V ± 0.5 V 75 Ω 75 Ω 20 pF 20 pF GND 3V 3V GND tOFF 5 V ± 0.5 V 5 V ± 0.
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TS5V330C www.ti.com SCDS276B – APRIL 2009 – REVISED DECEMBER 2009 PARAMETER MEASUREMENT INFORMATION (continued) Ω For additional information, refer to the TI application report, Measuring Differential Gain and Phase, literature number SLOA040. Figure 6. Test Circuit for Differential Gain/Phase Measurement The differential gain and phase is measured at the output of the ON channel. For example, when VIN = 0, VEN = 0, and DA is the input, the output is measured at S1A.
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TS5V330C SCDS276B – APRIL 2009 – REVISED DECEMBER 2009 www.ti.com PARAMETER MEASUREMENT INFORMATION (continued) Ω Figure 7. Test Circuit for Frequency Response, Crosstalk, and OFF-Isolation The frequency response is measured at the output of the ON channel. For example, when VIN = 0, VEN = 0, and DA is the input, the output is measured at S1A. All unused analog I/O ports are held at VCC or GND. The crosstalk is measured at the output of the non-adjacent ON channel.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.com 20-May-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
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PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TS5V330CDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 TS5V330CPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.
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PACKAGE MATERIALS INFORMATION www.ti.com 26-Jan-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TS5V330CDR SOIC D 16 2500 333.2 345.9 28.6 TS5V330CPWR TSSOP PW 16 2000 367.0 367.0 35.
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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.