Datasheet

Pre-Processing
PINTDAV
I C
2
Serial
Interface
and
Control
VDD/REF
X+
X-
Y+
Y-
AUX
TEMP
Mux
PENIRQ
DAV
SAR
ADC
Internal
Clock
Touch
Screen
Drivers
Interface
RESET
AD0
SCL
SDA
TSC2014
www.ti.com SBAS522 –SEPTEMBER 2010
1.2V to 3.6V, 12-Bit, Nanopower, 4-Wire
TOUCH SCREEN CONTROLLER with I
2
C™ Interface
Check for Samples: TSC2014
1
FEATURES
APPLICATIONS
• Cellular Phones
23
• 4-Wire Touch Screen Interface
• Portable Instruments
• Ratiometric Conversion
• MP3 Players, Pagers
• Single 1.2V to 3.6V Supply
• Multiscreen Touch Control
• Preprocessing to Reduce Bus Activity
• High-Speed I
2
C-Compatible Interface
DESCRIPTION
• Internal Detection of Screen Touch
The TSC2014 is a very low-power touch screen
• Register-Based Programmable:
controller designed to work with power-sensitive,
– 10-Bit or 12-Bit Resolution
handheld applications that are based on advanced
low-voltage processors. It works with a supply voltage
– Sampling Rates
as low as 1.2V, which can be supplied by a
– System Timing
single-cell battery. It contains a complete,
• On-Chip Temperature Measurement
ultralow-power, 12-bit, analog-to-digital (A/D) resistive
touch screen converter, including drivers and the
• Touch Pressure Measurement
control logic to measure touch pressure.
• Auto Power-Down Control
In addition to these standard features, the TSC2014
• Low Power:
offers preprocessing of the touch screen
– 430mW at 1.8V, 50SSPS
measurements to reduce bus loading, thus reducing
– 320mW at 1.6V, 50SSPS
the consumption of host processor resources that can
then be redirected to more critical functions.
– 190mW at 1.2V, 50SSPS
– 58mW at 1.6V, 8.2kSPS Eq. Rate
The TSC2014 supports an I
2
C serial bus and data
transmission protocol in all three defined modes:
– 37mW at 1.2V, 8.2kSPS Eq. Rate
standard, fast, and high-speed. It offers
• Enhanced ESD Protection:
programmable resolution of 10 or 12 bits to
– ±8kV HBM
accommodate different screen sizes and performance
needs.
– ±1kV CDM
– ±25kV Air Gap Discharge
The TSC2014 is available in a miniature, 12-lead,
3 x 4 array, (1.555 ±0.055)mm x (2.055 ±0.055)mm
– ±11kV Contact Discharge
wafer chip-scale package (WCSP) package. The
• 1.5 x 2.0 WCSP-12 Package
device is characterized for the –40°C to +85°C
U.S. Patent No. 6,246,394; other patents pending.
industrial temperature range.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2I
2
C is a trademark of NXP Semiconductors.
3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.